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Engineering Specification & Design Portfolio. Engineering Design. System Design. Start Here!. Detail Design. Design Process. Define Functional Needs Functional Specification (Continuous updating) Engineering Specification (Continuous updating) Detail Design Design for Manufacturing

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Engineering specification design portfolio

Engineering Specification & Design Portfolio


Engineering design
Engineering Design

System Design

Start Here!

Detail Design


Design process
Design Process

  • Define Functional Needs

  • Functional Specification (Continuous updating)

  • Engineering Specification (Continuous updating)

  • Detail Design

    • Design for Manufacturing

    • Design for Assembly and Disassembly

    • Life Cycle Design

  • Prototyping

  • Production

  • Product Launch

  • Maintenance and Support

  • Product Recycling

Concurrent and Iterative Activities


Design procedure
Design Procedure

Marketing

Subsystem Decomposition

Functional Needs

Functional Specification

Design Analysis

Engineering Specification

Matl. Selection

  • Detail Design

    • Life Cycle Design

    • Design for Assembly and Disassembly

    • Design for Manufacturing

Recycling

Maintenance

Manufacturing

Process Plan

Product


Design specification
Design Specification

  • Functional Specification

    • Overall requirements

    • Key functionalities

    • Overall dimensions

    • Key performance characteristics

    • Layout drawing

  • Engineering Specification

    • Detail performance requirements

    • Subsystems and subsystems detail requirements

    • All relevant dimensions

    • Engineering drawings


Design portfolio
Design Portfolio

  • Design specification - Contract

  • Design Schedule

  • Functional design

    • Design alternatives

    • Design evaluation

  • Final design solution

    • Design model and analysis

    • Engineering drawings

    • Process Plan

  • References

  • Meeting notes


System design
System Design

  • Define Functional Needs

  • Functional Specification (Continuous updating)

    • Review existing information

      • Existing designs, patents, codes, legislation, literature search

    • Decomposition into subsystems

      • Overall layout

      • Subsystem relationship




Process flow i
Process Flow I

Silicon Template

Step 1a - Pattern developed on bare silicon template

  • Clean silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins

  • Rinse with deionized water and dry clean

  • Spin coat standard photoresist

  • Conduct photolithography by UV exposure

  • Wet etch the pattern by KOH (anisotropic etching)

  • Photoresist stripping

  • Rinse with deionized water and dry clean

  • Dicing


Process flow ii
Process Flow II

Pressure

Silicon Template

Polymer

Silicon Template

Step 1b - Soft mould Preparation

  • Apply mould release (silicone) on silicon template

  • Clean another silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins

  • Rinse with deionized water and dry clean

  • Spin coat polymer (PMMA / PDMS)


Process flow iii
Process Flow III

Heat

Heat

Step 1c - Pattern transfer to the soft mould

  • Apply silicon template onto polymer with pressure (<5bars)

  • Curing polymer with suitable conditions

  • Release of silicon template

  • Step 1d - Soft mould fabricated


  • Process flow iv
    Process Flow IV

    Silicon substrate

    PDMS / PMMA Mould

    Conductive Polymer

    Step 2 - Dipping of soft mould on conductive polymer

    • Apply a layer of conductive polymer into the paste pot

    • Turning the pot and set the height of the paste by height adjustable blade

    • Dipping of soft mould on the conductive polymer


    Process flow v
    Process Flow V

    Magazine

    Wafer

    Step 3 - Die preparation

    • Dicing

    • Load into magazine


    Process flow vi
    Process Flow VI

    Pressure

    IC die

    Step 4 - Formation of interconnect

    • Alignment is conducted between soft mould and IC die

    • Apply soft mould onto the die (displacement control)

    • Lifting of the soft mould for next cycle

    • Soft mould will undergo Step 2 for next die


    Process flow vii
    Process Flow VII

    Pressure

    Bumped Chip

    IC die

    Sub-mount / substrate

    Step 5 - Assembly process

    • Bumped chip is flipped

    • Alignment is conducted between bumped IC die and substrate

    • Apply bumped IC die onto the substrate (displacement control)


    Process flow viii
    Process Flow VIII

    Heat

    IC die

    Underfill

    Heat

    Step 6 – Curing

    • Batch if assembled package is collected

    • Batch curing of conductive polymer in conventional oven

    • Underfilling is optional


    Functional specification i
    Functional Specification I

    • Target Package

    • Base Table


    Functional specification ii
    Functional Specification II

    • Bonding Head

    • Camera Table









    System design1
    System Design

    Sub-system I

    Sub-system II

    Sub-system III

    Overall

    System

    Relationship B

    Relationship D

    Relationship C

    Relationship A


    System design2
    System Design

    • Internet

    • Patent database

      • http://www.ttc.ust.hk http://www.ttc.ust.hk

        • IP and Patent Search Links (WIPS)

          • e.g. printer head + Epson

    • Research database

      • http://ustlib.ust.hk http://ustlib.ust.hk

        • Database List – (SCOPUS)

          • Printer head (title) + Epson (Affiliation)