Passivation - PowerPoint PPT Presentation

MEMS DEVICE WAFER LEVEL PACKAGING TECHNICAL PRESENTATION

MEMS DEVICE WAFER LEVEL PACKAGING TECHNICAL PRESENTATION. Customer Device Wafer. TECHNICAL PROPOSAL FOR ULTRASOUND MEMS DEVICE WLP. Process Modification Required as follows:. Reduction of Bond pads to half of existing bond pads size.

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671 views • 20 slides

Optimization of Passivation for Mid and Long Wavelength InAs/GaSb Superlattice Photodetectors

Kelsey Poineau Research Advisor: Sid Ghosh. Optimization of Passivation for Mid and Long Wavelength InAs/GaSb Superlattice Photodetectors. Infrared Detection. Any object at non-zero temperature emits heat (electromagnetic radiation)

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174 views • 14 slides

Basic Idea: Create highly-pure, highly-ordered bound organo-silicon hybrids

J.Chan et al, in review. Tour et al (JACS 2006). Basic Idea: Create highly-pure, highly-ordered bound organo-silicon hybrids Molecules bound so intimately that electron waves pass easily between components Yielding: 1) Precise charge transfer into and out of Si surfaces

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249 views • 1 slides

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