RTAX-S FPGA DPA’s
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RTAX-S FPGA DPA’s. Rich Katz, Grunt Engineer NASA Office of Logic Design. Purpose. First early DPA look at RTAX-S FPGAs Die Types RTAX250S RTAX1000S RTAX2000S Packages Flat packs only Early missions flying flat packs This presentation will present highlights from the DPA reports.

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Rich Katz, Grunt Engineer NASA Office of Logic Design

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Rich katz grunt engineer nasa office of logic design

RTAX-S FPGA DPA’s

Rich Katz, Grunt Engineer

NASA Office of Logic Design


Purpose

Purpose

  • First early DPA look at RTAX-S FPGAs

  • Die Types

    • RTAX250S

    • RTAX1000S

    • RTAX2000S

  • Packages

    • Flat packs only

    • Early missions flying flat packs

  • This presentation will present highlights from the DPA reports.

    • More info at: http://klabs.org/richcontent/fpga_content/pages/notes/fpga_reliability.htm#dpa_rtax-s


Summary

Summary

Summary:  Six RTAX-S FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA). The testing was performed in accordance with GSFC S-311-M-70, MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards.

Part Number: RTAX250S RTAX1000S RTAX2000S

Package: CQ208E CQ352 CQ352

Grade: E B E

Lot Date Code: 0507 0444 0509

Wafer Date Code: D1H381 D1GAH1 D1KHN1

S/N: 72529, 72589 61287 73802, 73857


Rtax250s

RTAX250S

Note: Ceramic bottom, no exposed heat sink.


Rtax250s1

RTAX250S


Rtax1000s

RTAX1000S

Note: Ceramic bottom, no exposed heat sink.


Rtax2000s

RTAX2000S

Note: Ceramic bottom, no exposed heat sink.


Rtax2000s1

RTAX2000S


Analyses performed

Analyses Performed

  • External Visual Inspection

  • Prohibited Materials Analysis of the External Surfaces

  • Radiographic Examination

  • Particle Impact Noise Detection (PIND)

  • Hermeticity Testing

  • Residual Gas Analysis (RGA)

  • Internal Visual Inspection of the Delidded Devices

  • Prohibited Materials Analysis of the Internal Surfaces

  • Bond Pull Testing

  • Die Shear Testing


Analyses not performed

Analyses Not Performed

Scanning Electron Microscopy (SEM) Inspection of the metallization was not performed in accordance with MIL-STD-883F, Method 2018, paragraph 1. The metallization was of CMP planar oxide construction.


Anomalies

Anomalies

  • RTAX1000S Samples

    • Low bond pull strength

    • Bond pull failures

  • Additional samples from multiple lots now in process of being analyzed.


Rtax1000s anomaly

RTAX1000S Anomaly


Rtax1000s anomaly1

RTAX1000S Anomaly


Rtax1000s anomaly2

RTAX1000S Anomaly


Rtax1000s anomaly3

RTAX1000S Anomaly


Additional bond pull samples

Additional Bond Pull Samples

RTAX1000S

Lot Date/Code 0546

Three samples, all passed.


Sem sample ldc 0546

SEM Sample, LDC 0546

Sample 1 of 3


Sem sample ldc 05461

SEM Sample, LDC 0546

Sample 2 of 3


Sem sample ldc 05462

SEM Sample, LDC 0546

Sample 3 of 3


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