"AlSiC-Based Hybrid Composite Tool Kit". By Richard W. Adams and Mark A. Occhionero Ceramics Process Systems 111 South Worcester St Chartley MA 02712-0338 www.alsic.com New England IMAPS 31 Annual Symposium Thursday May 6, 2004. "AlSiC-Based Hybrid Composite Tool Kit".
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By Richard W. Adams
and Mark A. Occhionero
Ceramics Process Systems
111 South Worcester St
Chartley MA 02712-0338
New England IMAPS 31 Annual Symposium
Thursday May 6, 2004
infiltration castingCPS AlSiC Fabrication - Defines Properties and Design
Thomas Schuetze, Herman Berg, Oliver Schilling “The new 6.5kV IGBT module: a reliable device for medium voltage applications”, PCIM September 2001
flat dielectric substrate surface
convex bow cooler plate surface
Concurrent IntegrationTM -High Density Interconnect (HDI) for GaAs Microwave Transmit/Receive Packages
First, dense dielectric ceramic ferrules are inserted into the QuickCastTM infiltration tooling along with the SiC preform.
Then, the Al-metal, that infiltrates the SiC preform to form the AlSiC composite, hermetically bonds and fills the ferrules to form coaxial feedthrus.This process is termed Concurrent IntegrationTM.
Alloy 49 pad
AlSiC laser diode TEC substrate system showing TEC mount area (top) and the cross section showing the HOPG insert in the AlSiC composite (bottom).Concurrent IntegrationTM - Optoelectronic AlSiC TE Cooler Substrate with HOPG
Heat source surface