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Flip Chip Technology. Microwave Device Term Project. 2005/6/16 Kim Dong Hwan School of Electrical Engineering and Computer Science Seoul National University, Korea. Contents. Introduction Wire Bonding vs. Flip Chip interconnect Flip Chip Process (SSB & MSB) Conclusion. Introduction.

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flip chip technology

Flip Chip Technology

Microwave Device Term Project

2005/6/16

Kim Dong Hwan

School of Electrical Engineering and Computer Science

Seoul National University, Korea

contents
Contents
  • Introduction
  • Wire Bonding vs. Flip Chip interconnect
  • Flip Chip Process (SSB & MSB)
  • Conclusion
introduction
Introduction
  • Advancements in the packaging of semiconductor devicestraditionally use wire bonds to provide the interconnect from device to substrate or to other devices
  • Along with the rapid advances in microwave and millimeter wave subsystem development

 a growing interest concerning chip interconnectiontechniques has developed.

  • The importance of quality of these interconnects

 a large impact on the performance of the entire subsystem, especially at high frequencies.

  • Flip chip offers advantages over traditional interconnect schemes.

 A smaller overall footprints, better thermal heat transfer

slide4

Introduction

  • Wire Bonding vs. Flip Chip interconnect
  • Flip Chip Process (SSB & MSB)
  • Conclusion
wire bonding
Wire Bonding

Wire length

loss

Bond ribbon

[Coplanar Waveguide Model]

flip chip interconnection
Flip Chip Interconnection

MMIC(2mm 50 CPW line)

CPW

Motherboard on 20-cm Si wafer

Bump

Compared to the Bond Wire

Small

Big

[Flip Chip Interconnection of Coplanar MMIC]

[EM-Simulation Structure for RF test]

[Gold(Stud) Bumps attached]

Ref.Songsub Song

flip chip interconnection1
Flip Chip Interconnection

Bump Height ≥ Spacing

☞ The influence of substrate surface -> negligible

{Bump height ≥ Ground to ground spacing of the transmission lines}

flip chip interconnection2
Flip Chip Interconnection

Flip Chip Interconnection

Versus

Wire Bonding

Insertion loss

Return loss

Beyond 100GHz → Below 0.5dB

proximity effect in flip chip structure

50  CPW (D= 80mm)

  • Alumina substrate

MMIC or Device

MMIC or Device

Change in Z0 ( % )

~ 3 % change at 20 mm

D

D

Motherboard

Motherboard

Air gap (mm)

[ E-field distribution for a flip-chip

mounted CPW MMIC ]

[ E-field distribution for a flip-chip

mounted CPW MMIC ]

[ Change rate of characteristic impedance as a function of air-gap for a flip-chip mounted CPW MMIC ]

Proximity Effect in Flip-Chip Structure

Height of flip-chip bump (air-gap)

Ref. Sangsub Song, “The Flip-Chip Mounted MMIC Technology using the Modified MCM-D Substrate for Compact and Low-Cost W-band Transceivers”

why flip chip technology
Why Flip Chip Technology?

CPW MMIC

m-strip MMIC

Wire -Bonding

Ground

Via

Flip-Chip Bump

50 ~ 100 mm

[ Flip-Chip Bonding Technology ]

[ Wire-Bonding Technology ]

~ 650 mm

 Advantages of Flip Chip Bonging Technology.

 Short Interconnection Length  Better Electrical Performances

 High reproducibility  High Yield & Less Tuning

 Compact size  High Packaging density

 Passive components are made in dielectric substrate such as alumina Ceramics, SiO2 and BCB  Low Cost

slide12

Introduction

  • Wire Bonding vs. Flip Chip interconnect
  • Flip Chip Process (SSB & MSB)
  • Conclusion
s tud b ump b onding technology
Stud Bump Bonding Technology

[Cross-sectional SEM photograph of the bonding portion by SBB]

[Process flow of the SBB]

m icro b ump b onding technology
Micro Bump Bonding Technology

-To cure the resin

[Cross-sectional SEM photograph of the bonding portion by MBB]

[Process flow of the MBB]

☞ Further requirements for miniaturization and higher frequency operation

conclusion
Conclusion
  • The need for smaller packaging
    • Flip chip interconnect process → more compact fashion
  • Improved electrical performance
    • Reduced interconnect length → lower inductance and reduced signal loss → lower power requirements
  • The demands of high frequency applications
    • Limitation of the wire interconnect → flip-chip bump connection

[Flip Chip Bump Connection]

[Wire connection]

references
References

[1] Mark S. Hauhe, “Flip Chip Technology Vendor Overview,”

[2] R. Sturdivant, “Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips,” in Proc. 1995 Int. Microwave Theory Tech. Symp. Dig., Orlando, FL, May 1995, pp. 1591-1594.

[3] Hideki Kusamitsu, et al., “The Flip-Chip Bump Interconnection for Millimeter Wave GaAs MMIC,” IEEE Transactions on Electronics Packaging Manufact- uring, VOL. 22, NO .1, January 1999.

[4] T. Krems, et al., “Millimeter-Wave Performance of Chip Interconnections Using Wire Bonding and Flip Chip,” IEEE MTT-S Digest. pp. 247-250.

[5] Hiroyuki Sakai., “High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-wave ICs,” IEICE TRANS. Electron., VOL. E81-C, NO. 6 June 1998.

[6] Kiyomitsu Onodera, et al., “Novel Flip-Chip Bonding Technology for W-Band Interconnections Using Alternate Lead-Free Solder Bumps,” IEEE Microwave and Wireless Components Letters, VOL.12, NO. 10, October 2002.

[7] Sangsub Song, “The Flip-Chip Mounted MMIC Technology using the Modified MCM-D Substrate for Compact and Low-Cost W-band Transceivers” IEEE IMS 2005. Microwave Application Seminars.

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