FLOW-3D Microfluidics Enabling MEMS/NANO Performance

1. FLOW-3DMicrofluidicsEnabling MEMS/NANO Performance ™ ® FLOW-3D is a registered trademark of Flow Science, Inc.

2. A Growing Industry Proliferation of MEMS & Nanotechnology Will Continue to Increase BCC estimated the global market for nanotechnology products at nearly $9.4 billion in 2005 and over $10.5 billion in 2006, growing to about $25.2 billion by 2011 (an AAGR of 19.1% between 2006 and 2011) This figure includes established commercial nano-materials applications, such as carbon black filler for inkjet inks, nano-catalyst thin films for catalytic converters, and new technologies such as nano-particulate fabric treatments, rocket fuel additives, nano-lithographic tools, and nano-scale electronic memory.

3. A Growing Industry Proliferation of MEMS & Nanotechnology Will Continue to Increase The largest end-user markets for nanotechnology in 2005 were environmental remediation (33% of the total market), electronics (24%), energy (15%) and biomedical applications (5%). Electronics and biomedical applications have much higher projected growth rates than other applications over the next five years. As a result, the electronics share of the nanotechnology market should grow to over 50% by 2011, and biomedical applications' share to 8%. Environmental applications' share is expected to decline steeply to 13%, while energy's share falls to 9%.

4. A Growing Industry Investment in Microfluidics Technologies Will Continue to Increase The global market for microfluidic technologies was worth an estimated $2.9 billion in 2005. This figure should grow to $3.2 billion in 2006 and $6.2 billion by 2011, i.e., an average annual growth rate (AAGR) of 14.1% over the next five years. Inkjet printing is by far the largest application of microfluidics, is expected to account for slightly over half of the market. Smaller application segments, particularly chemical analysis and synthesis and proteomics are growing at a slower pace than healthcare-related applications. The market for defense and public safety applications should remain small throughout the forecast period.

5. A Growing Industry Leading MEMS/NANO Developers are Driving Improved Performance of Technology • Improving innovation of MEMS/NANO design and product development • Reducing cost of design and development • Improving time to market due to growing competitive landscape –MEMS/NANO commoditization rate is increasing • Improving speed to quality – iterations andredesign cause failure in product launch • Overcoming new design challenges andincorporating best practices in MEMS/NANO product development FLOW-3DUser

6. Need to Improve MEMS/NANO Development Leading MEMS/NANO Developers are Driving Improved Performance of Technology • Improving innovation of MEMS/NANO design and product development • Reducing cost of design and development • Improving time to market due to growing competitive landscape –MEMS/NANO commoditization rate is increasing • Improving speed to quality – iterations andredesign cause failure in product launch • Overcoming new design challenges andincorporating best practices in MEMS/NANO product development FLOW-3DUser

7. Design Challenges MEMS/NANO Process and Components are Rapidly Changing in Device Design, Processing and Application • Surface to-volume ratios are different in the micro world from what they are in the macro world • Micros are very thin and can be out of scale to the others • MEMS/NANO designers have to simulate fluids and how they are impacted by electronics, heat and structures • MEMS/NANO are getting smaller and more powerful - parts on the same siliconchip must also survive heat and electrical forces to adequately perform –increased power on a smaller surfaces requires different physics • Fluid damping effects can be 1000 times greater- figuring out how a devicemight move through a fluid • Bigger Variety of fluids needs to be created, especially in inkjet printers FLOW-3DUser

8. MEMS/NANO Performance Improvement Opportunities for Improvement • Although MEMS/NANO have been around for a number of years, with failure analysis support for production, packaging, testing, and field operation, the tools and techniques required to properly diagnose the root cause of failure need to be upgraded and designed specifically for MEMS/NANO failure mechanisms. • As the number of devices and applications grow, the MEMS/NANO failure analyst must become more diverse and multi-disciplinary in their knowledge base to properly diagnose the root cause of failure – particularly Microfluidics • Microfluidic MEMS/NANO are devices designed to interact with fluid-based systems.Devices such as pumps, valves, and channels have been designed andfabricated to transport, eject, and mix small volumes of fluid • The typical failure mechanism is thermal degradation. The effects ofelectrical/thermal cycling of these devices are currently underway.Overstress events have been shown to cause degradation by inducingpermanent deformation FLOW-3DUser

9. Challenges to Product Development Challenges to MEMS/NANO Performance Improvement • This class of MEMS/NANO offers the most difficulty for the failure analyst. Most of the tools and techniques currently used for failure analysis were leveraged from the IC industry, and were not designed to be used with fluids. • The challenges for the failure analyst include functional and structural analysis while maintaining device and tool integrity, fluid contamination and compatibility with MEMS/NANO and analytical tools, deprocessing, leak detection, and application of a diagnostic fluid for analysis. FLOW-3DUser

10. FLOW-3DMicrofluidics CFD Solutions for MEMS/NANO R&D, Product Design, Product Development and Manufacturing • Device simulation modules that perform detailed, multi-physics, multi-dimensional and transient Microfluidic simulations . • Microfluidic flow simulation modules are capable of simulating a comprehensive set of Microfluidic phenomena, supported by an array of best-in-class solvers • Microfluidic compact models in release include drop-on-demand inkjet nozzles, actuators driven by either thermal bubbles or piezoelectric diaphragms, internal flow elements that accommodate both single-phase and two-phase flow, electrokinetic separation channels and more. • Multi-physics simulation: FLOW-3D simulates coupled effects amonghydrodynamics, interfacial phenomenon, electrostatics, thermal analysisand more. Example effects are homogeneous nucleation, electrowetting,dielectrophoresis, volume and surface chemistry, electrokinetics,Joule heating, and flow through porous materials. • Accurate simulation--FLOW-3D offers state-of-the-art Volume-of-Fluidtechnology. It simulates free surfaces accurately accounting for sixdegrees of freedom in the liquid and gas phases and their interfaces FLOW-3DUser

11. Nozzle droplet ejection and exit surface wettability Thermal vapor bubble, nucleation, evaporation, condensation Diaphragm: rigid body dynamics Continuous inkjet - drop formation including impact of stimulation frequency Droplet electrostatic deflection - droplet selection and steering, multiple drop formation and mixing Fluid transport ducting, ink source to print head reservoir Liquid acoustics Droplet-surface impact, droplet spreading, recoiling, and splashing super-hydrophobicity Dielectrophoresis, electrowetting on dielectric, electrophoresis, electroosmosis, joule heating, electro-spray ionization Sample injection, mixing, chemical reaction, separation, and detection Capillary filling, pin spotting, surface wetting Microfluidic pumps, valves, and channel flows Large-signal fluidic damping Microvalves, flexible capillaries, micro fluidic pumps Fluid-diaphragm interaction Thin film coating Chip Cooling Thermal analysis, forced convection, free convection Inkjet printing basedlocalized cooling FLOW-3D Microfluidics FLOW-3D Can Improve MEMS/NANO Design Productivity in:

12. FLOW-3D Microfluidics Users