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Giuliana Rizzo INFN and University, Pisa on behalf of SuperB group

Vertex Detector for the factory. Giuliana Rizzo INFN and University, Pisa on behalf of SuperB group. Vertex 2007 16th International Workshop on Vertex detectors September 23-28, 2007, Lake Placid, NY, USA. Outline. The SuperB Project: Motivations, Accelerator & Status

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Giuliana Rizzo INFN and University, Pisa on behalf of SuperB group

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  1. Vertex Detector for the factory Giuliana Rizzo INFN and University, Pisa on behalf of SuperB group Vertex 2007 16th International Workshop on Vertex detectorsSeptember 23-28, 2007, Lake Placid, NY, USA G.Rizzo – Lake Placid - Vertex 2007

  2. Outline • The SuperB Project: • Motivations, Accelerator & Status • Vertex Detector Design Issues • Two viable options for Layer0: • striplets and CMOS Monolithic Active Pixels • Status of the R&D on Layer0 options • Conclusions & Perspectives G.Rizzo – Lake Placid - Vertex 2007

  3. Introduction • Flavour physics is rich, promises sensitivity to New Physics • Physics case established and clear,... but large statistics (50-100 ab-1) is needed • Present B-Factories (PEP-II and KEKB) integrated 1.2 ab-1, exceeding their design goals, with peak Luminosity ~1.2-1.7 x1034 cm-2 s-1...but an upgrade of 1-2 orders of magnitude in Luminosity is needed to get 50ab-1 • Increasing Luminosity by raising the current of PEP-II/KEKB is expensive and difficult • wall plug power and detector background explosion • effective limitation around 5x1035 cm-2 s-1 • Alternative approach for a SuperB design, exploiting ILC R&D, presented for the first time at Hawaii workshop in March 2005. • After several optimizations we have a SuperB design based on 4 and 7 GeV rings (similar to test damping rings for ILC) with moderate currents (~2A) and final focus (ILC-like)L=1036 cm-2 s-1 • This approach allows to (re-) use existing detectors and machine components. G.Rizzo – Lake Placid - Vertex 2007

  4. The SuperB Process • International SuperB Study Group on • Physics case, Machine, Detector • International steering committee established, chaired by M. Giorgi. Members from • Canada, France, Germany, Italy, Russia, Spain, UK, US • Close collaboration with Japan, although not formalized • Regular workshops • Five workshops held at SLAC, Paris, Frascati • SuperB Meeting at Daresbury • Two Accelerator retreats at SLAC • Conceptual Design Report • Published in March 2007 • Describes Physics case, Accelerator, Detector, including costs • International Review Committee appointed by INFN to review CDR • Preliminary report by end of 2007 • Final report in Spring 2008 • More information: www.pi.infn.it/SuperB G.Rizzo – Lake Placid - Vertex 2007

  5. The case for a high luminosity flavour factory g • Prejudice: if there is New Physics at the TeV scale it must have a flavor/CP structure • New heavy quanta can be detected through precision measurements of processes involving loop diagrams • Statistics of O(50 ab-1) is necessary to reduce the experimental error below the theoretical uncertainty for the most sensitive analyses • CP asymmetries have sensitivity to off-diagonal term of squark mixing matrix • Physics reach is complementary to LHC-LHCb: • some rare decays are not accessible at LHC; • test of LFV in t decays G.Rizzo – Lake Placid - Vertex 2007

  6. New Ideas for a SuperB @ 1036 To make a long/complicated story short: • Luminosity depends on beam currents (N) and collision area ( beam sizes s ) • Machine people like to express beam size with transverse emittance e=pss’and amplitude function b=s/s’ : s= (eb)1/2 Holds for collisions with a crossing angle q (KEKB) How to reach high Luminosity: • SuperKEKB approach: increase the currents (squeeze moderately the beams) • wall power and detector background explosion • effective limitation around 5x1035cm-2 s-1 • SuperB approach: low currents (2A), squeeze the beams and keep them small after collisions: • Ultra-low emittance (ILC-DR like) • Very small b at IP • Large Piwinski angle: F = tg(q)sz/sx With large q (17 mrad) and small sx (4mm) e- e+ bunches well separated after IP (sz =6mm) • “Crab Waist” scheme • also improves Lumi by a factor ~2 Reduce sy from 3 mm(KEK) to 0.035 mm ~L(KEK) x 100 Reduce beam beam effects and preserve the low emittance This new IP scheme will be tested in DAFNE this fall. G.Rizzo – Lake Placid - Vertex 2007

