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ISS Interlock Demand Planning Update

ISS Interlock Demand Planning Update. Foxconn March 2009. Key Messages. Volumes by Qtr: cycle over cycle changes 2FQ Quarterly Progress Additional Topics: AMD G6: DL385, BL495c, DL165 LVOs/Upsides Lucky Falls (SE1210): +200 in Apr (850), +500 in May (1000)

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ISS Interlock Demand Planning Update

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  1. ISS InterlockDemand Planning Update Foxconn March 2009

  2. Key Messages • Volumes by Qtr: cycle over cycle changes • 2FQ Quarterly Progress • Additional Topics: • AMD G6: DL385, BL495c, DL165 • LVOs/Upsides • Lucky Falls (SE1210): +200 in Apr (850), +500 in May (1000) • T2 launching 6/2 but supply chain ready 4/27 • Aligning launch to “ProLiant SL” launch w/ Spartan • Potential deals in May • Spartan Overview • Back up: Mar Interlock Volumes

  3. AMD G6DL385 / BL495c / DL165 • New gen which is really a processor “speed bump” • AMD Istanbul • Processor “drop-in” • Marketing branding “G6” to align to rest of G6 portfolio • Recent development • Targeting June/July launches • July HE, or “high efficiency” processors • Same chassis, PCA as G5 • No need to drive traditional G6 “transition risk volume” on Mod1/Mod0’s

  4. Spartan Overview • “ProLiant SL” new ProLiant product line: Scalable Line • PCA’s in 1U trays, in 2U shelf (enclosure) • Naming • Product Line: SL6000 • Product Families: • HP ProLiant SL170z G6: 1 T2 PCA per tray • HP ProLiant SL2x170z G6: 2 T2 PCA’s per tray • HP ProLiant SL160z G6: 1 DL160 G6 PCA per tray • Expected demand mix: • Potential demand spikes, SCI • Combined “ProLiant SL” Launch with T2 June 2nd

  5. ProLiant Product Line Groups ProLiant SL – category DL BL ML DL100 DL300 DL500 ML100 ML300 ProLiant Blades Integrity Blades Storage Blades Enclosures Networking Etc. SL1000 family SL6000 SL100 Servers Big series SL300 Servers Etc. Etc. Etc. SL320 Etc. SL170 Series Only 1 at launch SL160 5 20 August 2014 HP Confidential

  6. 2U Shelf/Enclosure • Features: • Support for (2) 2P (socket) server trays • Shared Fans, High Efficiency, N+1 Redundancy • 2U Shared Power • Support for 460W, 750W, or 1200W AC configurations • Full Hot Plug RPS, or ebrake RPS support • Multi-node Efficiency • Shared fan control • Power capping & measurement • Optional interface to Rack Control Unit • HP 10k G2 rack optimization • Bulk 10U rail system for lowest cost • 3rd Party rack support • Supports common DL100 rail High efficiency (92%) common slot power supplies Server Trays High efficiency N+1 Redundant Fans

  7. HP ProLiant SL160z

  8. HP ProLiant SL2x170z

  9. HP ProLiant SL170z

  10. Spartan Rack Integration NodeServiceability Rear View Front View Cable channel Optional Hot Plug Redundant PS

  11. Quarterly Volumes Upcoming Foxconn portfolio changes: • Gaining T2 and Spartan, 3FQ • Losing BL460c after G1, DL160/DL180 after G5

  12. 2FQ Progress - WW “Foxconn Total” includes G6 products.

  13. 2FQ Progress - EMEA “Foxconn Total” includes G6 products.

  14. 2FQ Progress - APJ “Foxconn Total” includes G6 products.

  15. 2FQ Progress - AM “Foxconn Total” includes G6 products.

  16. Back up Interlock Demand Volumes (Published on 3/5/09)

  17. Interlock Volumes - WW

  18. Interlock Volumes - AM

  19. Interlock Volumes - EMEA

  20. Interlock Volumes - APJ

  21. ISS Historical Trends- unit ships/qtr • Instability in market • Where are we in downturn? • Opportunity for market leadership • Market slowdown, with some areas showing accelerated growth • G6 driven uptick? January Plan February Plan

  22. ISS Server Planning Scenarios Low plan (green line) communicated to ODM’s 2/6, regional plan (blue line) remained higher Regions have since aligned to Q2 Some of Q3 and Q4 aligned, continued tie-outs with the regions Key Message: continue to execute to interlock

  23. Revised Demand Planning Interlock Volume Process Action taken week of 2/2 to reduce overall plan by approx 7-8% for Q2 Top down volume planning (GBU) Marketing Pricing Publish interlock volumes Transition Planning Generate LCVF Tie out process Detailed product line tie out with regions week of 2/16 Regions Bottom up product mix planning (regions) Bottom-up planning is difficult to coordinate because many different assumptions may be made across multiple groups/individuals. For example, there may be conflicting ideas across planners and/or regions about growth rates across businesses and overall rate of recessional decline, making the establishment of a consistent and integrated plan challenging.

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