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TWEPP Paris, 09

TWEPP Paris, 09 . Radiation Tests on the complete system of the instrumentation electronics for the LHC Cryogenics at the CNGS test facility Evangelia Gousiou CERN TE CRG. Outline. Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility

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TWEPP Paris, 09

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  1. TWEPP Paris, 09 Radiation Tests on the complete system of the instrumentation electronics for the LHC Cryogenics at the CNGS test facility Evangelia Gousiou CERN TE CRG

  2. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  3. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  4. The Cryogenic Instrumentation Electronics • All electronics will be subject to radiation (ionizing, non-ionizing dose and SEE). • Manufactured mainly with COTS that have been prequalified, since space or military technologies were incompatible with the project budget. • ->-> Replacements foreseen during maintenance campaigns. • ~10.000 electronic boards assembled in ~800 crates, all around the LHC tunnel and in “protected areas”. • Conditioners: measure temperature, pressure, He level • Actuators: AC and DC electrical heaters

  5. Conditioner Channels Architecture FPGA Pressure Sensor ASIC ADC MUX FPGA Temp. Sensor ASIC ADC Conditioner card (holds 2 independent channels)

  6. Conditioner Channels Architecture Pressure Sensor FPGA FPGA FPGA ASIC ASIC ASIC ADC ADC ADC FPGA SRAM MUX MUX MUX WorldFIP AGENT MUX Temp. Sensor FPGA FPGA FPGA ASIC ADC ASIC ADC ASIC ADC WFIP Communication card (for up to 7 cards) Conditioner card (holds 2 independent channels)

  7. Conditioner Channels Architecture WorldFIP FIELDBUS Pressure Sensor FPGA FPGA FPGA ASIC ASIC ASIC ADC ADC ADC FPGA SRAM MUX MUX MUX WorldFIP AGENT MUX Temp. Sensor FPGA FPGA FPGA ASIC ADC ASIC ADC ASIC ADC WFIP Communication card (for up to 7 cards) Conditioner card (holds 2 independent channels)

  8. Conditioner Channels Architecture WorldFIP FIELDBUS Pressure Sensor FPGA FPGA FPGA ASIC ASIC ASIC ADC ADC ADC FPGA SRAM MUX MUX MUX WorldFIP AGENT MUX Temp. Sensor FPGA FPGA FPGA ASIC ADC ASIC ADC ASIC ADC WFIP Communication card (for up to 7 cards) Conditioner card (holds 2 independent channels) • Continuously auto-calibrated system: • Comparison with a reference on each measurement for gain drift correction. • Voltage polarity inversion on each measurement for offset correction. • Excitation current inversion for compensation of thermocouple effects. Features for high accuracy Features for high accuracy

  9. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  10. Radiation tolerance strategy Components Selection • Rad-hard ASIC, Voltage Regulator developed at CERN • Anti-fuse FPGA • WorldFIP agent using signal transformer rather than optical insulators • Radiation tests on COTS in dedicated test facilities

  11. Radiation tolerance strategy Mitigation Techniques • Triple module redundancy on FPGA logic • Frequent refreshment of WorldFIP agent’s SRAM memory to reduce error probability • Overdesign of power supplies and thermal dissipators Components Selection • Rad-hard ASIC, Voltage Regulator developed at CERN • Anti-fuse FPGA • WorldFIP agent using signal transformer rather than optical insulators • Radiation tests on COTS in dedicated test facilities WorldFIP FIELDBUS Conditioner Card FPGA 20ms SRAM 1s 1s WorldFIP Communication Card

  12. Radiation Test Campaigns LHC Tunnel Electronics • Tests in dedicated test facilities for all the components (ITN-Portugal, UCL-Belgium, PSI-Switzerland, CERN-Switzerland). Protected Areas Electronics • Radiation levels underestimated -> -> Electronics not designed to stand radiation. The test campaign at CNGS aims at Validating the performance of the complete systems for both cases (tunnel and protected areas).

