Ultrasonic Flip Chip Bonding Machine

Ultrasonic Flip Chip Bonding Machine PowerPoint PPT Presentation


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. . . Feature. High speed bonding process less than 1 second and sufficient ultrasonic power to deform over 1000 bumps evenly Quick head movement for quick bump deformation by force feedback function Constant ultrasonic amplitude method to obtain consistent bonding Profile control fu

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Ultrasonic Flip Chip Bonding Machine

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