Hybrid Memory Cube (HMC) And High-Bandwidth Memory (HBM) Market Projections

1. Hybrid Memory Cube Hybrid Memory Cube ( (HMC Upto 2028 With Prominent Key Players. Upto 2028 With Prominent Key Players. HMC) And ) And High High- -Bandwidth Bandwidth Memory Memory ( (HBM HBM) ) Market Market Projections Projections The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology by connecting the multiple memory arrays to the top of one another. It uses standard DRAM cells for memory implementation. The High-bandwidth Memory (HBM) is also the RAM interface but for 3D stacked SDRAM. It is used in combination with network devices and graphic accelerators. Both memory bus is capable of providing higher bandwidth with lower power consumption. It is widely applicable in graphics designing, in the field of networking, and others. Major factors driving the growth of the HMC and HBM market include the growing need for high-bandwidth, low power consuming, and highly scalable memories, increasing adoption of artificial intelligence, and rising trend of miniaturization of electronic devices. Key Market Players Key Market Players Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), Advanced Micro Devices (AMD) (US), Xilinx (US), Fujitsu (Japan), NVIDIA (US), IBM (US), Open-Silicon, Inc. (US) Request Sample Report Request Sample Report: : https://www.researchinformatic.com/sample https://www.researchinformatic.com/sample- -request/207 request/207 By product type, the market for APU to grow at the highest CAGR during the forecast By product type, the market for APU to grow at the highest CAGR during the forecast period period. The market for APUs is expected to grow at the highest rate during the forecast period. HBM-based APUs are a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications. By Application, HMC and HBM market for graphics applications to grow at the highest By Application, HMC and HBM market for graphics applications to grow at the highest CAGR during the forecast period CAGR during the forecast period The HMC and HBM market for graphics applications is expected to grow at the highest CAGR during the forecast period. A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been

2. introduced in the market that is increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process vast amounts of pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming. Inquiry Before Buying Report Inquiry Before Buying Report: : https://www.researchinformatic.com/inquiry/207 https://www.researchinformatic.com/inquiry/207 Market Dynamics Market Dynamics Driver: Driver: Growing need for high Growing need for high- -bandwidth, low power consuming, and highly scalable bandwidth, low power consuming, and highly scalable memories memories The development of various 3D-stacked memories is mainly driven by the rising need for memories offering high bandwidth, low power consumption, and high scalability. With the emergence of Big Data, the Internet of Things (IoT), and other data-intensive applications, there is a growing demand for technologies that can efficiently process and store more information. Also, there is a strong need for memories with high efficiency and performance in the network system for data packet buffering, data packet processing, and storage applications beyond 100 Gbps. HMC and HBM, which provide a bandwidth of more than 100 Gbps, can be a feasible replacement for DRAM as they achieve competitive speeds with much lower power consumption. Also, the market is witnessing continuous advancements in these technologies. For instance, HBM 2 provides 256 Gbps of bandwidth, significantly improving over HBM 1 (128 Gbps of bandwidth). Restraint: Restraint: Thermal issues Thermal issues caused by high levels of integration caused by high levels of integration HMC and HBM are a stack of DRAM chips connected internally to TSVs and externally to one or more chips using micro bumps and TSV. Even though these technologies offer several advantages, thermal issues caused by the high level of integration and their impact on the overall module present a major challenge to manufacturers. These technologies offer highly dense multi-level integration per unit footprint, which creates challenges for thermal management. Listed below are some of the major complications associated with these technologies: •The high level of integration leads to high on-chip temperatures. •As the memory lies between the heat sink and the logic die, the heat generated from the logic die raises the temperature of the memory. •Although the compact package offers a shorter route for a signal to travel, the heat generated in the module slows down the movement of the signal once it hits the thermal limit (to protect the circuitry) Ask For Customization Ask For Customization: : https://www.researchinformatic.com/request https://www.researchinformatic.com/request- -customiz customization ation- -207 207 TOC:

3. Chapter 1 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Overview 1.1 Product Overview and Scope of Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) 1.2 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation By Type 1.2.1 APU 1.3 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation by End Use 1.3.1 HMC 1.3.2 HBM TOC Continued… Quick Buy: Quick Buy: https://www.researchinformatic.com/checkout/207/single_user_license https://www.researchinformatic.com/checkout/207/single_user_license About Us: Research Informatic is a bulging market research and consultancy company based in Nevada, United States, with a report distribution center in India. We are committed to assisting our clients in making critical business decisions by fulfilling their niche market research needs. Our clients are spread across more than 130 countries and in all business domains. Our service offerings include syndicated research, tailored research, consumer surveys, and consulting. We concentrate on making investment decisions based on a variety of criteria such as growth size, benefits strategies, technical advances, and changing consumer inclinations, to name a few. Our syndicated and custom research reports assist our customers in growing their businesses across a broad range of industries. In the fields of healthcare, chemicals and materials, ICT, Automation, Semiconductors & Electronics, Consumer goods, Energy, Food & Beverages, and Packaging, we include research studies in the form of syndicate reports, custom reports, market surveys, and consultancy projects. Contact Us: George Miller 1887 Whitney Mesa Dr. Henderson, NV 89014 +1 775 237 4157 sales@researchinformatic.com https://researchinformatic.com Follow us on LinkedIn: https://www.linkedin.com/company/research-informatic/mycompany/