  7. New Ideas for a SuperB @ 1036 To make a long/complicated story short: • Luminosity depends on beam currents (N) and collision area ( beam sizes s ) • Machine people like to express beam size with transverse emittance e=pss’and amplitude function b=s/s’ : s= (eb)1/2 Holds for collisions with a crossing angle q (KEKB) How to reach high Luminosity: • SuperKEKB approach: increase the currents (squeeze moderately the beams) • wall power and detector background explosion • effective limitation around 5x1035cm-2 s-1 • SuperB approach: low currents (2A), squeeze the beams and keep them small after collisions: • Ultra-low emittance (ILC-DR like) • Very small b at IP • Large Piwinski angle: F = tg(q)sz/sx With large q (17 mrad) and small sx (4mm) e- e+ bunches well separated after IP (sz =6mm) • “Crab Waist” scheme • also improves Lumi by a factor ~2 Reduce sy from 3 mm(KEK) to 0.035 mm ~L(KEK) x 100 Reduce beam beam effects and preserve the low emittance This new IP scheme will be tested in DAFNE this fall. G.Rizzo – Lake Placid - Vertex 2007

  8. New Ideas for a SuperB @ 1036 Y y waist can be moved along z with a sextupole on both sides of IP at proper phase “Crab Waist” To make a long/complicated story short: • Luminosity depends on beam currents (N) and collision area ( beam sizes s ) • Machine people like to express beam size with transverse emittance e=pss’and amplitude function b=s/s’ : s= (eb)1/2 Holds for collisions with a crossing angle q (KEKB) How to reach high Luminosity: • SuperKEKB approach: increase the currents (squeeze moderately the beams) • wall power and detector background explosion • effective limitation around 5x1035cm-2 s-1 • SuperB approach: low currents (2A), squeeze the beams and keep them small after collisions: • Ultra-low emittance (ILC-DR like) • Very small b at IP • Large Piwinski angle: F = tg(q)sz/sx With large q (17 mrad) and small sx (4mm) e- e+ bunches well separated after IP (sz =6mm) • “Crab Waist” scheme • also improves Lumi by a factor ~2 Reduce sy from 3 mm(KEK) to 0.035 mm ~L(KEK) x 100 Reduce beam beam effects and preserve the low emittance This new IP scheme will be tested in DAFNE this fall. G.Rizzo – Lake Placid - Vertex 2007

  9. SuperB Parameters CDR ~ PEPII-KEKB Currents Here is Luminosity gain Total Power 35 MW G.Rizzo – Lake Placid - Vertex 2007

  10. Smaller beam energy asymmetry 7+4 GeV  bg=0.28 SuperB (bg=0.55 BaBar) Reduces average vertex separation by ~ 2 w.r.t. BaBar: <Dz>~130 mm @ SuperB Radius of beam pipe and first SVT layer need to be reduced: Vertex resolution dominated by first layers: the closer to the IP the better SuperB Vertex Detector Design Issues Most benchmark analyses require excellent vertex resolution: • Time dependent analyses require <Dz>/s(Dz) > ~2 (keep BaBar as target): • <Dz>~ (bg)Y(4S) ct requirements on target s(Dz) scales with (bg)Y(4S) • Background fighting in rare decays benefits from improved vertex resolution Vertex Separation significance Main Issues Impact on Improves BaBar SuperB boost > Detector segmentation to reduce occupancy to acceptable level (<10%) > Radiation hardness • Dose ~ 6 Mrad/yr • Equivalent fluence ~ 6x1012 n/cm2/yr Machine backgrounds with high luminosity/ “squeezed” bunches/low currents: • Present etimate (simulation) of total background rate at SVT inner layer location ~ 5 MHz/cm2 x5 safety G.Rizzo – Lake Placid - Vertex 2007

