Pixel detector development: sensor
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Pixel detector development: sensor. Epitaxial wafer with sensor: first design. 5 readout chip sensor. pixel . Pad for bump bonding . 4 readout chip sensor . Pixel detector development: readout electronics. ToPix specifications:

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Pixel detector development: sensor

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Pixel detector development sensor

Pixel detector development: sensor

Epitaxial wafer with sensor: first design

5 readout chip sensor

pixel

Pad for

bump bonding

4 readout chip sensor


Pixel detector development sensor

Pixel detector development: readout electronics

ToPix specifications:

Custom made pixel readout chip developed using 130 nm CMOS technology


Pixel detector development sensor

Pixel detector development: Front-end electronics

ToPix_v2: Custom made pixel readout chip

Electrical scheme of the readout cell

ToT

bus

Prototype with 320 readout cells

Ifb

7

12

12

CLK:

control

logic

Cint

le_reg

INPUT

preamp

comp

te_reg

mask

latch

enable

baseline

restorer

5

12

cfg_reg

mask

DAC

DIGITAL

ANALOG

Pixel readout cell,

100 mm x 100 mm size


Pixel detector development sensor

Characterization of front-end and sensor prototypes

ToPix: Custom made pixel readout chip

Channel to channel ToT dispersion:

 10 %

Epi-Sensors

Tests with a 90Sr source


Pixel detector development sensor

Measurements with epitaxial pixel prototypes connected to ToPix front-end chip with wire bonding

Epitaxial silicon pixel size: 125mm x 325mm, 50 mm thick


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