Changing the Paradigm of Automated X-Ray Inspection XStation MX

1. Changing the Paradigm of Automated X-Ray InspectionXStation MX Peter Edelstein AXI Product Manager Peter.Edelstein@Teradyne.com May 9, 2007

2. Agenda • Industry Trends And Resulting Issues • Current And Future X-ray Technologies • Teradyne’s 3D X-ray Approach • XStation MX Detection Capability • XStation MX – Z-Find and Enhancements • Summary

3. Drivers for Automated X-Ray Inspection Increased Product Quality Requirements Loss Of Visual Access Increasing Board Complexity Automated X-Ray Inspection Loss Of Electrical Access BGA Usage High Frequency Nets LeadFree IPC

4. Technology Challenges • AOI - No Visual Access to the BGA Connections • ICT - No Access to Parallel Capacitors, Multiple VCC and GND pins on BGAs • ICT - Loss of net access due to component density • 3D X-Ray allows for full inspection of double sided boards • Laminographic 3D X-ray systems resolve the coverage issues with AOI and 2D X-ray but exhibit high false call rates and poor reliability • MXI and 2D X-Ray will see components on the opposite sides of the boards as defects limiting defect coverage

5. X-RAY AOI ICT Solder Joint Feature Measurements • Algorithms extract solder joint features to determine: • Width (Sub-Pixel Accuracy) • Heel Solder • Toe Solder • Pad Solder • Fillet Shape / Slope • Side Fillet Shape • Length + Many More GULLWING SOLDER JOINT X-Ray Image Heel Fillet Side Fillets Toe Fillet Heel Fillet Toe Fillet Side Fillet 3D Solder Joint Profile

6. AOI AXI Lifted Leads Parallel Components Shorts, OpensBridgesComponent Presence, Absence Comp.Polarity,Wrong Part HiddenJoints Component ValueComponent Operation ICT ICT and AXI Each Have Unique and Overlapping Fault Coverage Strengths ICT and AXI have overlapping and unique abilities to test for component“structural”vs.“operational”defects. AOI has only overlapping capabilities. Solder Quality Hidden Joints VCC/GND pins Voids Cosmetic DuplicateCoverage/Cost

7. XStation MX Compliments The Value Of ICT & Extends The Life Of Your Existing Systems • Increased Coverage Reduces Manufacturing Costs By Increasing the Yield to Functional Test While Reducing Scrap from un-detected defects. • Adding AXI on average improves joint coverage by ~30% and component coverage by ~25%.

8. Current and Future X-ray Technologies

9. MXI - Transmission – Pseudo 3D PCBA PCBA Limitations of MXI & Semi-Automated AXI • Throughput • Only sample tests can be performed • High False Fail Rates Above 3000 – 10,000 ppmJ • Angled views are described as 3D, but still have obscuration issues • 7-axis manipulation and low accuracy of motion • Manual Programming Tools Static Detector

10. Laminography - 3D High False Fail Rates Above 3000 – 10,000 ppmJ Low Resolution at Large FOV Uses Averaging to Reconstruct Images Inaccurate Mechanical Motion Induces Errors Low uptime Mechanical Complexity PCBA Limitations of Laminography Laser Rotating X-Ray Source Board movement in Z to converge on focal plane Rotating Detector (1000 RPM)

11. Teradyne’s 3D X-ray Approach

12. PCBA Static Detector Static X-Ray Source Static Board Measurement Methods • High Quality Imaging • High resolution at large FOV to inspect 0201’s • Uses computational techniques to reconstruct images – No blurring • Typically less than 500 ppmJ False Fail Rates • Removal of mechanical errors and averaging • Static image capture increases image quality • No moving parts during image capture • Allows for TraX 2D inspection • Highest Quality Images • Up to 6 Sq inches per second throughput ClearVueTM - 3D

13. XStation MX Detection Techniques:TraXTM High-Speed Transmission X-Ray Detector Large FOV High-Speed Transmission Image PCB Transmission X-Ray source The detector is area is divided into a single region, each region is now a FOV