  11. Backgrounds @ SuperB • Low currents (2A): • Beam-gas are not a problem (similar to BaBar) • SR fan can be shielded • High luminosity  dominated by QED cross section IR design Rate reduced to 5 MHz/cm2 at first SVT layer since e+/e- have low energy and loop in the 1.5T B field. Rate reduced to ~ 100 kHz/cm2 @ SVT location with present IR design and proper shielding to prevent the produced shower from reaching the detector Rate (Mhz/cm2) Radius (cm) G.Rizzo – Lake Placid - Vertex 2007

  12. SuperB SVT Geometry Layer0 20 cm 30 cm 40 cm LayerRadius 0 1.5 cm 1 3.3 cm 2 4.0 cm 3 5.9 cm 4 9.1 to 12.7 cm 5 11.4 to 14.6 cm • Baseline: use an SVT similar to the BaBar one adding a Layer0 • Cannot reuse BaBar SVT because of radiation damage • Fast Simulation indicates target performance achievable with: • b.p. inner radius: 1.0cm, • Layer0 radius: 1.5 cm • b.p.+Layer0 material: <0.5%-0.5% X0 Dt resolution (a Dz) BaBar Improves • A beam pipe with r ~ 1 cm highly desirable, but needs to be cooled. Study is in progress to keep total thickness low ~ 0.5 % of X0 G.Rizzo – Lake Placid - Vertex 2007

  13. SuperB CDR SVT Layer0 U V Depends critically on background level Two viable solutions proposed in the CDR working with back. rate from simulation ~ 5 MHz/cm2 (x5 safety margin considered) Both Layer0 options: 8 modules @ r=1.5 cm, 50 mm pitch, total material budget < 0.5% X0. • Striplets solution (baseline): mature technology, less robust against background occupancy. • OK with present back. estimate • CMOS MAPS solution (option): new & more challenging technology, more robust against background occupancy. • Extensive R&D needed • Fast readout architecture • Sensor optimization • Radiation hardness • Several mechanical issues: • sensor thinning, module design, power dissipation, light cooling 9.7 cm 1.29 cm G.Rizzo – Lake Placid - Vertex 2007

  14. SLIM5-Silicon detectors with Low Interactions with Material • Basic R&D for Layer0 (CMOS MAPS and thin strips) started in 2004 within the SLIM5 Collaboration. • Several Italian Institutions involved in the project: • BO, PI (coordination), PV-BG, TO, TN, TS. • R&D project supported by the INFN and the Italian Ministry for Education, University and Research. SLIM5 Purpose: develop technology for thin silicon tracker systems (sensor/ readout/ support structure/ cooling) crucial to reduce multiple scattering effects for future collider experiments (SuperB, ILC) Realize a demonstration thin silicon tracker with LVL1 trigger capabilities: • CMOS monolithic active pixels • Thin strip detectors on high resistivity silicon • Associative memory system for track trigger • Low mass mechanical support and services Test beam foreseen in 2008 to measure rate capability, efficiency,resolution SLIM5 Project G.Rizzo – Lake Placid - Vertex 2007

  15. Layer0 striplets R&D issues Readout Left Readout Right Si detector 12.9x97.0 mm2 1st fanout, 2nd fanout HDI HDI Conceptual design module “flat” z Technology for Layer0 striplets design well estabilshed • Double sided Si strip detector 200 mm thick • Existent readout chip (FSSR2 - BteV) meets the requirements for striplets readout with good S/N ~ 25. • Readout speed and efficiency not an issue with the expected background rate (safety factor x5 included) 6% occupancy in 132 ns time window. • Total thickness 0.45% X0 = (0.2 % (Si) + 0.1 % (Support) + 0.15 % Multiflex) • Possible reduction in material ( 0.35% X0) with R&D on interconnections between Si sensor and FEE: • Interconnections critical: high number of readout chans/module (~3000). • Multiple layers of Upilex with Cu/gold traces with microbonding (as in SVT) • Kapton/Al microcables with Tape Automated Bonding (as in ALICE experiment) G.Rizzo – Lake Placid - Vertex 2007

