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THEMIS Electric Field Instrument (EFI) Mission CDR The THEMIS EFI Team

THEMIS Electric Field Instrument (EFI) Mission CDR The THEMIS EFI Team. Outline. Personnel and Organization Summary of EFI Status at MCDR Requirements, Specifications, and Design Compliance Requirements Top-Level Design Error Budgets Status of Subsystem Design, Fabrication, and Testing

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THEMIS Electric Field Instrument (EFI) Mission CDR The THEMIS EFI Team

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  1. THEMIS Electric Field Instrument (EFI) • Mission CDR • The THEMIS EFI Team

  2. Outline • Personnel and Organization • Summary of EFI Status at MCDR • Requirements, Specifications, and Design Compliance • Requirements • Top-Level Design • Error Budgets • Status of Subsystem Design, Fabrication, and Testing • Fabrication, Integration, and Test • Schedule: Henry Ford Help Us… • Operations Planning • Deploy and Commisioning • Etc.

  3. Personnel and Organization • Organizational Chart (all UCB unless noted): • Prof. F. Mozer (EFI Co-I). • Drs. J. Bonnell, G. Delory, A. Hull (Project Scientists) • P. Turin (Lead ME), Dr. D. Pankow (Advising ME) • B. Donakowski (EFI Lead ME, SPB, Facilities) • G. Dalton (SPB, EFI GSE ME), K. McKee (ME), S. Martin (MT) • R. Duck (AXB ME) • D. Schickele (Preamp, Sensor Cables, Facilities ME) • S. Grimmer, R. Gupta (ME GSRs) • S. Jelinsky, S. Marker (Facilities and TVAC Staff) • S. Harris (BEB Lead EE), H. Richard (BEB EE) • J. Lewis, F. Harvey (GSE) • Technical Staff (H. Bersch, Y. Irwin, H. Yuan, B. Dalen, N. Castillo) Wm. Greer (UCLA), et al.) • R. Ergun (DFB Co-I; CU-Boulder) • J. Westfall, A. Nammari, K. Stevens (DFB SysE, EEs; CU-Boulder) • C. Cully (DFB GSR; CU-Boulder)

  4. EFI Status at I-CDR • Requirements and Design: • The current EFI design meets Mission and Instrument requirements. • The design is complete. • One new requirement (CG positioning) has been imposed post-PDR. • Procurement: • All long-lead items have been procured in sufficient quantities to allow for ETU and initial FLT production: • EEE parts ordered; rad testing of required parts complete. • SPB and AXB mechanical items (custom wire cable, stacers, actuators, motors) are in-house, or on order with expected delivery on schedule for FLT build up. • FLT machining on order, with expected 25% fulfilment (1-1/2 SC of parts) by early July, and remainder by end of July. • Personnel: • Team is complete: • All design engineering positions filled. • One FT MT position filled Mar ’04; 0ne PT MT positions filled internally by personnel transitioning over from STEREO; two ME GSRs hired for summer and fall to support FLT production startup. • Assembly and Test: • ETUs of all major elements have been assembled and partially or largely tested. • Testing will be completed by July 2004.

  5. RFA and Design Trade Closure • RFAs from I-PDR, M-PDR, and I-CDR all responded to a/o closed out: • ESC Spec is on Rev. D1; includes detailed specs on the requirement and methods to achieve it; ESC roster developed in Feb ’04, allowing close collaboration between Swales and UCB on problem areas and mitigation techniques. • EMI Spec completed Mar ’04. • Detailed Instrument I&T plan under development as part of ETU Testing; synthesized from Polar, Cluster, etc. • Mechanical (INST-RFA 13, 14, 15, 19, 20, R03), and Electrical (INST-RFA 16AB, 17) arising from ICDR, as well as Internal Mechanical Review. • Open Design Trades from PDR closed out: • Boom lengths set at 50/40/7.67 meters tip-to-tip based on CBE of Probe mass properties and std. GSFC and UCB dynamic stability requirements and boom mode resonance keep-outs. • Ti-N chosen over DAG-213 for SPB sensor coating. • Heritage brushed motor chosen for SPB deploy. • Braid biasing selected, and Distal Braid length set at 3 m. • DAC implementation on BEB chosen (ADC5544), and bias offset range of +/- 40 V maintained. • EFI filters on DFB chosen to be Bessel-type.

  6. Mission Requirements

  7. Mission Requirements

  8. Mission Requirements

  9. Science Requirements

  10. Performance Requirements

  11. Performance Requirements

  12. EFI Board Requirements

  13. EFI Board Requirements

  14. EFI Boom Requirements

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