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Explore our comprehensive suite of ion implantation and thin film deposition systems, including 500 kV HV terminal, Nielsen RF ion sources, ion accelerators, SEM and TEM units, and surface analysis tools for precise mass analysis and coating applications.
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Ion implanter – HV terminal 500 kV a number of Nielsen and RF ion sources for gaseous and solid materials mass analysis better than 1 a.m.u. beam current from 1-100 mA, beam scanning system target area up to 5 cm diameter
2MV Van de Graaff ion accelerator RF source for light ions - H, He and their isotopes RBS – beam line in preparation
UHV chamber for thin film deposition e-beam or thermal evaporation
Thin film coating unit for SEM sample preparation Dual ion miller for TEM specimen preparation
TEM – Philips EM400 120 keV
TEM – Philips EM400T 120 keV
SEM – Philips EM500 Oxford Instruments EDAX
ANA HV thin film deposition unit with dual ion beams
EMA 10 – UHV system Surface analysis- LEIS i SIMS (low energy ion scattering and Secondary ion mass spectroscopy)
Balzers SPUTTRON II thin film deposition system d.c. and r.f. sputtering, four target elements, raective deposition
Balzers BAK 550 evaporation system e-beam (four teagles) or thermal evaporation, thickness and deposition rate monitor, programmable four layer deposition, reactive evaporation, residual gas analyzer, flash evaporation
Talistep – thin film thickness and surface roughness measurements