  16. Module Layer0 (striplets): 3D-view Carbon-Kevlar ribs End piece Striplets Si detector (fanout cut-away) Buttons (coupling HDI to flanges) Upilex fanout Hybrids chip G.Rizzo – Lake Placid - Vertex 2007

  17. Final Layer 0 (striplets) structure • Mechanical aspects worked out in some detail: from module assembling up to final mounting on the beam pipe. 3-D view r-f cross section G.Rizzo – Lake Placid - Vertex 2007

  18. CMOS Monolithic Active Pixels • Developed for imaging applications • Several reasons make them very appealing astracking devices : • detector & readout on the same substrate • wafer can be thinned down to few tens of mm • radiation hardness (oxide ~nm thick) • high functional density and versatility • low power consumption and fabrication costs Principle of operation • The undepleted epitaxial layer acts as a potential well for electrons • Signal (~1000 e-) collected through diffusion by the n-well contact • Charge-to-voltage conversion provided by the sensor capacitance  small collecting electrode • Simple in-pixel readout (PMOS not allowed)  sequential readout G.Rizzo – Lake Placid - Vertex 2007

  19. Proof of principle with the first prototypes realized in 130 nm triple well CMOS process (STMicrolectronics) Deep NWell MAPS design PRE SHAPER DISC LATCH New approach in CMOS MAPS design to improve the readout speed potential: APSEL chip series SLIM5 Collaboration - INFN & Italian University • Full in-pixel signal processingrealized exploiting triple well CMOS process • Deep nwell (DNW) as collecting electrode Gain independent of the sensor capacitance collecting electrode can be extended • Area of the “competitive” nwells inside the pixel kept to a minimum:, they steel signal to the main DNW electrode. • Fill factor = DNW/total n-well area ~90% in the prototype test structures • Pixel structure compatible with data sparsification architecture to improve redout speed. competitive nwell Deep nwell G.Rizzo – Lake Placid - Vertex 2007

  20. Submitted DNW MAPS Chips – 130 nm ST Sub. 9/2006 Sub. 8/2006 Sub. 12/2004 Sub. 8/2005 APSEL2M APSEL2T APSEL0 APSEL1 TEST_STRUCT Improved F-E 8x8 Matrix Preamplifier characteriz. Cure thr disp. and induction Accessible pixel Study pix resp. ST 90nm characterization ST 130 Process characterization Sub. 11/2006 Sub. 5/2007 Sub. 7/2007 Sub. 7/2007 APSEL3D APSEL3_T1, T2 APSEL2_CT APSEL2_90 APSEL2D Test digital RO architecture Test chips for shield, xtalk 32x8 Matrix. Shielded pix. Test for final matrix Test chips to optimize pixel and F-E layout G.Rizzo – Lake Placid - Vertex 2007

  21. 90Sr electrons S/N=14 Landau mV Cluster signal (mV) APSEL2 3x3 matrix: analog output 3x3 matrix, full analog output Cluster Multiplicity 1 2 Noise events properly normalized Hit pixels in 3x3 matrix • Noise ENC = 50 e- • Indications of small cluster size (1-2 pixels) • Cluster Signal for MIP (Landau MPV) 700 e-  S/N = 14 Cluster seed G.Rizzo – Lake Placid - Vertex 2007

  22. Noise Vthr APSEL2 8x8 matrix: digital output Noise scan: hit rate vs discriminator threshold 8x8 matrix digital output Sequential readout Vth (mV) Threshold dispersion ~ 100 e- 90Sr electrons: single pixel spectrum Differential spectrum from digital output Spectrum from analog output Noise (mV) Average Noise ENC = 50 e- G.Rizzo – Lake Placid - Vertex 2007

