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Assembly and Packaging. Assembly and Packaging. 82 Members 22 present for Summer workshop Focus of activities for 2010 The only change to tables will be AP1: Difficult Challenges Preparation for 2011 with expanded coverage for: Medical electronics, 3D integration Interposers

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assembly and packaging1
Assembly and Packaging
  • 82 Members 22 present for Summer workshop
  • Focus of activities for 2010
    • The only change to tables will be AP1: Difficult Challenges
    • Preparation for 2011 with expanded coverage for:
      • Medical electronics,
      • 3D integration
      • Interposers
      • Automotive electronics
      • Optoelectronics
      • Printed electronics
      • Handling of thinned wafers and die
      • Embedded components
      • MEMS integration
    • Rewrite of the System in Package paper
  • Cross TWG coordination
    • Major collaborations include ERM, ERD, ESH, Interconnect, Design, Test
  • Coordination with other Roadmaps
    • iNEMI
    • CTR/MPC
    • JISSO
  • Difficult Challenges changing: 3D integration, new materials, more “Moore”
expanded coverage of emerging requirements for 2011 medical electronics
Expanded Coverage of Emerging Requirements for 2011:Medical Electronics
  • Medical electronics Categories to be addressed:
    • Portable medical electronics
    • Implantable medical electronics (Parkinson’s disease symptom control)
  • Selected Issues for Medical electronics
    • Power requirements: energy scavenging; wireless radiated power; batteries
    • Safety issues (voltage, biocompatibility, power delivery)
    • FDA certification
    • Reliability requirements
    • Environmental issues
    • Connectivity (wireless)
    • Optical components (cameras)
    • Microfluidics
    • Implantable micro-robotics
    • Sensors
    • MEMS
expanded coverage of emerging requirements for 2011 3d integration
Expanded Coverage of Emerging Requirements for 2011:3D Integration
  • Selected Issues for 3D Integration
    • Die stacking methods
      • Homogeneous stacking
      • Heterogeneous stacking
    • Test challenges for 3D
      • Test access
      • Test cost
    • Through silicon Vias
    • Thermal management for 3D structured
    • Power integrity
    • 3D SiP
    • Bonding methods
    • Codesign and simulation
expanded coverage of emerging requirements for 2011 interposers
Expanded Coverage of Emerging Requirements for 2011:Interposers
  • Selected Issues for Interposers:
    • Systems integration for 2D and 3D
    • Interposer features
      • Redistribution wiring
      • Passive networks
      • Thermal management
      • Stress management
    • Materials selection
      • Si
      • Ceramic
      • Glass
      • Organics
expanded coverage of emerging requirements for 2011 automotive electronics
Expanded Coverage of Emerging Requirements for 2011:Automotive Electronics

One side air cooling

Cooling on both sides

Liquid immersion cooling

  • Automotive electronics Categories to be addressed:
    • Internal combustion
    • Hybrid
    • All electric
  • Selected Issues
    • Communications (including optical networks)
    • Thermal management
      • In cabin
      • Hostile environments
    • Safety
    • Sensors
    • Controls for improved efficiency
    • Cost
expanded coverage of emerging requirements for 2011 thin wafer and die handling
Expanded Coverage of Emerging Requirements for 2011:Thin Wafer and Die Handling
  • Selected Issues for Thin Wafer and Die Handling
    • Testing: contactors with ohmic contact without damage
    • Holding mechanisms
      • Electrostatic chucks
      • Bernouilli chuck
      • Temporary bonding (sacrificial layer)
      • Vacuum chucks (porous ceramic chucks)
    • Dicing of thin wafer
    • Warpage
expanded coverage of emerging requirements for 2011 embedded components
Expanded Coverage of Emerging Requirements for 2011:Embedded Components
  • Embedded Component Categories to be addressed:
    • Active devices
    • Passive devices
  • Selected Issues for Embedded Components
    • Performance enhancement due to reduced distance between die and passives
    • Incorporation of additional functionality (heat pipes; wave guides)
    • Keep out area around embedded components
    • Charge source close to the die for current surge
    • Reduced size by placement of passives under die
    • Placement accuracy for small thinned die
    • 3D alignment tolerance for assembly
    • Improved resistance to shock
    • Thermal management
expanded coverage of emerging requirements for 2011 mems integration
Expanded Coverage of Emerging Requirements for 2011:MEMS Integration

Microfluidic pump

  • MEMS Integration Categories to be addressed:
    • Sensors
    • Accelerometers
    • RF Switches, Oscillators, and filters
    • Microfluidics
    • Optical
  • Selected Issues for MEMS Integration
    • Low stress interconnect between MEMS device and package cavities
    • Low cost, high reliability mechanical mounting
    • Electrical and environmental connections
    • low electrical parasitic interconnect
    • Low cost hermetic cavities
    • Stress management