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Autonomous On-Wafer Sensor Arrays. SFR Workshop November 8, 1999 Mason Freed, Kameshwar Poolla, and Costas Spanos Berkeley, CA.

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autonomous on wafer sensor arrays

Autonomous On-Wafer Sensor Arrays

SFR Workshop

November 8, 1999

Mason Freed, Kameshwar Poolla, and Costas Spanos

Berkeley, CA

This project involves the incorporation of sensors, a communication system, and a power supply onto a standard silicon wafer, for the purpose of supplying wafer-state information during a process step.

overview
Overview
  • Motivation
    • Certain wafer-state variables are difficult or destructive to measure, and many are impossible to measure in real-time
    • Add-on in-situ measurement devices are costly and cumbersome
  • Proposal: distributed sensor array on a wafer
test case etch rate
I

I

Poly-Si

V

Test-Case: Etch Rate
  • Polysilicon etch rate sensors based on van der Pauw probe electrical film-thickness measurement:
  • Use wired connections for power and communications
  • Initial testing in XeF2, an isotropic, gaseous etchant
    • No problem making connections to wafer
    • No electrical or physical isolation necessary
design 1
Design #1
  • Connections made using “edge-board” connector:

Sensors

Edge-board connector

results design 1
Results (Design #1)
  • Eleven etch cycles performed, interferometric thickness measurements made between each cycle.
  • Repeatability:  12.89 Å
  • Accuracy:  45.9 Å
  • Stability: 3.2 Å drift in 15 minutes.
design 2
Design #2

Temperature-referenced Sensors

Surface mount multiplexers

Edge-board pads

results design 2
Results (Design #2)
  • Preliminary test of a single sensor only, during etch
progress vs milestones
Progress vs Milestones

Year 1

  • Demonstrate tethered, real-time etch-rate measurements in chemical, non-plasma etch. (Done)

Year 2

  • Demonstrate un-tethered real-time measurements with integrated power and data processing. (Work in progress)
future work
Future Work

Next Year

  • Conduct testing of new sensor design.
  • Research isolation schemes to allow operation in plasma conditions.
  • Work on integrating power and communications modules onto sensor wafer, for wireless operation.

2000-2002

  • Develop additional integrated sensors for plasma.
  • Develop sensors for other processes (DUV resist processing, Rapid Thermal Processing steps.)
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