Study of glues for the assembly of the ALICE Silicon Pixel Detectors
This presentation is the property of its rightful owner.
Sponsored Links
1 / 20

Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003 PowerPoint PPT Presentation


  • 55 Views
  • Uploaded on
  • Presentation posted in: General

Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003. The PADOVA Gluing Team: Daniela Fabris 2 Marcello Lunardon 1,2 Francesca Soramel 3, 4 1 Dept. of Physics of the University of Padova 2 INFN Sezione di Padova

Download Presentation

Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10 .0 3 .2003

An Image/Link below is provided (as is) to download presentation

Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.


- - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - -

Presentation Transcript


Study of glues for the assembly of the ALICE Silicon Pixel Detectors

Status at 10.03.2003

The PADOVA Gluing Team:

Daniela Fabris2

Marcello Lunardon1,2

Francesca Soramel3,4

1 Dept. of Physics of the University of Padova

2 INFN Sezione di Padova

3 Dept. of Physics of the University of Udine

4 INFN Sezione di Trieste-Gruppo collegato di Udine

for the ALICE collaboration


INDEX

  • Assembling the SPD

  • Test protocol for glue selection

  • First results

  • What next


TheGluing Tasks for the SPD

TASK 1:

ASSEMBLING THE HALF STAVE

( BARI )

HALF STAVE

TASK 2:

ASSEMBLING THE HALF STAVES ON THE

CARBON FIBER SECTOR SUPPORT

( PADOVA )

CFSS


Assembling the Silicon Pixel Detectors (I)

TOP VIEW

BOTTOM VIEW

BACK SIDE

OF THE CHIP

GROUNDING FOIL WITH

WINDOWED KAPTON LAYER


Assembling the Silicon Pixel Detectors (II)

Carbon Fiber

Sector Support

Cooling Duct


Assembling the Silicon Pixel Detectors (II)

THERMAL ADHESIVE PADS


Assembling the Silicon Pixel Detectors (II)

Half Stave

UV GLUE


Assembling the Silicon Pixel Detectors (II)

Carbon Fiber Clips

UV GLUE


Assembling the Silicon Pixel Detectors (III)

  • Main problems to be studied:

    • thermal contact

    • mechanical stability with UV glue

The two problems are independent in the new mounting scheme


TEST PROTOCOL (I)

Thermal compound tests

  • TC.a) preliminary adhesion tests

    • how glues look like

  • TC.b) thermal conductivity measurements

    • measurements for about 0.1 mm adhesive thickness used in working conditions

    •  first reduction of candidates

  • TC.c) glue spreading tests

    • spreading the thermal adhesive on windowed kapton-glass samples fixed above the cooling duct with UV glue and with pressure control

    • glue spreading procedures

  • TC.d) thermal contact reliability tests w.r.t. thermal cycles

    • test of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedures

    •  best candidate(s) selection and definition of the gluing procedure


  • TEST PROTOCOL (II)

    • TC.e) test of compatibility with Bari glue (ECCOBOND 45)

      • verify thecompatibility between the thermal compound and the adhesive used to glue the grounding foil on the bottom side of the half stave

  • TC.f) irradiation tests with best candidate(s)

    • thermal contact reliability test of best candidate(s) after irradiation

    •  final selection of thermal compound

  • Mechanical assembly with UV glue

    • UV.a) UV gluebasic tests

      • - test the gluing strength with kapton-glass samples to be glued on CFSS

      • - tests of ungluing

        - tests of clip mounting

         UV glue quantity and curing time

  • UV.b) irradiation tests

    • - test the UV glue before and after irradiation


  • LIST OF THERMAL COMPOUNDS


    FIRST TEST RESULTS

    • TC.a) Preliminary adhesion tests

      • test of adhesion for thermoplastic adhesive

      •  easy to handle, but very difficult to get a good contact in working conditions (low pressure, air ). Problems to reach the polymerization temperature  rejected

  • TC.b) Thermal conductivity measurements

    • Measurement of thermal conductivity of a 0.1 mm thick adhesive layer for glues and greases

    •  see next slides

  • UV.a) UV glue basic tests

    • first trial of assebly and unassembly with UV glue

    •  see next slides


  • THERMAL CONDUCTIVITY TESTS (I)

    Let be:

    DISC 1 at T1

    DISC 2 at T2

    R dissipating a power W

    x the thickness of the glue

    A the area of the glue

    W = k A (T1 -T2) / x

    k = x W / (T1 - T2)A

    •T from R(PT100) and tables (0.387 W / K)

    • Corrections for power dispersion and thermal resistance between PT100 sensors applied


    THERMAL CONDUCTIVITY TESTS (II)

    expectedDT/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm2 thermal contact window


    FIRST UV GLUE TESTS (I)

    The tooling for UV gluing tests in Padova is almost ready...


    FIRST UV GLUE TESTS (II)

    ... meanwhile, some hand-made trial:


    WHAT NEXT

    • TC.b) thermal conductivity measurements:

      • completed

    • TC.c) glue spreading tests:

      • mechanics for tests just completed; starting soon

    • UV.a) UV glue tests:

      • first assembly and unassembly trials with clips done; mechanics for tests just completed; starting soon more quantitative tests

    • TC.d) thermal contact reliability tests w.r.t. thermal cycle:

      • mechanical setup and heaters defined, to be realized

    • TC.e) test of compatibility with Bari glue:

      • setup to be defined

    • TC.f/UV.b) irradiation tests with best candidate(s):

      • setup for both thermal adhesive and UV glue: to be defined


    THE END


    INVENTARIO

    More electronics and mechanics for tests


  • Login