High Performance Integrated Circuit Design by Emre Salman

Jun 19, 2024

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High Performance Integrated Circuit Design by Emre Salman

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Integrated Circuit Technology

Integrated Circuit Technology. EE40 6 August 2008. Integrated Circuit Fabrication. Goal: Mass fabrication ( i.e. simultaneous fabrication) of many “chips”, each a circuit (e.g. a microprocessor or memory chip) containing millions or billions of transistors. Methods for Top Down processing:

1.05k views • 49 slides

INTEGRATED CIRCUIT

INTEGRATED CIRCUIT. IC adalah suatu media yang berisi berbagai macam komponen elektronika yang terintegrasi dan terhubung satu dengan lainnya sedemikian rupa untuk melaksanakan suatu fungsi tertentu. Pada awalnya jumlah komponen yang dapat dimasukkan ke dalam sebuah IC sangat terbatas.

380 views • 9 slides

High Yield Integrated Circuit Design using the MOSIS Service

High Yield Integrated Circuit Design using the MOSIS Service. Michael S. McCorquodale Robert M. Senger Eric D. Marsman. Solid State Electronics Laboratory NSF ERC for Wireless Integrated Microsystems (WIMS) Department of Electrical Engineering and Computer Science University of Michigan

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High Performance Tray Design

High Performance Tray Design. Dr. Leon Fan. Kenning Engineering, LLC. Dr. Leon Fan. Graduate Chinese Academy of Sciences Post Doctoral Work on Gas/Liquid Two Phase Flow, University of Illinois FRI Research Engineer Glitch Inc. Manager, Research Department

649 views • 34 slides

Analog Integrated Circuit Design (Analog CMOS Circuit Design)

Analog Integrated Circuit Design (Analog CMOS Circuit Design). Ali Heidary, Electrical Engineering, Guilan University. The mos parameter. Some important parameter are:. Exercise 1. For the current mirror of figure below calculate: 1- R o . 2- V o-min 3- the condition for

1.51k views • 8 slides

Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. PN Junctions. Reading: Chapter 5. PN Junctions. Donors. N-type. P-type. – +. I. V. I. N. P. V. Reverse bias. Forward bias. diode. symbol. A PN junction is present in every semiconductor device.

511 views • 25 slides

Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. Fabrication Technology. Silicon Device Fabrication Technology. Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year.

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Integrated Circuit - IC

Integrated Circuit - IC.

644 views • 10 slides

Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. MOS Capacitors Reading: Chapter 16. MOS Capacitors. MOS: M etal- O xide- S emiconductor. MOS transistor. MOS capacitor. Ideal MOS Capacitor. Oxide has zero charge, and no current can pass through it.

555 views • 20 slides

Digital Integrated Circuit Design

Digital Integrated Circuit Design. Andrea Bonfanti DEIB Via Golgi 40, Milano. Manufacturing Process. CMOS Process. n-well CMOS Process. Twin-well CMOS Process. Twin-well Trench-Isolated CMOS Process. Triple-well CMOS Process. Circuit Under Design. Its Layout View. nwell. metal1.

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Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. Semiconductor Fundamentals. Evolution of Devices. Yesterday’s Transistor (1947). Today’s Transistor (2006). Why “Semiconductors”?. Conductors – e.g Metals Insulators – e.g. Sand (SiO 2 ) Semiconductors

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Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. MOSFETs Reading: Chapters 17 & 18. The First Transistor. 1956 Physics Nobel Prize. Invention of the Field-Effect Transistor. In 1935, a British patent was issued to Oskar Heil. A working MOSFET was not demonstrated until 1955.

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by Emre Tapcı

“The Architecture of Massively Parallel Processor CP-PACS” Taisuke Boku, Hiroshi Nakamura, et al. University of Tsukuba, Japan. by Emre Tapcı. Outline. Introduction Specification of CP-PACS Pseudo Vector Processor PVP-SW Interconnection Network of CP-PACS Hyper-crossbar Network

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High-Speed Digital Circuit Design

High-Speed Digital Circuit Design. Chris Allen (callen@eecs.ku.edu) Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm. Outline. Syllabus Instructor information, course description, prerequisites Textbook, reference books, grading, course outline Preliminary schedule

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Digital Integrated Circuit Design

Digital Integrated Circuit Design. Andrea Bonfanti DEIB Via Golgi 40 Milano. The Inverter. V. DD. V. V. in. out. C. L. The CMOS Inverter: A First Glance. V. DD. CMOS Inverter. N Well. PMOS. 2 l. Contacts. Out. In. Metal 1. Polysilicon. NMOS. GND. Two Inverters.

1.15k views • 78 slides

Integrated Circuit Devices

Integrated Circuit Devices. Professor Ali Javey Summer 2009. MS Junctions Reading: Chapter14. Metal-Semiconductor Contacts. Two kinds of metal-semiconductor contacts : metal on lightly doped silicon – rectifying Schottky diodes metal on heavily doped silicon –

584 views • 26 slides

IC (integrated Circuit)

IC (integrated Circuit). Rangkaian Digital. Apa itu IC ?.

1.85k views • 14 slides

Integrated Circuit Devices

372 views • 33 slides

Integrated Circuit Devices

624 views • 58 slides

Integrated Circuit Devices

287 views • 26 slides

Analog Integrated Circuit Design (Analog CMOS Circuit Design)

860 views • 8 slides

Unit VII SEMICONDUCTOR INTEGRATED CIRCUIT DESIGN

Unit VII SEMICONDUCTOR INTEGRATED CIRCUIT DESIGN. Programmable logic devices (PLD). Programmable Logic Array (PLA) Programmable Array Logic(PAL) FPGAs CPLDs Standard cells Design Approach Parameters influencing low power design. PLD.

739 views • 56 slides

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