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Development done on Device Bonder to Address 3D Requirements in a Production Environment. Pascal Metzger , Joseph Macheda : SET Michael D. Stead, Keith A. Cooper : SETNA 131 impasse Barteudet , Saint-Jeoire, Haute-Savoie, France. Presentation Outline. Introduction : Why 3D ?

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development done on device bonder to address 3d requirements in a production environment
Development done on Device Bonder to Address 3D Requirements in a Production Environment
  • Pascal Metzger, Joseph Macheda : SET
  • Michael D. Stead, Keith A. Cooper : SETNA
  • 131 impasse Barteudet, Saint-Jeoire, Haute-Savoie, France
presentation outline
Presentation Outline
  • Introduction : Why 3D ?
  • Some recalls on processes
  • Consequences on Design of equipment
  • Summary
3d stacking
3D Stacking
  • 3D Stacking permits to integrate more functions in reduced space
3d assets
3D Assets
  • Reduced path between layers / functions
    • Reduced R, C and L
      • Lower electrical consumption
      • Longer autonomy
      • Higher bandwidth
      • Less sensitive to electromagnetic interferences
      • Reduced utilization of noble materials
3d assets1
3D Assets
  • Reduced volume
    • Reduced size, thickness and weight of devices
    • Less fragile
    • Better ergonomics
3d challenges
3D Challenges
  • Heat management inside IC
  • Precision
  • Cycle time
presentation outline1
Presentation Outline
  • Introduction : Why 3D ?
  • Some recalls on processes
  • Consequences on Design of equipment
  • Summary
explored processes
Explored Processes
  • Aluminum microtubes
    • Room temperature process
    • 106 connections at a 10 μm pitch

Source CEA-LETI

explored processes1
Explored Processes
  • Molecular attachment
    • Room temperature process
    • Direct Cu-Cu bonding
    • High cleanliness requirements

Source CEA-LETI

explored processes2
Explored Processes
  • Hybrid collective bonding
    • Thermocompression Cu-Cu bonding

Source College of Nanoscale Science and Engineering

explored processes3
Explored Processes
  • Solder composition
    • Thermal tacking and single re-flow step

Source Institute of Microelectronics, A*STAR

presentation outline2
Presentation Outline
  • Introduction : Why 3D ?
  • Some recalls on processes
  • Consequences on Design of equipment
  • Summary
consequences on design of equipment
Consequenceson design of equipment
  • For R&D, the same equipment can drive several different processes
  • For production, especially HVM, specialization may not be avoided to optimize the cycle time
qualification method

Top reticule

Microscope

Bottom reticule

Qualification method
  • Architecture
qualification method1
Qualification method
  • Test vehicles = Quartz chip with verniers

Both (Mixed)

Chip (Top)

Substrate (Bottom)

qualification method2

Top reticule

Microscope

Bottom reticule

Qualification method
  • Cycle
    • Pick up
    • Alignment
    • Contact
    • Bonding
    • Post Bond measurement
    • Repeat
thermal influence
Thermal influence
  • Cycle at 21°C  ± 0.4 µm
thermal influence1
Thermal influence
  • Cycle at 200°C  ± 0.6 µm
thermal influence2
Thermal influence
  • Cycle at 200°C (perturbation)  ± 1 µm
thermal influence3
Thermal influence
  • No thermal gradient within a plate
thermal influence4
Thermal influence
  • Thermal gradient within a plate
thermal influence5
Thermal influence
  • Thermal gradient within a plate
thermal influence6
Thermal influence
  • Mismatch between CTE
  • Example Ø 100 mm wafers of SiO2 and Si

µm

°C

presentation outline3
Presentation Outline
  • Introduction : Why 3D ?
  • Some recalls on processes
  • Consequences on Design of equipment
  • Summary
summary
Summary
  • Several parameters, especially temperature, play a key role in final precision of assembly.
  • For HVM environment, cycle time is one of the most important parameter.
  • For 3D applications in HVM requiring high precision, the process will influence both precision and cycle time.
summary1
Summary
  • The design of the equipment, choice of materials, control of environment will be influenced by process.
  • Trade off in versatility, cost and stability may be necessary.
  • What will be the precision, the throughput, the process which will be used ? These are crucial questions.
  • Thanks to SET team
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