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PERIPHERALS AND MOTHERBOARD FOR THE BASIC STAMP

PERIPHERALS AND MOTHERBOARD FOR THE BASIC STAMP. By: Josh R. Fairley Advisor: Dr. Raymond S. Winton. PURPOSE.

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PERIPHERALS AND MOTHERBOARD FOR THE BASIC STAMP

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  1. PERIPHERALS AND MOTHERBOARD FOR THE BASIC STAMP By: Josh R. Fairley Advisor: Dr. Raymond S. Winton

  2. PURPOSE • The purpose of this project is to design a set of motherboard core and peripheral modules for high-throughput applications to be implemented in grades 7 – 12 and in senior electrical engineering laboratories.

  3. OBJECTIVE 1. ELECTRICALCOMPONENTBEHAVIOR 2. ELECTRICAL ENGINEERING DESIGN STRATEGIES 3. TECHNICAL SKILLS

  4. GOALS • TO DEVELOP AN EFFICIENT ENVIRONMENT THAT WILL PRODUCE: UNDERSTANDING OF ELECTRICAL CIRCUIT BEHAVIOR WORKING PROTOTYPES FOR A LARGE VARIETY OF PROJECTS

  5. Requirements • Modularity • Manufacturing • Physical Packaging • Reliability

  6. Design Strategy • Use Stamp as Foundation Controller for multiple peripheral modules • Use communication between Stamps to increase complexity of a project • Create condensed packaged Motherboard/Module demo’s

  7. Foundation Controller • Output Current for I/O pins for Stamp I/II • DOS based application to interface BSI • Programming Languages • Memory Size • I/O pins • Port interface between PC/Basic Stamp

  8. Foundation Controller

  9. Motherboard

  10. Stamp Communication • Serin program command • Hardware implemented for communication process

  11. Test Specification • Size Dimensions • Component Reliability • Code Functionality • Overall System Test

  12. Packaging • Transport Circuit Design to PC Board • Package multiple demo’s into one overall storage unit

  13. 7-Segment Module

  14. LED Module

  15. Dipswitch Module

  16. MotherBoard/Module Demo’s FOUNDATION: BASIC STAMP II MICROCONTROLLER PERIPHERALS: DISPLAYS TRANSDUCERS STEPPERMOTORS SERVOMOTORS THERMISTORS LED’S

  17. Stamp/Module Costs • Source: Hosfelt Electronics, Inc 888-264-6464 • or 800-524-6464 • Catalog 99R customer #397M12 • page stock# item ea quan tot • 47 51-393 DIP switch w/rocker actuator $.85 20 $17.00 • 82 42-104 Solderless breadboard $10.95 10 $109.50 • 105 13-398 Minature speaker $.99 20 $19.80 • 117 25-350 3mm Red LED $.12 200 $24.00 • Tot $170.30

  18. Continued Cost Analysis • HOSFELT ELECTRONICS, INC Catalog 99B Cust #397M12 (MSU-ECE) • Page Part no quan item ea tot • 28 80-243 2 pkt #65 carbide drills $3.25 $6.50 • 28 80-247 2 pkt #53 carbide drills $3.25 $6.50 • 47 51-334 20 mercury tilt switch $.75 $15.00 • 67 7406 50 Hex inverter $.39 $19.50 • 72 42-194 8 4"X6" PC board $5.99 $47.92 • 86 21-267 100 16-pin DIP socket $.08 $8.00 • Total: $103.42

  19. Continued Cost Analysis • page stock# item ea quan • 62 AO2047-ND 9-pin D-sub connector, female $2.15 25 53.75 • 62 AO245-ND 25-pin D-sub connector, male $3.02 25 75.50 • 224 ZHB6718CT-ND H-bridge $3.76 20 75.16 • 384 KC003T-ND Minature thermistor $2.43 20 48.64 • Tot $253.05

  20. Continued Cost Analysis • page cat# item size $ea quan $tot • /cclad-s.htm S1-36G 1/16" FR4 glass epoxy • with 1 oz copper foil 3x6 $12.20 10pkg 122.00 • /chemphot.htm • KD-1G type-S Develop soln 1Gal $32.90 1 32.90 • PRSK-1G type-S Stripper 1Gal $92.45 1 92.45 • /chemetch.htm#Ferric Chloride • E-1G Ferric Chloride 1Gal $20.80 1 20.80 • FSB-500 Scotchbrite pad 12x24 $21.00 1 21.00 • /chemplat.htm • ITP-1QT Immersion Tin plate 1qt $23.80 2 47.60 • tot $336.75

  21. Continued Cost Analysis • BS1-IC BASIC stamp 1 @$30.60 ea quan 15 • tot = $459, S&H not included.

  22. Test Certification • Manufacturing of Printed Circuit Boards • Component Choice • Code Functionality • System Test

  23. Conclusions • Success was achieved for project implementation for grades 7 – 12 • Shortcoming: Did not construct projects of appropriate complexity for senior design electrical engineering laboratories

  24. Future Progress • Continued design and manufacturing of motherboard/peripheral module demo’s to be implemented in senior level electrical engineering laboratories

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