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JRA3 I nstitute of P hysics ASCR Prague

JRA3 I nstitute of P hysics ASCR Prague. ECAL, V FCAL (V. Vrba) HCAL (J. Cvach) Exchange in NA2 (travels 8 .5 k€ ). Tasks in EUDET & budget w/o overheads . Si sensor development for ECAL, VFCAL Monitoring system for HCAL Consumables - 81.7 k€

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JRA3 I nstitute of P hysics ASCR Prague

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  1. JRA3Institute of Physics ASCRPrague ECAL, VFCAL (V. Vrba) HCAL (J. Cvach) Exchange in NA2 (travels 8.5 k€) J. Cvach, annual JRA3

  2. Tasks in EUDET & budget w/o overheads • Si sensor development for ECAL, VFCAL • Monitoring system for HCAL • Consumables - 81.7 k€ • Si sensor development + production (34.6 k€) • VME test stand (25742 €), calibration electronics (16.5 k€) • computing (4.9 k€) • Personnel - 13 k€ for PhD students, young postdocs • Travels 4 k€ • Contribution from the Institute • Permanent staff – 67 ppm • Travels (6.7 k€) J. Cvach, annual JRA3

  3. DET4 DET5 DET3 DET6 DET1 DET2 DET7 DET9 DET8 Si Sensors for ECAL (V. Vrba) Sensor ECAL prototype production: • 2006: in four production runs of Si pad sensors at ON Semiconductor we obtained 72 good fully tested wafers which have been integrated into ECAL prototype • January-July 2006: wafers delivered to Ecole Polytechnique 7 ECAL layers equipped with ONSemiconductorwafers • end of 2006: additional fabrication run at ON Semiconductor is planned to produce about 60 wafers for the full instrumentation for 2007 test beam. Václav Vrba, SI ECAL Sensor Status 2006

  4. I-V curves on pad arrays Václav Vrba, ECAL status

  5. 2 weeks Reverse current long term stability

  6. Sensor testing @ Institute of Physics AS CR • Test laboratory for measurement of Si sensors Senzors from ON Semiconductor, Czech Republic • EUDET tasks • Design studies for finer granularity (5x5 mm2) of Si sensors are under way • Possibility to use 6” wafers is also investigated V. Vrba, ECAL status

  7. HCAL - Calibration + Monitoring Board system (I. Polák) CMB provides • calibrated UV flashes to the scintillator tiles • optical feedback via PIN photodiode • sensing of temperature at scintillator planes and on CMB • connection via CANbus to the detector Slow Control • monitoring of temperature, voltages, … • setting enable, amplitude, pulse width of each LED J. Cvach, annual JRA3

  8. Calibration & monitoring board – to deliver LED light dynamic range 0.5 – 100 MIP Functions LED control Amplitude (via DAQ, CANbus, standalone) Pulse width: 5 ns  Enable PIN diode readout Temp monitoring Measurement of nonlinearity LED intensity varied by DAQ Intensity measured by PIN Absolute calib from linear part 12 PIN ampli 3 pulse generators control 1V 10 ns Calibration and monitoring board II

  9. Calibrating 18 SiPM with one LED J. Cvach, annual JRA3 Gain calibration for a matrix of 18 SiPM connected to the same LED

  10. CMB boards during CERN tests HCAL plane J. Cvach, annual JRA3

  11. VME stand – durable equipment financed from the EUDET project • Replacement of old CAMAC and NIM modules • Measurements of signals from photodetectors (PM, APD, …) • 9 pieces of APDs, Hamamatsu S 8664-s • 12 bit QDC, 16 chan., V792N • Controller V2718 connected by optical cable to PC • Reading, control with Labview • 4-channel power supply N472 • GPIB, serial bus • Scope TDS 5104 J. Cvach, annual JRA3

  12. Initialisation QDC reading Input buffer decoding Stand is operational – a EUDET milestone • Labview chart of signal processing LED  4 fibres read by APD +QDC • Ivo pulser + V993 dual timer – 1 kHz • What we gained? • Larger dynamic range 10bit12bit QDC • Sophisticated system (new, VME) • Short term usage: long term tests of CMB Jan Smolík Linearity dependence of 4 channels (APDs) to the increase (Vcalib) of the LED light J. Zálešák J. Cvach, annual JRA3

  13. APD APD C M B Future stand use • Long term tests and better understanding of CMB • Use a CMB board with (8 LED & PIN diodes) + 8 APDs  16 QDC chan. Calibration & Monitoring Board J. Cvach, annual JRA3

  14. Our immediate tasks in EUDET • Production of Si wafers for ECAL module successfully integrated into the prototype and operated in the test beam • Design studies for finer granularity (5x5 mm2) of Si sensors are under way; • Possibility of the use of 6” wafers is investigated; • Students and young physicist (Petr Mikes, Michal Marcisovsky, Pavel Ruzicka, Miroslav Havranek) are involved in the project activities participating in the laboratory sensor evaluation, test beam runs at DESY and CERN, data analysis, simulation etc. They also participate in regular collaboration meetings. • HCAL – calibration electronics • 2006: 40 (double) boards produced, 23 installed in the prototype, one half financed from EUDET • Investigations of functionality and long term stability of CMB • Participation in tests and data analysis J. Cvach, annual JRA3

  15. Resources EUDET • Main contribution from EUDET - consumables • Upper table – our JRA3 spending profile by tasks • Lower table – spendingaccording to categories J. Cvach, annual JRA3

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