1 / 7

E-beam Evaporation

E-beam Evaporation. Resistance-heating cannot achieve sufficient VP for high-melting point materials to achieve reasonable deposition rate. From Grovenor, Fig. 4.1, p. 180. E-beam Evaporation. Use an electron beam to provide the necessary heating.

wilma
Download Presentation

E-beam Evaporation

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. E-beam Evaporation • Resistance-heating cannot achieve sufficient VP for high-melting point materials to achieve reasonable deposition rate From Grovenor, Fig. 4.1, p. 180

  2. E-beam Evaporation • Use an electron beam to provide the necessary heating • A hot filament emits electrons by thermionic emission • The electrons are accelerated to the source through a potential difference of several to 15 kV • The electrons are steered by a B-field via the Lorentz force to strike the material to be evaporated from Mahan, Fig. V.2(a), p. 116

  3. E-beam Evaporation from Mahan, Fig. I.3, p. 3

  4. E-beam Evaporation from Ohring, Fig. 3-12, p. 100

  5. E-beam Evaporation from Ohring, Table 3-3, p. 102

  6. E-beam Evaporation from Ohring, Table 3-3, p. 103

  7. E-beam Evaporation • Advantages : • Electron K.E. is transferred as heat to the evaporant causing it to locally melt; this avoids contamination from the container • Hot crucibles are not in the line of sight of the substrate • Disadvantage : • Energetic electrons and x-ray radiation may damage some films so sputtering or CVD has replaced e-beams for some applications (e.g., MOS devices)

More Related