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Founded in February 1998. (Spin-off from Samsung Semiconductor)

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Founded in February 1998. (Spin-off from Samsung Semiconductor). Public Company in Korea since Dec,2002 (KOSDAQ). Business Units. SIP Division- Flash Memory Cards, MCP/SiPs ASSP Div – 20 Partners from USA/Europe/Taiwan ASIC Division: Design Center for Fujitsu ASIC. Locations.

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slide2

Founded in February 1998. (Spin-off from Samsung Semiconductor)

Public Company in Korea since Dec,2002 (KOSDAQ)

Business Units

  • SIP Division- Flash Memory Cards, MCP/SiPs
  • ASSP Div – 20 Partners from USA/Europe/Taiwan
  • ASIC Division: Design Center for Fujitsu ASIC

Locations

  • HQ & Factory in Yong-In City, Kyunggi-Do(SiP Div)
  • ASSP & ASIC Div in Seoul
  • Branch Offices in Gumi, Kwang Ju, HK
  • Paid in Capital : US$ 6.48 million.
  • Employee : 220 People as of Sep, 2008.
  • Yearly Revenue

US$80M in CY2006, US$92M in CY2007, US$110M in CY2008,

US$150M in CY2009

slide3

Total Solution Provider as Packaging in House : SIP Division

  • SIP Division

Produce Flash Memory Cards in Volume(3Mu-5Mu/Month)

For MCP/SiP : Packaging Production Lines + Well Experienced Packaging Engineers

+ System Application Engineers(Hardware Engineers/Firmware Engineers)

  • Global Partners

Memory Suppliers, SOC Suppliers, Test Houses

  • Professionalism
  • Enthusiasm, Creative & Aggressive
  • Communicate well in English
  • Well Experienced Management for Semiconductor
  • Good Relationship & Sales Revenue with Major
  • Customers (Lexar, Samsung, LG, Fuji Film, Softbank etc)
slide4

IC Packaging R&D, Manufacturing :Flash Memory Cards , MCPs , SIPs UFDs ,

Specialty Packages

SIP

Div

Representative & Distributor for

ASSP & SoCs Sales & Marketing

Application Engineers Supports

Turn-key Designs 4 Offices

ASSP

Div

ASIC

Div

ASIC Design Center For

Fujitsu Foundry/COT EASIC

slide5

CEO

SIP Div.

ASSP Div.

ASIC Div.

Manufacturing/ Equipment/

Production Control

Application

Engineers

Planning /

Finance

ASIC

Engineers

Production

Package Design /System/

Test Dept.

R&D

Packaging

Sales &

Marketing

Planning / Finance

/ Account Dept.

ASIC

Marketing

Production I Process

Engineering Dept.

Seoul / Gumi Office,

CS, Sales & Marketing

Engineering

IQC / PQC / QA / AS Part,

Spec. Center

Quality &

Reliability

  • SIP : System in Package
  • ASSP : Application Specific Standard Product
  • ASIC : Application Specific Integrated Circuit
  • Employee : 220 People

Global Sales & Marketing,

Forceasting

Sales &

Marketing

Purchase / HR/

Administration Dept.

Administration

slide6

Seoul

Barun

Electronics

Incheon

Yongin

Barun Electronics

Manufacturing/R&D :YongIn, Kyunggi- Do.

Seoul Office : YanJae Dong, Seoul

Local Sales office : Gumi, Kwang Ju

Oversea Branch office : HongKong, Japan, USA

Gumi

Kwang ju

slide7

(UNIT : M$)

25.0%

30.1%

12.6%

2006

2007

2008

2009

slide9

분기별 실적 추이

* 단순합산

주1)

(단위 : 백만원)

주1) 당사는 08년8월19일자로 ㈜젠코아와 합병하였고, 기업합병회계준칙에 따라 합병전 바른전자의 실적은 포함되지 않습니다.

기공시된 3분기 누적 매출액과 영업이익은 각각 376억원과 20억원입니다. 상기 자료는 합병에 따른 양사의 단순합산 실적을 표기한 것입니다.

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