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Gamma-ray Large Area Space Telescope. DOE Review 4.1.7 DAQ. GLAST Large Area Telescope: G. Haller SLAC haller@slac.stanford.edu (650) 926-4257. Contents. Overview - Production & Testing - Schedule TEM/TPS Flight Units PDU Flight Units GASU Flight Units SIU/EPU Flight Units Testbed

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doe review 4 1 7 daq

Gamma-ray Large Area Space Telescope

DOE Review 4.1.7 DAQ

GLAST Large Area Telescope:

G. Haller

SLAC

haller@slac.stanford.edu

(650) 926-4257

contents
Contents
  • Overview - Production & Testing - Schedule
    • TEM/TPS Flight Units
    • PDU Flight Units
    • GASU Flight Units
    • SIU/EPU Flight Units
  • Testbed
  • Installation & Test Support
  • Budget
lat electronics
LAT Electronics

TKR Front-End Electronics (MCM)

ACD Front-End Electronics (FREE)

TKR

CAL Front-End Electronics (AFEE)

16 Tower Electronics Modules & Tower Power Supplies

CAL

Global-Trigger/ACD-EM/Signal-Distribution Unit*

3 Event-Processor Units (EPU) (2 + 1 spare)

  • Event processing CPU
  • LAT Communication Board
  • SIB

Spacecraft Interface Units (SIU)*

  • Storage Interface Board (SIB): Spacecraft interface, control & telemetry
  • LAT control CPU
  • LAT Communication Board (LCB): LAT command and data interface

Power-Distribution Unit (PDU)*

  • Spacecraft interface, power
  • LAT power distribution
  • LAT health monitoring

* Primary & Secondary Units shown in one chassis

tem tps mounted to cal
TEM/TPS Mounted to CAL

TKR not shown

LAT GRID with 16 CAL/TEM/TPS Modules

CAL

TEM

TPS

tower electronics module tower power supply
Tower Electronics Module/Tower Power Supply
  • Tower Electronics Module: Main DAQ module, one on each tower
    • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics
    • Assembles CAL and TKR event fragments to tower event
  • Tower Power Supply module, one on each tower
    • Input 28V
    • Generates low-noise voltages for
      • TKR (2.65V analog, 2.65V Digital)
      • CAL (3.3V analog, 3.3V digital)
      • TEM (3.3V and 2.5V digital)
      • TKR Bias (20V-140V programmable)
      • CAL (20V to 90V programmable)

Tower Electronics Module (TEM) before coating/staking

TEM

Tower Power Supply (TPS) before coating/staking

Shown upside-down

TPS

tem tps status schedule
TEM/TPS Status & Schedule
  • Status
    • Three Flight Tower-Electronics Modules/Tower Power Supplies received
      • Fully assembled
      • Thermal-cycled
      • Vibration tested (one of them to qualification levels)
      • One unit finished thermal-vacuum testing
      • One unit in thermal-vacuum testing
      • Both units finished EMI/EMC testing
      • No issues/problems
    • Balance of 19 TEM/TPS in surface-mount assembly at vendor
  • Schedule
    • 2/17/05 First TEM/TPS to I&T
    • 2/25/05 Second TEM/TPS to I&T
    • 4/1/05 Third TEM/TPS to I&T
    • 4/22/05 Fourth TEM/TPS to I&T
      • One week lag between delivery of consecutive assemblies
    • 7/26/05 Last TEM/TPS to I&T
power distribution module pdu
Power Distribution Module (PDU)

