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From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 20 PowerPoint Presentation
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From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 2009 PDE Workshop Tom Thurman (Ret.), Michael Benda Rockwell Collins Advanced Manufacturing Technology. Topics. About Rockwell Collins MBE Vision DFx

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slide1

From Paper Based Analysis to Model Based Analysis:

Applications of AP 210 at Rockwell Collins

April 29, 2009

NASA-ESA 2009 PDE Workshop

Tom Thurman (Ret.), Michael Benda

Rockwell Collins

Advanced Manufacturing Technology

slide2

Topics

  • About Rockwell Collins
  • MBE Vision
  • DFx
  • Paper Based Data Flow
  • Fiducial Example
  • Filled Via Example
  • Model Based Data Flow
  • Immersive Visualization
slide3

What Rockwell Collins Does

  • A Leading Supplier Of
    • Aviation Electronics
    • Airborne/Mobile Communication Systems
  • Roughly Equal Division Between Commercial And Military Sales

> 15 Manufacturing Locations

  • Primarily High Value, High Mix, Relatively Low Volume Products
  • Reliability, Flexibility, Reducing Lead Times Are Important
  • AP 203 & AP 210 Are Key Components Of Our Environment
slide4

Model Based Enterprise Environment

  • Attributes of the Model Based Enterprise (MBE):
  • Tools and processes are integrated through the application of standard information
  • All data abstractions for functional needs are accessible through data management interfaces
  • Performance verified with science based simulation environments and augmented by required physical testing
  • Knowledge captured and fed back through every stage of the life cycle

Integrated agile & flexible engineering, manufacturing, and operations characterized

by modeling, simulation, and optimization, utilizing common processes and

Integrated systems/tools/data standards across the extended enterprise.

design for x dfx
Design for X (DFx)
  • Vision: Design rules are implemented to allow early and consistent evaluations of new designs to identify and resolve issues prior to release for production
  • Rockwell Collins first release of DFx has been Printed Circuit Assembly (PCA) Design For manufacturability (DFm):
    • Abstraction of standard information from CAD data
    • Manufacturing rules are run against design data
    • Visual representation communicates to the design team
    • Developed in a collaborative environment
  • Second implementation of DFx is PCA Design For testability (DFt):
    • Same approach as DFm
  • Third implementation of DFx is DFm at the Line Replaceable Unit (LRU) level:
    • In process
design for manufacturability
Design for Manufacturability
  • Analysis of how Suited a PCA Design is for Manufacturing
    • Offline Process can be Run as Often as Needed During Design Process
    • Process Supports Balance Between Design and Manufacturing Needs
  • Native CAD Data
    • Artwork
    • Component Terminal Locations
    • Drill Location, Size
    • PCA Bill Of Material
    • Milling
  • Data Beyond Scope of Native CAD
    • Configuration Management (Product ID, Revision, Approvals, Date…)
    • Deleted/Replaced/Unpopulated Components in PCA
    • Fiducials
    • PCB Stackup
    • Assembly Panel (Tabs, Cutouts)
    • Standard Component Catalog Data
    • Component Manufacturing Properties
    • Component Manufacturing Classification
    • Textual Assembly Requirements
design for testability
Design for Testability
  • Analysis of how Suited a PCA Design is for Test
    • Extension of DFm
  • Data Added to DFm Data
    • Native CAD Data:
      • Component Reference Designations Realized in Printed Circuit Board (PCB)
      • Netlist
      • Component Placement in PCA
      • Component Terminal Locations in PCA
      • Land Locations in PCB
      • Connector Signal-Pin Outs
      • CAD-Defined Test Point Locations in PCB
    • Data Beyond Scope of Native CAD:
      • Special Symbols Realized in PCB
      • Tooling Hole Locations in PCB
      • Special Lands for Terminals, Jumpers, etc…
      • Special Test Point Locations in PCB
paper based data flow
Paper Based Data Flow

Product ID, Approvals

CM

Drawing Review

Native CAD; Basic geometry, Netlist

ECAD

Panel

Model

Material

Stackup

Model

Drawing Creation (Scripting with ECAD Tool)

Assembly

Requirements

Fabrication

Requirements

Requirements data

Product data

departmental specific encoding of domain specific features fiducial
Departmental Specific Encoding of Domain Specific Features: Fiducial
  • In the printed circuit card manufacturing domain, a Fiducial is a small mark included in a PCB used to align components
  • Fiducials are required to be included in a PCB design and must be identified to facilitate design review and Computer Aided Manufacturing (CAM) tools.
  • A Fiducial is represented in a Specific Design Department by a part with a name = “FIDUCIAL”. “FIDUCIAL” is not a material item so the originating Department filters any Bill Of Material (BOM) related data before publishing. Another Design Department may represent a Fiducial by assigning a name to some other CAD data type; the identification string varies.
  • Fiducial is a predefined feature data type in the layout view in AP 210. If a Department published BOM-related data from an AP 210 database, no filtering would be needed, because features are not parts, thereby reducing maintenance costs.
domain specific features sharing fiducial data between departments in a supply chain
Domain Specific Features: Sharing Fiducial Data Between Departmentsin A Supply Chain

Domain Specific

Features Data

(Out of Scope of

CAD Tool)

Domain Specific

Features Data

(In Scope of

CAM Tool)

Design Intent

CAD

TOOL

Native

CAD To

AP 210

Mapping

Departmental

Encoding To

AP 210

Mapping

AP 210 Data Set

AP 210

To CAM

Mapping

CAM

TOOL

CAD

Native

Data

Model

Departmental

Specific Encoding of

Domain Specific Features

in CAD

CAM

Native

Data

Model

departmental specific encoding of domain specific features filled via
Departmental Specific Encoding of Domain Specific Features: Filled Via
  • In the PCB manufacturing domain, a filled via is a small plated hole that is filled after the lamination process.
  • Filled vias may be included for various reasons.
  • A Filled Via is represented in a Specific Design Department by a user defined classification defined in the released drawing. The identification of the fill material is included in a note.
  • Filled_via is a predefined data type in AP 210.
  • Material_identification is a predefined data type in STEP that is related to the fill material through a predefined relationship in AP 210.
domain specific features analyzing filled via impact on product properties
Domain Specific Features: Analyzing Filled Via Impact on Product Properties

Display Filled Via

Impact

Design Intent

Filled via

Classes

Filled via

Material

CAD

TOOL

Native

CAD To

AP 210

Mapping

Departmental

Encoding To

AP 210

Mapping

AP 210 Data Set

AP 210

To Analysis

Mapping

Analysis

TOOL

Departmental

Specific Encoding of

Filled via, material

slide13

Model Based Data Flow

Component

Information

System

Product ID, Approvals

CM

(Daily)

Native CAD; Basic geometry, Netlist

ECAD

CIM

Global

Library

Panel

Model

Results

AP210 (P28)

Part Data

LKSoft Mapping Engine

Material

Stackup

Model

DFXpert Rules Engine

AP210 (P21)

Part &

Design Data

Assembly

Requirements

Fabrication

Requirements

Mapping

Specifications

Requirements data

Product data

Part data

slide14
Will Provide Advanced 3-D Visualization Including Domain Specific Features

Allow Designers To See How Everything Will (Or Will Not) Fit Together

Design Reviews Can Use Virtual Touchable Models

Immersive Visualization

3-D Component Models

AP

203

AP

210

AP

210

AP 210 Standard Model

SIMULATION

TOOL

14