  13. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  14. Why CNGS? • Exposure to LHC-like radiation field • Good knowledge of radiation levels from simulations and real time monitoring • Free of charge! Tests of complete systems (crates)

  15. The CNGS Test Facility Gran Sasso (Italy) Service Gallery Main Tunnel Neutrino Beam . . . Ducts 2ndary Beam Graphite Target Particle Shower Proton Beam CERN

  16. The CNGS Test Facility Gran Sasso (Italy) Service Gallery Main Tunnel Neutrino Beam . . . Ducts 2ndary Beam Graphite Target DUT Particle Shower Proton Beam CERN

  17. The CNGS Test Facility Gran Sasso (Italy) Service Gallery Main Tunnel Neutrino Beam 2km … … . . . Ctrl Room Ducts • We are provided with • Mains • WorldFIP Communication • Real Time Rad Monitors • 2 x 48pins Connectors 2ndary Beam Graphite Target DUT Particle Shower Proton Beam CERN

  18. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  19. Equipment to Test • 2 Cryogenic Instrumentation Crates fully equipped with Conditioners, Actuators, Communications and Power Supply Cards: • 25 Cards (=50 channels) of LHC tunnel electronics • 8 Cards (=16 channels) of “protected areas” electronics

  20. Test Setup • On line measurements on DUT: • WorldFIP data as in the LHC control system • Current Consumption and Voltage Levels • Testing conditions: • Fixed loads to conditioner channels • Fixed set points to actuator channels • 4 thermometers in different locations

  21. Testing Periods • 1.5 months at low dose radiation station: • 1.5 months at high dose radiation station: + 1 month dry run tests to confirm electronics and measurements reliability.

  22. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  23. Protected Areas Electronics 1. AC Heater Actuators Overview • Cumulative effects failures: • -> Failing component: Solid state relay • ->-> Solutions for the LHC: Moving of electronics, shielding of protected areas. 0.3 • Same results for 6 channels and reproduced in two different CNGS locations.

  24. Protected Areas Electronics Power on load TID(Gy) 2 4 6 8 10 1MeV(cm-2)2e10 4e10 6e10 8e10 1e11 1.2e11 1.4e11

  25. Protected Areas Electronics Power on load TID(Gy) 2 4 5 6 8 10 1MeV(cm-2)2e10 4e10 6e10 7.3e10 1e11 1.2e11 1.4e11

  26. Protected Areas Electronics 1. AC Heater Actuators Failing Component FPGA Set point Solid State Relay Mains

  27. Protected Areas Electronics 1. AC Heater Actuators Failing Component FPGA Set point Solid State Relay Mains

  28. Protected Areas Electronics 2. Insulated Temperature Conditioners Overview (I) • Cumulative effects failures: • -> Failing component: DC-DC converter; plans for tests in dedicated test facilities. 4 • Same results for 12 channels and reproduced in two different CNGS locations.

  29. Protected Areas Electronics 2 Current Consumption (A) TID(Gy) 70

  30. Protected Areas Electronics 2. Insulated Temperature Conditioners Overview (2) • Single Event Upsets: • -> Failing component: Digital Isolator • ->-> Mitigation Technique for LHC: soft reset automatically forced by the control system; • No influence on proper operation of the machine. 6 • Same results for 12 channels and reproduced in two different CNGS locations.

  31. Protected Areas Electronics 2. Insulated Temperature Conditioners SEE occurrence FPGA ctrl signal Digital Isolation Amplifier 4 wire measurement PT 100 ASIC Analog Isolation Amplifier measurement • measurement • ctrl signals • ……………………….. = Sensor Resistance

  32. Protected Areas Electronics 2. Insulated Temperature Conditioners SEE occurrence FPGA 1 1 Digital Isolation Amplifier 100μA 50 Ω ASIC Analog Isolation Amplifier 5mV 5mV • 5mV • 100μA • ...................... • =50 Ω

  33. Protected Areas Electronics 2. Insulated Temperature Conditioners SEE occurrence 0 FPGA 10μA 1 1 Digital Isolation Amplifier 100μA 50 Ω ASIC Analog Isolation Amplifier 0,5mV 0,5mV 5mV 5mV • 0,5mV • 100μA • ...................... • =5 Ω • A soft remote Reset brings the situation back to normal. • Cross section calculation:

  34. Tunnel Electronics Overview >10 • No Single Event Errors! • Still within specs in output accuracy! Tunnel electronics have received till now a cumulated dose of: ..and the tests are still ongoing!