14. 4.4” A B A Range used 23o - 41o 2.2” XStation MX Detection Techniques:ClearVueTM Image Reconstruction Detector PCB Transmission X-Ray source The detector area is divided into 9 regions, each region is 1/9 of a particular FOV

15. X T T B B Z B T T B T B B B B T T T ClearVue Slicing Capabilities

16. Top Slice Pad Slice T T T T T T B B B B B B Bottom Slice B B B T T T T T T B B B T T T B B B B B B B B B B B B T T T T T T T T T ClearVue Provides Clear Accurate Slices T B B T Objects at different elevations move by different horizontal distances allowing for automated Z height detection “Max Value” algorithm removes artifacts

17. XStation MXDetection Capability

18. XStation MX – High Fault Coverage • Designed for manufactures that have quality as their number 1 priority. Provides the highest level of defect detection of any test or inspection solution. • Allows for boards up to 18” x 20” to be inspected in a single pass with automated in-line operation. Fully Automated Defect Detection ClearVue 3D X-Ray TraX 2D X-Ray

19. Capacitor In this slice all bottom-side components have been removed Looks Like Short with 2D X-Ray BGA Ball Resistor Test Point XStation MX Provides Maximum Fault Detection and Lowest False Call Rates. • By Providing High Resolution Without Loss Of Original Image Information • All Defect Types Can Be Located. ClearVue 2D

20. Example ClearVue Defect Detection

21. XStation MX Z-Find and Enhancements

22. How Does XStation Find the Correct Slice to Inspect? • For most solder joints the optimal joint elevation is the pad level where the lead of a device touches the copper layer on the PCB. • For BGAs the optimal joint elevation is the equator of the ball • Z-Find is the task that estimates the optimal joint elevation to inspect a solder joint by: • synthesizing multiple slices (typically 20 to 30) across a ROI over a range of heights • plotting the profile of amount of solder over the z elevation

23. Z-Find Profile Example – Fine Pitch QFP

24. Z-Find Process Visualized TOP SLICE Signature Top Slice Bottom Slice BOTTOM SLICE Z Elevation

25. Enhanced Z-Find • Z-Find works best when given a small range to search over, approximately 10-20 mils • Bare boards can be warped by up to 1% of their diagonal size ( No limit for loaded boards) • For a 10”x10” board, that’s almost 75 mils at the center

26. Enhanced Z-Find • 100 or more measurements made per move • A new software task determines the board surface from the data: • Correlate the measurements with the X-ray views • Smart enough to filter presence of parts on the board • Will interpolate if data for a view is unavailable • Still no need for a special mapping procedure; the mapping occurs in parallel with the inspection

27. Other Performance Enhancements • Reduced Programming Time in the Production Environments • Image enhancement to improve fault detection • Increased the standard FOV with no loss of accuracy which allows for higher throughput

28. Summary

29. XStation MX – Automated X-Ray Inspection Software XFrame Programming Software XVer Repair Station Accurate Defect Detection, High Performance Automated In-LineX-Ray Inspection System.

30. Strength of XStation MX • XStation MX is the only Automated X-ray Inspection solution that deploys two patented* X-ray measurement techniques • 3D X-ray • The first is our Patented ClearVue 3D technique that allows for slicing from top to bottom side of the board at ~1 mil increments using a static imaging train • High Speed 2D X-ray • Our Patented TraX, Transmission X-ray solution provides full defect coverage on single sided boards at higher throughput than most AOI platforms • These techniques can be used in the same inspection program allowing the best fault coverage and throughputs to be achieved * Patents include: 6,748,046,4,809,308, RE35,423, EP 0236 001 and 5,541,856.

31. Summary – XStation MX Provides • Industry leading image quality • The Highest Fault Coverage to reduce DPMO rates and increase delivered quality • Lowest False Call Rates, reducing repair costs and increasing call accuracy • Multiple X-Ray inspection techniques • Allows for optimum throughput while retaining defect detection • Proven hardware and software lineage from our installed base • High MTBF’s and service coverage from Teradyne’s world-wide support network

32. Changing the Paradigm of Automated X-Ray InspectionXStation MX Peter Edelstein AXI Product Manager Peter.Edelstein@Teradyne.com May 9, 2007