1 / 30

FE electronic box

FE electronic box. Construction of end piece OT module Electronic components Mechanics Cooling. End-piece Feed trough boards at dummy. End piece. The OT module exists out of two identical panels holding 64 straws.

page
Download Presentation

FE electronic box

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. FE electronic box • Construction of end piece OT module • Electronic components • Mechanics • Cooling

  2. End-piece Feed trough boards at dummy

  3. End piece • The OT module exists out of two identical panels holding 64 straws. • 2 Feed trough boards connecting HV and gnd over full width to outside world

  4. End-piece construction

  5. Feed-trough boards

  6. Electronic components • Overview of boards • Full or half module • Stacking of boards • HV and connector section

  7. Electronic components • Feed-trough board 2x • HV-board 4x • ASD-board 8x • OTIS-board 4x • GOL-board 1x

  8. Full or half module GOL/OTIS board design is made in such a manner that it can switch from left to right

  9. Stacking of boards • 2 planes of 64 channels • 32 channel HV-boards • Each HV-board connects 2 ASD-boards • 2 ASD-boards connect L or R OTIS • OTIS-board L and R version • GOL-board connects 4 OTIS-boards front and back plane

  10. HV connector-section • 4 HV-boards make an enclosure so HV is completely shielded from other electronic parts • HV space contains 4 boards carrying 32 cap each that are integrated in the board • HV-distribution inside • One side HV is coming in other side is low voltage and couples to ASD board trough frame plate.

  11. Disconnected FE-box • Fast replacement • FE-box is fully decoupled from chamber

  12. Connected FE-box • full HV-enclosure • Forces from gnd-spring are not on chamber • Gnd spring over full width • 128 gnd contacts on each side

  13. Spaces for gas-pipes OT-module has a free space on each side of 5 mm for gas pipes FE-box can easily be removed Gas-pipes

  14. FE box overview

  15. FE-box exploded view

  16. Frame 3D

  17. main mechanic parts A • One plate supports gol/aux boards • 2 equal support plates on both sides, supporting HV-boards, ASD boards and Otis board. • 2 extraction/insertion tools are implemented • Guiding tip guarantees proper mating with chamber connector B C D

  18. Box-enclosure

  19. Cooling • Location of dissipating areas • Heat transport trough the frame • Heat transport from chips to frame • measurements

  20. Dissipating areas

  21. Frame sideview

  22. ASDBLR COOLING CONSTRUCTION

  23. ASDBLR AS TEMPERATURE SENSOR ~750mV ~1.8mV/C We use a dummy input diode as temperature sensor (Not callibrated yet)

  24. NTC 5K on Copper Surface Close to ASDBLR Each board has a sensor Connection point

  25. OTIS NTC NTC UNDER OTISONOPOSITE SIDE

  26. PACKAGED FRONT END COOLING TEST The Front Ends of the Outer Tracker are closely packed, heat must be extracted with cooling water along the Aluminium cooling extension plate. For the test we use a cooling block with forced air Several sensors monitor heatup of components.

  27. RESULTS AFTER SETTLING H K NI EF 35 C Otis52 C ASDBLR NTC on copper 42C ASDBLRInput Diode43C Proto Outer Tracker Front-End Tests 27

  28. NTC GRAPH K ohm temp

  29. FIRST IMPRESSION FROM PAPER RECORDERS AFTER POWER SWITCH ON OTIS Copper NTC 52C 50 17C 45 RED ASDBLR NTC ON Copper Board SURFACE 42C ASDBLR 40 BLUE ASDBLR DIODE ~43C 8C BASEPLATE THERMOMETER 35C 35 COOLING BASE 30 REMARKS: 1.forced air cooling base with regulators, shifts 10C 2.ASDBLR steps up 5C in 2 minutes, then settles to 7C above plate 3. OTIS settles 17C above cooling flap part of baseplate 25 1 2 3 6 12 Hours t=0 >power on

  30. FIRST CONCLUSIONS The ASDBLR has low temperature rise thanks to strong thermal coupling trough PCB Delta T=7 degrees C The maximum delta T is 17 degrees C for the Otis chip The regulators are mounted directly on the cooling plate , no internal sensor available, but adequate cooling is ok.

More Related