3d s en sor testbeams at fnal
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3D s en sor testbeams at FNAL. M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira. FBK ATL A S09 ( QUALIFICATION BATCH ). Different wafer thicknesses: 200- 230 -250 m m Slim edge (200 m m on two sides). Expected low leakage current and high breakdown. 1E. 1E. 1E. 1E.

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3D s en sor testbeams at FNAL

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3d s en sor testbeams at fnal

3D sensor testbeams at FNAL

M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira


Fbk atl a s09 qualification batch

FBK ATLAS09 (QUALIFICATION BATCH)

Different wafer thicknesses: 200-230-250 mm

Slim edge (200 mm on two sides)

Expected low leakage current and high breakdown.

1E

1E

1E

1E

CMS pixel

detectors

Lots of wafers available, but …

waiting for a general agreement with ATLAS about the use of CMS sensors


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