  23. Fast Readout Architecture for MAPS End Of Rows - EOR - End Of Columns - EOC - MP Sparsification MP MP • Data-driven readout architecture with sparsification and timestamp information under development. • In the active sensor area we need to minimize: • the logical blocks with PMOS to minimize the competitive nwell area and preserve the collection efficiency of the DNW sensor. • digital lines for point to point connections to allow scalability of the architecture with matrix dimensions and to reduce cross talk with the sensor underneath. • Matrix subdivided in MacroPixel (MP=4x4) with point to point connection to the End Of Column • Token pass logic scans for hits in the EOCs (stored list of hit MPs and relative timestamp) to start the redout of the corresponding MP. • Pixel data from each read out MP are sent to the End Of Row and to the sparsification logic. • Data output interface formats the output of the sparsification, associates the TS and sends data to output lines APSEL2D chip received in July, tests just started • Pixel response and noise as expected • Readout seems to work as expected, but induction is present and interfering with operations G.Rizzo – Lake Placid - Vertex 2007

  24. From APSEL2 to APSEL3 M6 Digital routing (local/global) M5 Shield (VDD/GND) M4 M3 Analog routing (local) M2 M1 APSEL2 issues APSEL3D Digital lines shielding • Cross talk between digital lines and substrate • Requires aF level parasitic extraction to be modeled • Relatively small S/N ratio (about 15) • Especially important if pixel eff. not 100% • Power dissipation 60 mW/pixel • Creates significant system issues APSEL3 Redesigned front-end/sensor Optimize FE Noise/Power: • Reduce sensor capacitance keeping the same collecting electrode area • reduce DNW sensor/analog FE area (DNW large C) • Add standard NWELL area (lower C) to collecting electrode. • New design of the analog part Optimize sensor geometry for charge collection efficiency using fast simulation developed: • Locate low efficiency region inside pixel cell • Add ad hoc “satellite” collecting electrodes APSEL3 Power=30 mW/pixel: Perfomance APSEL3 expected performance G.Rizzo – Lake Placid - Vertex 2007

  25. APSEL3D • 256 pixel matrix with sparsified readout and timestamp - submitted 7/2007 • Innovative mixed mode design • Pixel cell with full custom design and layout • Sparsifying logic synthetized in std-cell from VHDL model • Essential for large matrix design with complex logic • Encouraging results on hit efficiency from VHDL simulation: • e > 99% with hit rate up to 800 MHz/cm2 (small matrix- preliminary study) 256 pixels - 50 mm pixel pitch G.Rizzo – Lake Placid - Vertex 2007

  26. Layer0 MAPS Module • MAPS power dissipation is large (in the active area!) • Power = 50 μW/cell = 2 W/cm2 • Power dissipation drives the mechanical problem MAPS module proposed in CDR (microchannel with cold liquid) • Two MAPS layers (up/down) placed on the mechanical support forming a ladder. • Each chip: 12.8mm x 12.8mm. • Total Layer0 thickness: 0.5 % X0 • 0.1 % (Si) + 0.3 % (Supp+Cooling) + 0.1 % (bus/Cu) G.Rizzo – Lake Placid - Vertex 2007

  27. Conclusions • The physics case for a high luminosity B-Factory is clearly established • The SuperB accelerator concept allows to reach and exceed 1036 in luminosity. • Baseline Vertex Detector design proposed in the CDR: • Improved vertex resolution, imposed by lower machine boost, needed to reach BaBar performance. • Achievable with a Vertex Detector based on the BaBar SVT design adding a Layer0 very close to IP (R=1.5 cm), thin (~0.5% X0) and able to cope with the background expected. • Layer0 CDR solution based on: • High resistivity short strips: viable but less margin against back. occupancy • CMOS MAPS pixels: “new” technology very appealing but needs extensive R&D. • First results on DNW MAPS very promizing but there is still a lot to do! • Other groups interested in the R&D for the Vertex Detector are very welcome to join the SuperB community. G.Rizzo – Lake Placid - Vertex 2007

  28. Perspectives • There is growing international interest and participation to the SuperB Project. • The Conceptual Design Report is now under review: • Report by the end of 2007. • Next SuperB steps: from CDR to TDR: • Accelerator studies continue to optimize the machine parameters. • Test in Dafne in Nov ’07 (crab waist and basic concepts of SuperB IP scheme) • Detector R&D coordination has been formed (meets every other week) • Physics groups active to update on Physics case (looking at complementarity with LHC). G.Rizzo – Lake Placid - Vertex 2007