EM PDU enclosure with primary/redundant PDU circuit cards, no coating/staking

  • Primary and Redundant Circuits in one Enclosure
    • Receives Primary and Redundant 28-V from spacecraft
    • Each, primary and redundant PDU can select between primary and redundant spacecraft power
    • Filters 28V
    • Turns on/off 28V to 16 towers and 3 EPU’s under program control
    • Protects PDU and down-stream circuits from over-current and under-voltage
      • Over-current via poly-switches
      • Under-voltage via custom circuit in each power-on branch
    • Receives command/clock from GASU
    • Digitizes voltages/temperatures from > 150 sources
      • Includes temperatures from radiators, GRID; used for thermal control
    • Reads back data to SIU via GASU
    • Provides PDU DAQ voltage and temperature analog data to spacecraft for monitoring
pdu status and schedule
PDU Status and Schedule
  • Status
    • Design/documentation complete
    • Enclosures fabricated
    • All parts received (except recalled International Rectifier regulator, due end of February)
    • Assembly contract awarded
    • All parts kitted and audited by assembly vendor
    • Assembly started
  • Schedule for Flight Unit
    • 5/15/05 Precoat PDU assembly ready for electrical test
    • 5/30/05 Complete assembly ready for environmental test
    • 7/1/05 Flight PDU to I&T
slide10
GASU

PDU enclosure with primary/redundant PDU circuit cards, no coating/staking

  • Primary and Redundant Circuits in one Enclosure
    • Contains two types of circuit card assemblies
      • GASU Power Supply CCA
      • GASU DAQ Board CCA
    • GASU Power Supply
      • Receives 28-V supply voltages for
        • Primary and redundant DAQ board, generates 3.3V and 2.5v
        • ACD FREE cards
          • Filtering for 28-V
          • 3.3V regulation
    • GASU DAQ Board
      • Contains 9 FPGA’s
      • Includes Command Response Unit, Fan-out and fan-in of commanding to 16 TEMs, PDU, EPU’s, ACD
      • Includes Global Trigger Logic
      • Includes LAT Event-Builder Logic
      • Includes command/control/read-back for ACD sub-system
      • Includes power-control for ACD FREE Boards
gasu status and schedule
GASU Status and Schedule
  • Status
    • Design/documentation complete
    • Enclosures fabricated
    • All components/parts received
    • Assembly contract awarded
    • Parts being kitted
    • Flight assembly to start 3/10/05
  • Schedule for Flight Unit
    • 5/20/05 Precoat GASU assembly ready for electrical test
    • 6/10/05 Complete assembly ready for environmental test
    • 7/13/05 Flight GASU to I&T
siu epu
SIU/EPU
  • Spacecraft Interface Unit (SIU)
  • Event Processor Unit (EPU)
  • Difference is boot code loaded into RAD750 CPU

Enclosure

LCB

Backplane

SIB

Power-Supply

CPU

siu epu status and schedule
SIU/EPU Status and Schedule
  • Status
    • Design/documentation complete
    • Enclosures fabricated
    • All components/parts received except BAE RAD750 CPU
      • Uses recalled International Rectifier regulator
      • Boards to be sent back to BAE
      • Reworked boards expected 3 weeks after they receive components; June 05
    • Assembly contract out for RFP
  • Schedule
    • 6/1/05 Precoat cCPI boards ready for electrical test
    • 7/28/05 Complete assembly ready for environmental test
    • 8/19/05 First Flight SIU/EPU to I&T
    • 8/24/05 Second flight SIU/EPU to I&T
    • 8/27/05 Third flight SIU/EPU to I&T
    • 8/30/05 Fourth flight SIU/EPU to I&T
    • 9/2/05 Last flight SIU/EPU to I&T
testbed and i t support
Testbed and I&T Support
  • Testbed
    • Upgrade of engineering modules to reflect flight designs
    • Scheduled over next 6 months
    • Labor to support upgrade
    • Labor to support testing of electronics and flight software using data generated via front-end simulator boards
    • Labor to support test-stands for flight electronics qualification and acceptance testing
  • I&T Support
    • Design/fabrication/testing of virtual spacecraft simulator for I&T
    • Support for integration and testing of DAQ modules on instrument
management egse
Management & EGSE
  • Management
    • Sub-system manager
    • Technical writer
    • Support for environmental test
    • Travel
    • Computer for test-stations (HW & SW) maintenance
    • Shipping charges for flight hardware
  • EGSE (Electrical Ground Support Equipment)
    • Maintenance/repair of test-stations supplied to sub-systems
costs commits

Costs & Commits

Explanation:

Dataflow Electronics = TEM/TPS Flight Units

ACD GASU FU & GLT FU = GASU

Power Conditioning = PDU

SIU & LAT Communication Card = SIU