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Pixel Sensor Submission

Pixel Sensor Submission. ATLAS Prototype 1: CiS, SII (p-stop+p-spray) Prototype 2: CiS, IRST (moderated p-spray) PreProduction: CiS, TESLA CMS 1 st prototype: CSEM (p-stop) USCMS: SINTEF (p-stop) 2 nd prototype: SINTEF (p-stop) PSI: ? (moderated p-spray? + p-stop) ALICE

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Pixel Sensor Submission

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  1. Pixel Sensor Submission • ATLAS • Prototype 1: CiS, SII (p-stop+p-spray) • Prototype 2: CiS, IRST (moderated p-spray) • PreProduction: CiS, TESLA • CMS • 1st prototype: CSEM (p-stop) • USCMS: SINTEF (p-stop) • 2nd prototype: SINTEF (p-stop) • PSI: ? (moderated p-spray? + p-stop) • ALICE • 1st prototype: Canberra (p on n)

  2. BTeV Submission • 1st prototype • Joint submission with US-CMS (p-stop) • Bids received: SINTEF, CSEM,CiS, Eurysis • No bid: Hamamatsu • SINTEF and CSEM chosen • CSEM submission held up by CMS • SINTEF: 22 wafers in total (5 oxygenated, 3 high resistivity)

  3. SINTEF wafers summary • Single-chip yield excellent • Leakage current low, BD voltage meet or exceed spec (> 300V) • 5-chip module yield: (see figure) • After irradiation : Vd < Vbd up to 4x1014 p/cm2 (low resistivity wafers) • Normal wafers about the same characteristics as oxygenated wafers

  4. SINTEF five chip modules

  5. Next steps • Two more prototype submissions planned • Moderated p-spray (NDA with ATLAS, Licence Agreement with Garching Innovation GmbH) • P-stop (meet design rule of vendor, new chip size, new module size)

  6. Moderated p-spray • Received prototype 2 wafers and preprod. Wafers from ATLAS • Probing results (Rita’s presentation) • Irradiation test end of January • Detectors: mated to preFPIX2tb (bench test, irradiation test, beam test) • Try out the submission process ourselves • New chip size, new module size • RFP sent to: CiS, Eurysis, SINTEF, TESLA • Bids received from : CiS, SINTEF, and TESLA (see next slide) • Big difference in quote and details of the responses • After checking with Purchasing Dept, proposed to drop TESLA (quote unrealistic and not enough detail) • Still waiting to get more details from CiS (testing procedure, material spec) • SINTEF: details on testing of modules

  7. Preconceptual R&D: Draft Timeline

  8. Discussion • ATLAS wafers (probing results) • More questions to the vendors? • Status of the mask design • Remaining issues • Simulation • Submission schedule

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