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  1. Contents • Capability-PCB • Capability-FPC and RFPC • Capability-Aluminum PCB • Capability-PCBA Wonderful PCB

  2. Number of Layer: 2-28Layer Maximum processing area: 680 x 1000 mm Min board Thickness: 2 Layer 0.3mm(12mil); 4 Layer 0.4mm(16mil); 6 Layer 0.8mm(32mil); 8 Layer 1.0mm(40mil); 10 Layer 1.1mm(44mil); 12 Layer 1.3mm(52mil); 14 Layer 1.5mm(59mil); 16 Layer 1.6mm(63mil); 18 Layer 1.8mm(71mil); Finished board thickness tolerance: Thickness<0.8mm,Tolerance:+/-0.08mm; 0.8mm≤Thickness≤6.5mm,Tolerance+/-10% Capability –PCB General Capability Wonderful PCB

  3. Capability -- PCB General Capability • Twisting and bending :≤0.75%,Min0.5%。 • Range of TG:130-215℃ • Impedance tolerance+/-10%,Min+/-5%。 • Hi-Pot Test: Max4000V/10MA/60S • Surface treatment: HASL With Lead HASL Free Lead Flash Gold Immersion Gold Immersion Silver Immersion Tin Gold Finger Osp Wonderful PCB

  4. Capability -- PCB Pattern limit Wonderful PCB

  5. Capability -- PCB Holes processing Wonderful PCB

  6. Capability -- PCB Cu thickness +plating (1) • Cu thickness Out layer Cu thickness:1-6OZ Inner layer Cu thickness:0.5-4OZ Cu thickness of PTH: average>=20um,Min.>=18um • HASL with lead: Tin 63% Lead37% • HASL free lead: surface thickness>=0075um Thickness in the hole>=5um • Flash Gold Ni thickness:3-5um (120u"-160u") Gold thickness:0.025-0.075um (1u"-3u") Wonderful PCB

  7. Capability -- PCB Cu thickness +plating (2) • Immersion Gold Ni thickness:3-5um (120u"-160u") Gold thickness:0.025-0.15um (1u"-6u") • Immersion Tin Tin thickness:0.8-1.2um (32u"-48u") • Immersion silver Ag thickness:0.15um-0.75um (6u"-30u") • Gold Finger Ni thickness:3-5um (120u"-160u") Gold thickness:0.025-1.51um (1u"-60u") Wonderful PCB

  8. Capability -- PCB Cover thickness (1) • Solder mask Color: green, matte green,yellow,blue,red,black,matte black Solder mask thickness: Surface line≥10um, surface line corner≥6um surface board 10-25um Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm • Legend Color: White, yellow, black Min height of legend 0.70mm (28mil); Min width of legend 0.15mm (6 mil) Wonderful PCB

  9. Capability -- PCB Cover thickness (2) • Blue Gel thickness:0.2-1.5mm tolerance+/-0.15mm • Carbon print: Thickness:5-25um Min space:0.25mm impedance:200Ω Wonderful PCB

  10. Capability -FPC • FPCLayers 1-8 layers • Board Thickness 0.05-0.5mm • Min.line width/space 0.04/0.04mm • in.Through Hole Size 0.2mm • PTH Hole Dia.Tolerance ∮≤0.1mm 0.05mm ∮≥0.1mm ±0.075mm • Solder Mask Registration Tolerance ±0.05mmMin.Routing Dimension Tolerance ±0.05mm • Hole to edge(Hard tool/Die Cut) ±0.1/±0.2mm • Eege to Edge(Hard tool/Die Cut) ±0.05/±0.2mm • Circuit to edge(Hard tool/Die Cut) ±0.07/±0.2mm Wonderful PCB

  11. Capability-Flex Rigid PCB • 4L1R+2F+1R • 6L2R+2F+2R • 1+HDI 6L1+1R+2F+1R+1 • 2+HDI 6L1+1F+2F+1F+1 • 2+HDI 8L • Thin 4L R-F(1+HDI ) Wonderful PCB

  12. Capability—FPC and RFPC Material-1 1. Base Material 1.1 FCCL ( Flexible Copper Clad laminate) Polyimide: Kapton (12.5 m/20 m/25 m/50 m/75 m High flex life, good thermal management, high moisture absorption and good tear resistant Polyester (25 m/50 m/75 m) Most cost effective, good flex life, low thermal resistivity, low moisture absorption and tear resistant 1.2 Dielectric Substrates:PI, PET. Wonderful PCB

  13. Capability—FPC and RFPC Material 2. Coverlay 2.1 Cover Layer from ½ mil to 5 mils (12.7 to 127µm) Polyimide: (12.5 m/15 m/25m/50m/75m/125m) High flex life, high thermal resistivity. 2.2 Flexible Solder Mask Most cost effective, lower flex life, better for registration ) 2.3 PIC—photo imaging covercoat Lower flex life, better for registration Wonderful PCB

  14. Capability—FPC and RFPC Material • 3. Adhesive Sheet • 4. Conductive Layer • 4.1 Rolled Annealed Copper (9 m/12 m/17.5 m/35 m/70 m) • High flex life, good forming characteristics. • 4.2 Electrodeposited Copper (17.5 m/35 m/70 m) • More cost effective • 4.3 Silver Ink • Most cost effective, poor electrical characteristics. Most often used as shielding or to make connections between copper layers • SF-PC5000 and SF-PC1000protection film Wonderful PCB

  15. Capability—FPC and RFPC Material 6.Additional Material & Stiffeners FR4——Epoxy Pressure Sensitive Adhesive (PSA) Steel, Aluminum stiffeners 7. No / Low Flow PP Applied in Lamination 106(2mil) 1080(3.0mil / 3.5mil) 2116(5.6mil) w/o micro-via Brand: TUC, Panasonic, Arlon, Hitachi, Doosan Wonderful PCB

  16. Capability –Aluminum PCB Wonderful PCB

  17. Capability- PCB Assembly 1.  PCBA, PCB assembly: SMT & PTH & BGA 1.1.SMD :160K points/hour. operation rate :70%( 8 working hours per day, 20 set equipments) 1.2.DIP: 75K points/hour. operation rate :80% ( 8 working hours per day, 250persons for DIP) 2.  PCBA and enclosure design 3.  Components sourcing and purchasing 4.  Quick prototyping 5.  Final assembly 6.  Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) 7.  Custom clearance for material importing and product exporting Wonderful PCB

  18. Capability –Profiling for all • cnc : tolerance+/-0.1mm line to cnc ≥0.20mm hole to cnc ≥0.30mm gold finger to cnc ≥0.20mm • Punching: Hole size diameter +/-0.10mm Punching diameter +/-0.15mm • v-cut: corner:30℃、45℃、60℃ corner tolerance:+/-5° v-cut deepness:0.6-1.6mm deepness tolerance:+/-0.10mm Wonderful PCB

  19. Capability –Test for all • Equipment: Universal Tester Flying Probe Open/Short Tester High power Microscope Solderability Testing Kit Peel Strength tester High Volt Open & Short tester Cross Section Molding Kit With Polisher Wonderful PCB