RTAX-S FPGA DPA’s
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RTAX-S FPGA DPA’s. Rich Katz, Grunt Engineer NASA Office of Logic Design. Purpose. First early DPA look at RTAX-S FPGAs Die Types RTAX250S RTAX1000S RTAX2000S Packages Flat packs only Early missions flying flat packs This presentation will present highlights from the DPA reports.

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RTAX-S FPGA DPA’s

Rich Katz, Grunt Engineer

NASA Office of Logic Design


Purpose
Purpose

  • First early DPA look at RTAX-S FPGAs

  • Die Types

    • RTAX250S

    • RTAX1000S

    • RTAX2000S

  • Packages

    • Flat packs only

    • Early missions flying flat packs

  • This presentation will present highlights from the DPA reports.

    • More info at: http://klabs.org/richcontent/fpga_content/pages/notes/fpga_reliability.htm#dpa_rtax-s


Summary
Summary

Summary:  Six RTAX-S FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA). The testing was performed in accordance with GSFC S-311-M-70, MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards.

Part Number: RTAX250S RTAX1000S RTAX2000S

Package: CQ208E CQ352 CQ352

Grade: E B E

Lot Date Code: 0507 0444 0509

Wafer Date Code: D1H381 D1GAH1 D1KHN1

S/N: 72529, 72589 61287 73802, 73857


Rtax250s
RTAX250S

Note: Ceramic bottom, no exposed heat sink.



Rtax1000s
RTAX1000S

Note: Ceramic bottom, no exposed heat sink.


Rtax2000s
RTAX2000S

Note: Ceramic bottom, no exposed heat sink.



Analyses performed
Analyses Performed

  • External Visual Inspection

  • Prohibited Materials Analysis of the External Surfaces

  • Radiographic Examination

  • Particle Impact Noise Detection (PIND)

  • Hermeticity Testing

  • Residual Gas Analysis (RGA)

  • Internal Visual Inspection of the Delidded Devices

  • Prohibited Materials Analysis of the Internal Surfaces

  • Bond Pull Testing

  • Die Shear Testing


Analyses not performed
Analyses Not Performed

Scanning Electron Microscopy (SEM) Inspection of the metallization was not performed in accordance with MIL-STD-883F, Method 2018, paragraph 1. The metallization was of CMP planar oxide construction.


Anomalies
Anomalies

  • RTAX1000S Samples

    • Low bond pull strength

    • Bond pull failures

  • Additional samples from multiple lots now in process of being analyzed.






Additional bond pull samples

Additional Bond Pull Samples

RTAX1000S

Lot Date/Code 0546

Three samples, all passed.


Sem sample ldc 0546
SEM Sample, LDC 0546

Sample 1 of 3


Sem sample ldc 05461
SEM Sample, LDC 0546

Sample 2 of 3


Sem sample ldc 05462
SEM Sample, LDC 0546

Sample 3 of 3


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