  29. Backup G.Rizzo – Lake Placid - Vertex 2007

  30. MAPS Radiation Hardness • Expected Background @ Layer0: • Dose = 6Mrad/yr • Equivalent fluence = 6x1012 neq/cm2/yr • CMOS redout electronics(deep submicron) rad hard • MAPS sensor - Radiation damage affects S/N • Non-ionizing radiation: bulk damage cause charge collection reduction, due to lower minority carrier lifetime (trapping)  fluences ~ 1012 neq/cm2 affordable, 1013 neq/cm2 possible • Ionizing radiation: noise increase, due to higher diode leakage current (surface damage)  OK up to 20 Mrad with low integration time (10 ms) or T operation < 0o C, or modified pixel design to improve it Results from standard nwell MAPS prototypes Irradiation test performed on several MAPS prototypes, with standard nwell sensor, indicate application for SuperB is viable. APSEL chips irradiation started this summer …. G.Rizzo – Lake Placid - Vertex 2007

  31. SuperB Physics Case • There is a solid case for a SuperB collecting between 50 and 100 ab-1 ( 5. 1010 -10 11 B, charm, t pair) • Precision measurements in B sector allowing to detect discrepancies from the standard model • Reduced theoretical uncertainties will allow this in many channels • Rare decay measurements • Lepton flavour violation, T violation in tau, • In addition: possibility to run at tau/charm threshold, polarized beam • Complementarity with LHC has been studied in the CERN workshop Flavour Physics in the era of LHC . • (M.Mangano,T.Hurth to be published soon as CERN yellow report) • See in addition to SuperB CDR: • The Discovery Potential of a Super B Factory (Slac-R-709) • Letter of Intent for KEK Super B Factory (KEK Report 2004-4 ) • Physics at Super B Factory (hep-ex/0406071) • SuperB report (hep-ex/0512235) • Many documents available at the URL : www.pi.infn.it/SuperB • BUT MORE IMPORTANT…… THE UNEXPECTED DISCOVERY FROM A FRONTIER MACHINE G.Rizzo – Lake Placid - Vertex 2007

  32. Comparison with Super LHCb • From mulheim From F. Muheim talk SuperB runs at Y5s • No Bs Oscillation • Only partially integrated time dependentasymmetries ΔΓs, possible Bs -> μμ YES Bs -> γγ YES G.Rizzo – Lake Placid - Vertex 2007

  33. CPV in rare decays (PENGUINS) Precision expected at high lumi b, c, t yelds assuming unpolarized beams G.Rizzo – Lake Placid - Vertex 2007

  34. Rare Decays G.Rizzo – Lake Placid - Vertex 2007

  35. UTfit as now and with SuperB Triangle vertex Determined by N.P. free processes With 50 ab-1 gis measured at 1° level 50 ab-1 1 ab-1 Theoretical uncertainties on sides could be reduced: (V.Lubicz, SuperB IV Villa Mondragone nov.2006) Vub : 2% (excl.) 2% (incl.)Vcb : 1% (excl.) 0.5% (incl.) G.Rizzo – Lake Placid - Vertex 2007

  36. How to increase L ? (example Super-KEKB) x 3 (HER) / x 5 (LER) x 4 x 0.5 x 50 G.Rizzo – Lake Placid - Vertex 2007

  37. Hourglass effect To squeeze the vertical beam dimensions, and increase L, by at IP must be decreased. This is efficient only if at the same time the bunch length is shortened to »by value, or particles in the head and tail of the bunch will see a larger by. by* Bunch length G.Rizzo – Lake Placid - Vertex 2007

  38. Overlap region sx sz Y sz y waist can be moved along z with a sextupole on both sides of IP at proper phase “Crab Waist” sx P.Raimondi idea 1) Head-on, Short bunches 2) Large crossing angle, long bunches (1) and (2) have same Luminosity, but (2) has longer bunches and smaller sx Large Piwinski angle: F = tg(q)sz/sx With large crossing angle the x and z planes are swapped G.Rizzo – Lake Placid - Vertex 2007

