Slhc strip tracker module envelopes
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sLHC Strip Tracker Module Envelopes. (Tim) WP4 Meeting Glasgow, 13 th June 2011. Overview. Development of engineering d esign for s tave layout requires knowledge of likely stave core thickness. Components Core Dimensions outer dimensions, bus-tape to bus-tape Core Envelope

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sLHC Strip Tracker Module Envelopes

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Slhc strip tracker module envelopes

sLHC Strip Tracker Module Envelopes

(Tim)

WP4 Meeting

Glasgow, 13th June 2011


Overview

Overview

  • Development of engineering design for stave layout requires knowledge of likely stave core thickness.

  • Components

    • Core Dimensions

      • outer dimensions, bus-tape to bus-tape

    • Core Envelope

      • Twists, bows local ‘roughness’, thermo-mechanical deformations

    • Module-to-tape adhesive

    • Module Envelope

  • Module Envelope

    • Use experience from ABCN25’s with likely extrapolation to ‘final’ ABCN13 modules


Abcn25 module z heights

ABCN25 Module Z Heights

  • SmartScope survey of one hybrid glued to a sensor

    • Mount wire-bonding jig on SmartCcope and measure z-height

    • Locate module and establish vacuum

    • Measure z-heights of:-

      • Silicon wafer

      • Hybrid

      • ASICs

      • Wirebonds

      • Capacitors


Results

Results

  • Wirebonds

    • Intended difference in loop-height is 0.2mm

    • 4-row wirebonding establishes on LHCbVeLo Beetle ASICs – 0.2mm bond height difference maintained.

    • Expect 4-row ABCN13 wirebonding to be similargiving wirebond height of 0.8mm above ASICs

    • Total height = 1.30 + 0.80 = 2.21mm

  • Capacitors

    • Measured height = 2.17 above local hybrid height of 0.65mm

    • Hybrid unsupported so measured height affected

    • Corrected height = 2.17 + 0.8 - 0.65 = 2.32mm


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