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SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package

SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package. Bruce C. Bigelow Department of Physics, University of Michigan 20 July 2005. SiC NIR Package Design Issues. Neither NIR device vendor is producing a package we want to use for SNAP

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SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package

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  1. SNAP NIR Detector Packaging Development:Towards a Universal SiC Detector Package Bruce C. Bigelow Department of Physics, University of Michigan 20 July 2005

  2. SiC NIR Package Design Issues • Neither NIR device vendor is producing a package we want to use for SNAP • SiC is currently favored for SNAP focal plane components • It would be useful to have a NIR package design that can accommodate either RSC or RVS detectors • These designs shown here have the center of the Rockwell sensor area located at the center of the Raytheon sensor area. B. C. Bigelow -- UM Physics

  3. Current Rockwell Package Design Rockwell PGA PCB presents wire-bonding pads for connector on front side of mother-board B. C. Bigelow -- UM Physics

  4. Current Rockwell Package Design H2RG package and mounting details B. C. Bigelow -- UM Physics

  5. Current RVS Package Dimensions Raytheon PCB presents wire-bonding pads for connector on back side of mother-board B. C. Bigelow -- UM Physics

  6. Current RVS Package Raytheon Proprietary / Competition Sensitive B. C. Bigelow -- UM Physics

  7. Rockwell device on universal package Wire-bonds attach green PCB to front side of magenta mother board. Rockwell device is undersized for the SNAP focal plane detector pitch B. C. Bigelow -- UM Physics

  8. Raytheon device on universal package Wire-bonds attach green PCB to back side of magenta mother board. Raytheon device is well sized for the SNAP focal plane detector pitch B. C. Bigelow -- UM Physics

  9. Common SiC package design B. C. Bigelow -- UM Physics

  10. Conclusions • A conceptual design for a SiC NIR detector package that could accommodate either Rockwell or Raytheon detectors, and meets all of the current SNAP requirements, has been presented. • Pending review of the quotation drawings, requests for quotations for fabrication of the package will be sent out, and prototype parts will be ordered from at least one vendor B. C. Bigelow -- UM Physics

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