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Printed Circuit Board Design

Printed Circuit Board Design. Design Team 6 Alex Volinski Derek Brower Phil Jaworski Jung-Chung Lu Matt Affeldt. Introduction. Software Flow Routing / Board Layout Components/Assembly Electrical Considerations. Software Flow-Schematic. Software Packages Schematic Advantages

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Printed Circuit Board Design

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  1. Printed Circuit Board Design Design Team 6 Alex Volinski Derek Brower Phil Jaworski Jung-Chung Lu Matt Affeldt

  2. Introduction • Software Flow • Routing / Board Layout • Components/Assembly • Electrical Considerations

  3. Software Flow-Schematic • Software Packages • Schematic Advantages • Schematic creation • Libraries • ERC and simulation • Schematic to Layout

  4. Software Flow-Layout • Layout • Libraries • Layers and Routing • Labels • DRC • Fabrication

  5. Routing/Board layout • Important Terminology • Layers • Metal • Silkscreen • Solder mask • Traces • Spaces • Trace/Space

  6. Routing/Board layout • Important Terminology • Pads • Surface Mounts • Vias • Drilled Metal Plated Holes

  7. Floor Plan • Layout by importance of Position • Align components in a common-sense approach JTAG Memory Sensor IO Sensor IO Regulators Micro-controller USB/ UART User I/O

  8. Floor Plan • Routing in PCB Artist • Place components inside green PCB border • Yellow lines are connections that need to be made

  9. Floor Plan • Layout Example of 2-Layer Board • Bottom Level Grounded

  10. Floor Plan • Begin Making Traces

  11. Floor Plan • Tracing Problem

  12. Floor Plan • Grounding Techniques • Series • Common Impedance • Parallel • Low Potentials • High Impedance • Multipoint • Contains Currents • Reduces Inductance

  13. Floor Plan • Power Distribution • Single-Point • Single Reference • Multipoint • Impedance Coupled • Star Distribution • Central Reference • Equal Lengths

  14. Component Types • Through-hole • DIP • Surface mount • SOIC • BGA • QFN

  15. Assembly Techniques • Surface Mount • Stay above 0805 • Through Hole • Much easier and less performance

  16. Assembly Techniques • Solder Reflow • Allows precise soldering of Surface Mounts (below 0805)

  17. Return Path • Decreasing impedance vs. protecting a section

  18. Ground Plane Traces

  19. Stray Capacitance • Multi-Layer board is capacitor

  20. Avoiding Antennas • Avoiding Radiating EMI • At ‘low’ frequencies (<100 MHz) no components will be antennas • Be aware of attached cables • Layout board to reduce coupling

  21. Conclusion • Software Flow • Advantage of making schematic • Layers, Libraries, Fabrication • Routing / Board Layout • Layers, Traces, Pads vs. Vias • Importance of position • Grounding Techniques, Power Distribution

  22. Conclusion • Components/Assembly • Different types of components • Through Hole / Surface Mount • Weighing options for better performance • Electrical considerations • Stray Capacitance • Ground Plane Traces • Antennas to avoid radiating EMI

  23. Questions

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