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Impact and Modeling of Anti-Pad Array on Power Delivery System

Impact and Modeling of Anti-Pad Array on Power Delivery System. Zhiping Yang 1 , Jin Zhao 2 , Sergio Camerlo 1 , Jiayuan Fang 2 1 SVS Signal Integrity & Packaging Design Group, Cisco System, Inc. San Jose, CA 95134 Tel: (408) 525-5690, Fax: (408) 525-5690, Email: zhiping@cisco.com

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Impact and Modeling of Anti-Pad Array on Power Delivery System

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  1. Impact and Modeling of Anti-Pad Array on Power Delivery System Zhiping Yang1, Jin Zhao2, Sergio Camerlo1, Jiayuan Fang2 1 SVS Signal Integrity & Packaging Design Group, Cisco System, Inc. San Jose, CA 95134 Tel: (408) 525-5690, Fax: (408) 525-5690, Email: zhiping@cisco.com 2 Sigrity, Inc. Santa Clara, CA 95051 Tel: (408) 260-9344 x 104, Fax: (408) 260-9342, Email: jzhao@sigrity.com EPEP 2003 October 27 - 29, 2003 Westin Princeton Princeton, New Jersey

  2. Content • Anti-pad array and its effects • Test card structure and lab measurement setting and results • 3D EM model extraction • Board level modeling and simulation • Correlation between simulation and measurement • Conclusions and future work

  3. Anti-pad Array and Its Effects • Several thousands passing through vias on a typical CISCO board • Most of the vias are located right under the BGA ASICs with regular pattern • No commercial EDA software available for studying the effects of anti-pad array at system/board level • Anti-pad array will impact signal transmitted and power supply system performance Our intuition suggests that the plane inductance and resistance will increase because of the reduction of the current flowing capacity; and that cell capacitance will vary due to the change in effective area and also due to the via structures that are passing through the anti-pad array.

  4. Layer 1 4.7 mil FR4 Layer 2 4.0 mil FR4 Layer 3 Layer 11 21.0 mil FR4 Layer 15 4.7 mil FR4 Layer 16 Two cases: open case short case (shorting at locations) Total thickness=93 mils Test Card Structure Test Card Stackup Test card without anti-pad array Test card with anti-pad array Probe Location Probe Location

  5. Lab Measurement Probe setting Local ground pin Probe 2 Probe 1 Local power pin Probe setting detail

  6. Lab Measurement Results (Open Case)

  7. Lab Measurement Results (Short Case)

  8. Observations from Lab Measurement Results • From the measurement results, it is obvious that the anti-pad array exhibits different impedance and resonance impact on 4 mils and 21 mils structures. • For the structure with 4 mils plane separation, the impedance has been raised by 10% to 30%. • For the structure with 21 mils plane separation, the resonant frequency has been shifted downward several tenths of MHz to 100MHz. • According to the measurement results, ignoring the impact of anti-pad array at the design stage could lead to a weakened power delivery system.

  9. 3D EM Field Solver Model Extraction Solid planes One anti-pad Two anti-pads Two port S-parameter has been calculated for different structures. A k factor has been defined as One anti-pad with a passing through via Two anti-pads with a passing through via Computations were performed using Ansoft HFSSTM

  10. Computed KR Factor KR_4mils = 2.3 4 mils plane separation

  11. Computed KL Factor KL_4mils = 1.815 4 mils plane separation

  12. Computed KG Factor KG_4mils = 0.714 4 mils plane separation

  13. Computed KC Factor KC_4mils = 0.729 4 mils plane separation

  14. Computed KR Factor KR_4mils = 3.15 21 mils plane separation

  15. Computed KL Factor KL_4mils = 1.197 21 mils plane separation

  16. Computed KG Factor KG_4mils = 1.260 21 mils plane separation

  17. Computed KC Factor KC_4mils = 1.337 21 mils plane separation

  18. K Factor Summary • The table above lists the k factors that were used in simulation for both structures with 4 mils and 21 mils plane separations. • The inductance and resistance always increase with the anti-pad array existing on the plane for both 4 mils and 21 mils structures. • The capacitance and admittance will be reduced for the 4 mils structure, but will increase for the 21 mils structure. • The k factor remains constant for a reasonably broad frequency range.

  19. RLGC parameter adjusted area Board Level Simulation Setting • k factors are calculated by using Ansoft HFSSTM 3D EM field solver. • The RLGC parameters adjustment is only for the area where the anti-pad array is located on the PCB. • This approach was successfully applied into Sigrity SPEED2000TM. • Simulation results were compared with measurement results.

  20. Simulation Results vs. Measurement Results Short Case without Anti-pad array

  21. Simulation Results vs. Measurement Results Short Case with Anti-pad array

  22. Simulation Results vs. Measurement Results Open Case without Anti-pad array

  23. Simulation Results vs. Measurement Results Open Case with Anti-pad array

  24. Conclusions and Future Work • An effective approach for accurate consideration of anti-pad array impact on the power and ground planes is presented. • Simulation and measurement comparison indicates that this approach is valid and the impact of the anti-pad array on the power delivery system has been captured up to several GHz. • A frequency dependent k factor may improve the model accuracy for high frequency applications.

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