Development done on device bonder to address 3d requirements in a production environment
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Development done on Device Bonder to Address 3D Requirements in a Production Environment. Pascal Metzger , Joseph Macheda : SET Michael D. Stead, Keith A. Cooper : SETNA 131 impasse Barteudet , Saint-Jeoire, Haute-Savoie, France. Presentation Outline. Introduction : Why 3D ?

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Development done on device bonder to address 3d requirements in a production environment
Development done on Device Bonder to Address 3D Requirements in a Production Environment

  • Pascal Metzger, Joseph Macheda : SET

  • Michael D. Stead, Keith A. Cooper : SETNA

  • 131 impasse Barteudet, Saint-Jeoire, Haute-Savoie, France


Presentation outline
Presentation Outline in a Production Environment

  • Introduction : Why 3D ?

  • Some recalls on processes

  • Consequences on Design of equipment

  • Summary


3d stacking
3D Stacking in a Production Environment

  • 3D Stacking permits to integrate more functions in reduced space


3d assets
3D Assets in a Production Environment

  • Reduced path between layers / functions

    • Reduced R, C and L

      • Lower electrical consumption

      • Longer autonomy

      • Higher bandwidth

      • Less sensitive to electromagnetic interferences

      • Reduced utilization of noble materials


3d assets1
3D Assets in a Production Environment

  • Reduced volume

    • Reduced size, thickness and weight of devices

    • Less fragile

    • Better ergonomics


3d challenges
3D Challenges in a Production Environment

  • Heat management inside IC

  • Precision

  • Cycle time


Presentation outline1
Presentation Outline in a Production Environment

  • Introduction : Why 3D ?

  • Some recalls on processes

  • Consequences on Design of equipment

  • Summary


Explored processes
Explored Processes in a Production Environment

  • Aluminum microtubes

    • Room temperature process

    • 106 connections at a 10 μm pitch

Source CEA-LETI


Explored processes1
Explored Processes in a Production Environment

  • Molecular attachment

    • Room temperature process

    • Direct Cu-Cu bonding

    • High cleanliness requirements

Source CEA-LETI


Explored processes2
Explored Processes in a Production Environment

  • Hybrid collective bonding

    • Thermocompression Cu-Cu bonding

Source College of Nanoscale Science and Engineering


Explored processes3
Explored Processes in a Production Environment

  • Solder composition

    • Thermal tacking and single re-flow step

Source Institute of Microelectronics, A*STAR


Presentation outline2
Presentation Outline in a Production Environment

  • Introduction : Why 3D ?

  • Some recalls on processes

  • Consequences on Design of equipment

  • Summary


Consequences on design of equipment
Consequences in a Production Environmenton design of equipment

  • For R&D, the same equipment can drive several different processes

  • For production, especially HVM, specialization may not be avoided to optimize the cycle time


Qualification method

Top reticule in a Production Environment

Microscope

Bottom reticule

Qualification method

  • Architecture


Qualification method1
Qualification method in a Production Environment

  • Test vehicles = Quartz chip with verniers

Both (Mixed)

Chip (Top)

Substrate (Bottom)


Qualification method2

Top reticule in a Production Environment

Microscope

Bottom reticule

Qualification method

  • Cycle

    • Pick up

    • Alignment

    • Contact

    • Bonding

    • Post Bond measurement

    • Repeat


Thermal influence
Thermal influence in a Production Environment

  • Cycle at 21°C  ± 0.4 µm


Thermal influence1
Thermal influence in a Production Environment

  • Cycle at 200°C  ± 0.6 µm


Thermal influence2
Thermal influence in a Production Environment

  • Cycle at 200°C (perturbation)  ± 1 µm


Thermal influence3
Thermal influence in a Production Environment

  • No thermal gradient within a plate


Thermal influence4
Thermal influence in a Production Environment

  • Thermal gradient within a plate


Thermal influence5
Thermal influence in a Production Environment

  • Thermal gradient within a plate


Thermal influence6
Thermal influence in a Production Environment

  • Mismatch between CTE

  • Example Ø 100 mm wafers of SiO2 and Si

µm

°C


Presentation outline3
Presentation Outline in a Production Environment

  • Introduction : Why 3D ?

  • Some recalls on processes

  • Consequences on Design of equipment

  • Summary


Summary
Summary in a Production Environment

  • Several parameters, especially temperature, play a key role in final precision of assembly.

  • For HVM environment, cycle time is one of the most important parameter.

  • For 3D applications in HVM requiring high precision, the process will influence both precision and cycle time.


Summary1
Summary in a Production Environment

  • The design of the equipment, choice of materials, control of environment will be influenced by process.

  • Trade off in versatility, cost and stability may be necessary.

  • What will be the precision, the throughput, the process which will be used ? These are crucial questions.

  • Thanks to SET team


Thank you for your kind attention www set sas fr
THANK YOU FOR YOUR KIND ATTENTION in a Production Environment www.set-sas.fr


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