  35. Tunnel Electronics 51 50 Resistance (Ω) 48 TID (Gy)

  36. Tunnel Electronics 51 +0.3% 50 Design Specs -0.3% Resistance (Ω) 48 TID (Gy) 0 10 20 40 60 80 100 120

  37. Tunnel Electronics Overview • Tunnel electronics have received till now a cumulated dose of: ..and the tests are still ongoing! >10 • No SEE! • Still within specs in output accuracy! • BUT! Gain drifts already observed and corrected by auto calibration features.

  38. Tunnel Electronics Vsens = G*I*Rsens Sensor Voltage Vref = G*I*Rref Reference Voltage

  39. Tunnel Electronics Vsens = G*I*Rsens Sensor Voltage Vref = G*I*Rref Reference Voltage

  40. Tunnel Electronics 51 Sensor Voltage Vsens = G*I*Rsens 50 Vsen Rsens=Rref Vref Vref =G*I*Rref Reference Voltage 48

  41. Outline Overview of the Cryogenic Instrumentation Electronics Radiation tolerance strategy CNGS Test Facility Test Setup Test Results Conclusions

  42. Conclusions • CNGS testing has provided quantitative knowledge about the radiation tolerance of our complete system. • Confirmation of LHC tunnel electronics reliability. • Identification of protected areas electronics weaknesses. • First approach of possible solutions.

  43. Conclusions • CNGS testing has provided valuable knowledge for all our electronics • Thank you for your attention • Further tests on specific components need to be performed • Optimism in the case of tunnel electronics • Multiplesolutions for the protected areas electronics problems

  44. Conclusions • CNGS testing has provided valuable knowledge for all our electronics • Thank you for your attention • Further tests on specific components need to be performed • Optimism in the case of tunnel electronics • Multiplesolutions for the protected areas electronics problems

  45. TWEPP Paris, 09 Extras

  46. Voltage & Current Measurements V I 1 Ω • In order to probe and gain access to the Current Consumption and Voltage Level signals, modification needed to be done on the Power Supply Card • The Power Supply Card receives the mains and provides channels of DC Voltage for all the Cards in a Crate • A 1Ω robust resistance inserted in series in the tracks of the Power Card

  47. Voltage & Current Measurements V I 1 Ω • In order to probe and gain access to the Current Consumption and Voltage Level signals, modification needed to be done on the Power Supply Card • The Power Supply Card receives the mains and provides channels of DC Voltage for all the Cards in a Crate • A 1Ω robust resistance inserted in series in the tracks of the Power Card

  48. Cryogenic Instrumentation Conditioner Channels Architecture WorldFIP FIELDBUS FPGA Pressure Sensor ASIC ADC FPGA Pressure Sensor ASIC ASIC MUX ADC FPGA SRAM WorldFIP AGENT MUX MUX FPGA PT 100 ASIC ADC ASIC WFIP Communication Card (holds up to 7 Cards) Conditioner Card (holds 2 independent channels) High Accuracy main features Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion.

  49. Cryogenic Instrumentation Conditioner Channels Architecture WorldFIP FIELDBUS FPGA Pressure Sensor ASIC ADC FPGA Pressure Sensor ASIC ASIC MUX ADC FPGA SRAM WorldFIP AGENT MUX MUX FPGA PT 100 ASIC ADC ASIC Vsens= G*I*Rsens WFIP Communication Card (holds up to 7 Cards) Conditioner Card (holds 2 independent channels) ASIC high precision resistor High Accuracy main features Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion.

  50. Cryogenic Instrumentation Conditioner Channels Architecture WorldFIP FIELDBUS FPGA Pressure Sensor ASIC ADC FPGA Pressure Sensor ASIC MUX ADC FPGA SRAM WorldFIP AGENT MUX MUX FPGA PT 100 ASIC Vsens= G*I*Rsens Vref = G*I*Rref WFIP Communication Card (holds up to 7 Cards) Conditioner Card (holds 2 independent channels) ASIC high precision resistor High Accuracy main features Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion.

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