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DiPamat Di rect Pa tterning M aterials

DiPamat Di rect Pa tterning M aterials. Etch / Plating Resist. What is resist. A photo resist is a chemical product that, under the influence of UV light, changes its chemical nature. Resist without UV: is washed away during resist development. Resist with UV:

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DiPamat Di rect Pa tterning M aterials

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  1. DiPamatDirect Patterning Materials Etch / Plating Resist

  2. What is resist A photo resist is a chemical product that, under the influence of UV light, changes its chemical nature. Resist without UV: is washed away during resist development Resist with UV: is NOT washed away during resist development protects the copper in the etch batch is stripped away after etching Remark: 1 Etch resist: print & etch of inner layers 2 Plating resist: print, plate & etch of outer layers Eric Janssens May 2013

  3. What is resist • Liquid photo resist (20%) • Curtain, roller- or spray coated • Thickness: 5 - 20µm • Pro: high resolution • Contra: dust inclusions and chemical sensitivity • Dry photo resist (80%) • Cold, hot or wet laminated • Thickness: 25 - 75µm • Pro: high yield and good tenting • Contra: line width Tenting: Via’s must be tented to avoid resist getting in the via Eric Janssens May 2013

  4. Traditional resist printing • Workflow: • Design • Image and develop film, check • Coat, laminate resist • Image resist • If laminated: peel cover layer • Develop resist • Etch • Strip • Working with resist is: • A time consuming process step • Expensive • Fixed data • Ecological unfriendly Eric Janssens May 2013

  5. Inkjet resist printing • Principle: • apply etch / plating resist • directly on the panel • using a set of Inkjet nozzles mounted on a XY table • ie without the use of a phototool or screen • Workflow: • Design • Print (with pin curing) • Curing (thermal and/or UV) • Etch • Strip Eric Janssens May 2013

  6. Inkjet resit printing • Advantages: • Reduce cost • no phototool, less production steps • shorter production cycle, higher yields • Registration panel per panel / distortion compensation • front-to-back • outer layer to inner layer • Design changes & variable data per board • Fast (no set up) • Ecology Eric Janssens May 2013

  7. Quid May 2013 • R&D project is in progress • Jetability and etch resistance: OK • Stripability: concepts are tested • Planning • One ER fieldtest in operation by end 2013 • Proliferation of ER in 2014 • Concept study PR Eric Janssens May 2013

  8. Quid May 2013 Eric Janssens May 2013

  9. Quid May 2013 Eric Janssens May 2013

  10. Quid May 2013 Eric Janssens May 2013

  11. Competition: Dow (Rohm and Haas) www.dowelectronicmaterials.com Phase shift ink Eric Janssens May 2013

  12. Competition: MacDermid www.macdermid.com Eric Janssens May 2013

  13. Competition: MuTracx www.mutracx.com • Spin-off from OCE Technologies (Canon) • Announces Lunaris: print system and etch resist for IL • Phase shift inkl • Uses Predict • Fieldtest summer 2010 in EU • Commercially available by mid 2011 Eric Janssens May 2013

  14. Competition: MuTracx Eric Janssens May 2013

  15. System supplier: MuTracx lunaris animation.avi Eric Janssens May 2013

  16. Conclusion Inform your customers and prospects on our plans Gather as much information as possible Don't forget film Eric Janssens May 2013

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