# Heat transfer study in M0’ using the thermistors on the APD’s and on the boards - PowerPoint PPT Presentation

Heat transfer study in M0’ using the thermistors on the APD’s and on the boards

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Heat transfer study in M0’ using the thermistors on the APD’s and on the boards

## Heat transfer study in M0’ using the thermistors on the APD’s and on the boards

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1. Heat transfer study in M0’using the thermistors on the APD’s and on the boards Paul Baillon wach4 2002 Paris

2. Starting the electronic.Calibration of the APD’s Paul Baillon wach4 2002 Paris

3. Paul Baillon wach4 2002 Paris

4. Power cooling water The flow is 0.14 liter/s. The cooling power for 0.42 (out-in) is 2.5W/channel. Elec. off 0.42 Elect. on out in Paul Baillon wach4 2002 Paris

5. Regulating cooling water The flow is 0.22 liter/s. The cooling power for 0.013 (out-in) is 0.12W/channel Elec. off Elec. on out 0.013 in Paul Baillon wach4 2002 Paris

6. Power cooling Failure on the main cooling circuit on 23/9/02 Effects on the temperature of the electronic and the APD’s Paul Baillon wach4 2002 Paris

7. 1.29 out in Paul Baillon wach4 2002 Paris

8. Boards 1 Apd’s 0.03 Paul Baillon wach4 2002 Paris

9. Regulating water Temperature increase 0.005 out in Paul Baillon wach4 2002 Paris

10. Conclusions: • Temperature of APD (Thermistor) is 0.1 above cooling water • when the electronic is on. • When the water of the power circuit has its temperature • increase by 1.34: • -Temperature of APD (Thermistor) is 0.1 above cooling water • -The outgoing regulating water increases its temperature by 37% • and the APD’s by 30%. • -The connector of the APD (on the board ) has its temperature • increased by 1.34 at maximum. • (it cannot be higher than the increase of the power cooling ). • All the heat going to the regulating circuit and to the APD’s goes • through that connector. • Then we deduce that the connector has a temperature less than • 1.34/0.3=4.4 • (above the regulating water.) Paul Baillon wach4 2002 Paris

11. Effects on the APD’s of power variations in the electronic. It is due to a low voltage variation correlated to temperature variations in the control rack in the barrack. Paul Baillon wach4 2002 Paris

12. board 0.12 APD thermistors 0.012 Paul Baillon wach4 2002 Paris

13. Conclusion: The rise of the board temperature is clearly correlated to a rise of the low voltage power supply and of its current. The rise is 4% in temperature of the board to which corresponds 12% rise on the APD thermistors. There is more power consumption and heat release at the bottom of the board (FPPA?) Paul Baillon wach4 2002 Paris