1 / 31

Epitaxy: Application to Polarized Emitters

Epitaxy: Application to Polarized Emitters. Aaron Moy and Brian Hertog SVT Associates, Eden Prairie, Minnesota. Acknowledgements : US Dept. of Energy SBIR Phase I and II Grant contract #DE-FG02-01ER83332 in collaboration with SLAC Polarized Photocathode Research Collaboration (PPRC):

osma
Download Presentation

Epitaxy: Application to Polarized Emitters

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Epitaxy: Application to Polarized Emitters Aaron Moy and Brian Hertog SVT Associates, Eden Prairie, Minnesota Acknowledgements: US Dept. of Energy SBIR Phase I and II Grant contract #DE-FG02-01ER83332 in collaboration with SLAC Polarized Photocathode Research Collaboration (PPRC): A. Brachmann, J. Clendenin, E. Garwin, S. Harvey, R. Kirby, D.-A. Luh, T. Maruyama, R. Prepost, and C. Prescott

  2. Outline • Strained Layer Semiconductor for Polarized Electron Source • Epitaxial Crystal Growth • Methods of III-V Epitaxy • Metal organic chemical vapor deposition (MOCVD) • Molecular beam epitaxy (MBE) • Gas source molecular beam epitaxy (GSMBE) • Growth of Photocathodes Using GSMBE • Characterization of Material

  3. Polarized Electron Emitters • Emission of electrons with specific spin • Applications • High energy physics, colliders • Spintronics • Motivation • Efficiency ~ P2I, where P=polarization, I= current • Increased efficiency, less machine time cost

  4. Strained Layer Polarized Emitters • Photocathode emission • Circularly polarized light • Unstrained GaAs • 50% max polarization • Compressively strained GaAs • lattice constant < 5.65 Å • valence band splitting • 3/2 1/2 transition favored • 100% max polarization

  5. Creating Strained GaAs Layers • Heteroepitaxy • New layers will form based on previous lattice • Compressive strain • Growth on lattice with smaller lattice constant • Larger difference in lattice size increased strain force GaAs 5.65 Å GaAs0.64P0.36 5.58 Å Compressively strained GaAs on GaAs0.64P0.36 lattice constant 5.58 Å

  6. Epitaxy Growth of thin film crystalline material where crystallinity is preserved, “single crystal” Atomic Flux Bare (100) III-V surface, such as GaAs Deposition of crystal source material (e.g. Ga, As atoms)

  7. Epitaxy Result: Newly grown thin film, lattice structure maintained Starting surface

  8. Epitaxy • Advantages of epitaxy- • Improved crystallinity • Reduced defects • Higher purity • Precise control of thickness • Precise control alloy composition • “Lattice matched” compounds • Abrupt or graded interfaces • Ability to engineer unique device structures • Nanostructures • Superlattices • Strained layers

  9. III-V Compound Semiconductors III IV V VI VII VIII

  10. How Epitaxy Is Achieved • Two primary methods for thin film epitaxy- • Metal Organic Chemical Vapor Phase Deposition (MOCVD) (aka metal organic vapor phase epitaxy MOVPE) • Molecular Beam Epitaxy (MBE) • Differences in growth chemistry

  11. Metal Organic Chemical Vapor Phase Deposition • Growth in “reactor” • Pressure 10s-100s of torr • Metal organic group III source material • Trimethyl Gallium Ga(CH3)3 • Trimethyl Indium In(CH3)3 • MO vapor transported H2 carrier gas • Hydride group V source gas • Arsine AsH3 • Phosphine PH3 • Thermal cracking at growth surface

  12. MOCVD- Surface Chemistry Surface chemistry- Basic layout of an MOCVD reactor

  13. MOCVD- Gas Handling System

  14. MOCVD Summary • Growth rates 2-100 micron/hr • high throughput • P-type doping • Zn (Diethyl Zinc), high diffusivity • C (CCl4, CBr4), amphoteric • Complex growth kinetics • delicate interaction between injected gasses, temperatures • High background pressure • Parasitic incorporation • Intermixing of atoms at interfaces

