Electronics Packaging for the Space Environment . Zach Allen ECEN 5004: Fundamentals of Microsystems Packaging. Overview. Introduction Overview Space: extreme heat and cold Packaging considerations for the vacuum of space Packaging for the space radiation environment.
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ECEN 5004: Fundamentals of Microsystems Packaging
(CVCM) ≤ 0.1%
Outgassing characteristics of selected materials from: http://outgassing.nasa.gov/cgi/sectiona/sectiona_html.sh
M. Mason and G. Eng Tin Plasma Arc Experiment Setup
Simulated tin whisker: 25 to 50µm diameter tin wire
M. Mason and G. Eng Tin Plasma Arc Experiment Results
Tin Plasma Duration vs. Power Supply Voltage
Tin Plasma Arc in Vacuum Chamber
DEC 2005, critical Shuttle Endeavour avionics box failed a test
Tin plated card guides
NASA experiment: Tin Whisker penetrating 0.1 mil thick conformal coating