'Current crowding' presentation slideshows

CHAPTER 10

CHAPTER 10. Master Figure. Fig. 10.1. Fig. 10.2. Fig. 10.3. Figs. 10.4 a, b. (a). (b). Fig. 10.5. Fig. 10.6. PVD Cu Seed. Cu Surface Treatment CVD Dielectric. Via Lithography and Etch. Cu Electrofill and Anneal. Line Lithography and Etch, TaN barrier. Cu CMP TaN Clean

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EM-sensitive components on semiconductor chips

EM-sensitive components on semiconductor chips. Modern RF circuits often feature on-chip inductors required by circuit design Operating frequencies are high enough to make this feasible Increasing circuit complexity also creates other inductive components

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Normal LED is 7.7 ? PI LED is 3.8 ?

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