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Feb/06/2008 Integrated Supply Chain – Electronic Components Technology Yamato, IBM Japan, Ltd.

PowerPC 750CL DIC Measurement JEITA ED-7306_E. Feb/06/2008 Integrated Supply Chain – Electronic Components Technology Yamato, IBM Japan, Ltd. Power PC 750CL 21x21mm FCPBGA. R. L. R. L. H. H. H. Measurement : IBM Endicott, D.Questad. C. C.

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Feb/06/2008 Integrated Supply Chain – Electronic Components Technology Yamato, IBM Japan, Ltd.

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  1. PowerPC 750CL DIC MeasurementJEITA ED-7306_E Feb/06/2008 Integrated Supply Chain – Electronic Components Technology Yamato, IBM Japan, Ltd.

  2. Power PC 750CL 21x21mm FCPBGA R L R L H H H Measurement : IBM Endicott, D.Questad C C

  3. Fig #3 : Simulate warpage during reflow process ( 25’Cmax temp 25’C ) Power PC 750CL 21x21mm FCPBGA R Fig #5 : To define the + / - way. Fig #1 : Measure R axis warpage, adjust the 2 edges to be zero point, and plot. Y axis warpage. L R L H H H Measurement : IBM Endicott, D.Questad Fig #2 : Measure L axis warpage, adjust the 2 edges to be zero point, and plot. Fig #4 : Simulate warpage during reflow process ( 25’C max temp 25’C ) C C

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