3D s en sor testbeams at FNAL. M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira. FBK ATL A S09 ( QUALIFICATION BATCH ). Different wafer thicknesses: 200- 230 -250 m m Slim edge (200 m m on two sides). Expected low leakage current and high breakdown. 1E. 1E. 1E. 1E.
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M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira
Different wafer thicknesses: 200-230-250 mm
Slim edge (200 mm on two sides)
Expected low leakage current and high breakdown.
Lots of wafers available, but …
waiting for a general agreement with ATLAS about the use of CMS sensors