  39. Here is Luminosity gain IP beam distributions for KEKB An example... IP beam distributions forSuperB G.Rizzo – Lake Placid - Vertex 2007

  40. Reuse of PEPII/Babar components Almost all components of PEPII are reusable in SuperB (magnets, RF system..) after the end of the running of the Slac Bfactory. Although many components of Babar apparatus could be reused some changes and upgrades are necessary to take care of the very high rate and of the high spatial occupancy in the subdetectors. A new electronics designed for the high lumi is necessary. A major change in the electromagnetic calorimeter is needed, a new EMC endcap in the forward region, based on faster and radiation harder device. Silicon Vertex tracker must be redesigned because of a smaller beam pipe radius necessary to allow, despite a small center of mass boost, good precision in time dependent analyses. Upgrade of drift chamber and forward PID is also considered. G.Rizzo – Lake Placid - Vertex 2007

  41. In MEuro G.Rizzo – Lake Placid - Vertex 2007

  42. Accelerator and site costs Note: site cost estimate not as detailed as other estimates. G.Rizzo – Lake Placid - Vertex 2007

  43. Detector cost Note: options in italics are not summed. We chose to sum the options we considered most likely/necessary. G.Rizzo – Lake Placid - Vertex 2007

  44. Schedule • Overall schedule dominated by: • Site construction • PEP-II/Babar disassembly, transport, and reassembly • We consider possible to reach the commissioning phase after 5 years from T0. G.Rizzo – Lake Placid - Vertex 2007

  45. What money ? • The SuperB budget model still needs to be fully developed. It is based on the following elements (all being negotiated) • Italian government ad hoc contribution • Regione Lazio contribution • INFN regular budget • EU contribution • In-kind contribution (PEP-II + Babar elements) • Partner countries contributions • Clearly the SuperB project is inherently international and will need to be managed internationally G.Rizzo – Lake Placid - Vertex 2007

  46. CDR Signatures: some numbers Signatures breakdown by country • 320 Signatures • About 85 institutions • 174 Babar members • 65 non Babar exper. G.Rizzo – Lake Placid - Vertex 2007

  47. The Università di Roma Tor Vergata Site 750m • Area available • Strong interest of University and INFN • Tunnel at about -12m • Synergy with approved FEL (SPARX) • Engineering group created • Issues: water, power G.Rizzo – Lake Placid - Vertex 2007

  48. PEPII-BABAR 11 countries, 80 institutions, ~630 collaborators Energy in the CM is 10.58 GeV: e+e-U(4S)B0B0 coherent state L=1 state 9(e-)x 3.1(e+) GeV asymmetric beam energies boost U(4S) in LAB (bg=0.55)and increase separation among the two Bs decay vertices BaBar detector for example: Charged tracking/vertexing • 5-layer vertex detector Si µstrip • 40 layers Drift Chamber(He-isobutane) Hadron identification • tracker: dE/dx • DIRC imaging Cerenkov detector Electron/photon • CsI calorimeter Muon/KL • Instrumented flux return with RPC/LST Peak Luminosity:1.2  x 1034 cm-2s-1 2900 mA (LER) , 1875 mA (HER) 1722 bunches G.Rizzo – Lake Placid - Vertex 2007

  49. Measurement Technique for time-dependent CPV • CP asymmetries depend on Dt between B decays • Measurement of B decay points is essential. B-Flavor tagging 0 z B tag Coherent BB production (p-wave) B0 B0 Use center of mass boost to measure displaced vertices Reconstruction of B decays to exclusive final states G.Rizzo – Lake Placid - Vertex 2007

  50. Beam pipe • 1.0 cm inner radius • Be inner wall • ≈ 4um inside Au coating • 8 water cooled channels (0.3mm thick) • Power ≈ 1kW • Peek outer wall • Outer radius ≈ 1.2cm • Thermal simulation shows max T ≈ 55°C • Issues • Connection to rest of b.p. • Be corrosion • Outer wall may be required to be thermally conductive to cool pixels G.Rizzo – Lake Placid - Vertex 2007

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