  15. Molecular Beam Epitaxy (MBE) • Growth in high vacuum chamber • Ultimate vacuum < 10-10 torr • Pressure during growth < 10-6 torr • Elemental source material • High purity Ga, In, As (99.9999%) • Sources individually evaporated in high temperature cells • In situ monitoring, calibration • Probing of surface structure during growth • Real time feedback of growth rate

  16. Molecular Beam Epitaxy Growth Apparatus

  17. MBE- In Situ Surface Analysis • Reflection High Energy Electron Diffraction (RHEED) • High energy (5-10 keV) electron beam • Shallow angle of incidence • Beam reconstruction on phosphor screen RHEED image of GaAs (100) surface

  18. MBE- In Situ Growth Rate Feedback Monitoring RHEED image intensity versus time provides layer-by-layer growth rate feedback

  19. MBE- Summary • Ultra high vacuum, high purity layers • No chemical byproducts created at growth surface • High uniformity (< 1% deviation) • Growth rates 0.1-10 micron/hr • High control of composition • In situ monitoring and feedback • Mature production technology

  20. MBE- System Photo

  21. Gas Source MBE • Combines advantages of MBE with gas source delivery of group V atoms (as used in MOCVD) • PH3, AsH3 used for group V sources • Thermally cracked at injector into P2, As2 and H2 • P2, As2 dimers arrive at growth surface along with Ga, In • MBE surface kinetics maintained

  22. Gas Source MBE • Advantages of GSMBE • PH3 a more mature method for phosphorus MBE growth • Improved dynamic range of switching state • As, P molecules travel around shutter in solid source MBE • Control of P, As flux by adjustment of gas flow • Can replenish group V source material without breaking vacuum • Disadvantages • Requires gas handling system • Requires extra vacuum pumping to remove hydrogen • Arsine and Phosphine highly toxic

  23. Limits to Strained Layers: Critical Thickness • Strain forces increase with thickness • Strain reaches threshold, lattice relaxes • “Critical Thickness” • Layer thickness where relaxation occurs • Relaxed lattice- bulk crystal state • Thickness inversely proportional to strain (difference in lattice constant) • Misfit dislocations created • Scattering, absorption of photons • Non-uniformities GaAs on GaAsP Critical Thickness

  24. Photocathode Polarized Emitters • Device Considerations • Strained GaAs layer • Highly p-type doped • Thick to provide enough emission current • Structure Growth • Uniform • Excellent crystallinity • Substrate for epitaxy • High quality • Robust

  25. Strained Superlattice Photocathode • Strained GaAs on GaAsxP1-x • Multiple GaAs layers sandwiched by GaAsxP1-x • Each GaAs layer below critical thickness • Multiple GaAs layers to provide thick overall active volume for electron emission • Superlattice- repetition of thin layers • GSMBE for epitaxy • Thin layers (< 50 Å) • Utilizes phosphorus • Abrupt, uniform interfaces

  26. GaAsP 30 A Strained GaAs 30 A Active Region 1000 A GaAs0.64P0.36 Buffer GaAsP 2.5mm Strained GaAs GaAs(1-x)Px Graded Layer 2.5mm GaAsP Strained GaAs GaAs Substrate Strained Superlattice Photocathode x 16 pair

  27. Strained Superlattice Photocathode by GSMBE • Growth details • Substrate heated to 580 °C to remove surface oxide • GaAs buffer layer grown at 1 micron/hr using AsH3 flow 3 sccm • GaAs -> GaAsP graded layer grown • Step graded GaAsxP1-x using six distinct compositions • Maintained AsH3 + PH3 = 4.5 sccm gas flow rate • GaAsP layer grown at 480 °C • Superlattice layer grown at 480 °C

  28. Material Characterization- X-ray

  29. Material Characterization- Photoluminescence

  30. Material Characterization- Photoluminescence Half die, PL points for uniformity probe

  31. Conclusion • Strained layers for photocathode applications • Molecular beam epitaxy successful method for photocathode growth • MBE growth parameters and structure can be refined to improve polarization of devices

More Related