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This lab explores Hexagonal Closest Packing (HCP) and Cubic Closest Packing (CCP) arrangements. HCP involves a third layer directly over the first, repeating in an ABAB pattern, while CCP features distinct layers in an ABC pattern. We will examine intralayer voids, which are trigonal planar spaces between spheres, and interlayer voids that exist between layers. This study will also analyze the void-to-sphere ratio, specifically noting that there are six voids around each sphere and a ratio of 2:1. Participants will identify different types of voids and their coordination numbers.
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Closest-Packing GLY 4200 Lab 4 – Fall, 2014
Hexagonal Closest-Packing (HCP) • Third layer is directly over the first layer • Repeat is ABABAB…
Cubic Closest-Packing (CCP) • Third layer is distinct from the first two layers • Repeat is ABCABCABC….
Intralayer Voids • Space between the spheres, within the layer, is a trigonal planar void • A void is a space which may be occupied by a small ion, usually a cation
Void:Sphere Ratio • Ratio of voids/spheres • Around each sphere there are six voids • Around each void there are three spheres • The ratio of voids/spheres is therefore 2:1
Interlayer Voids • Both types of packing have empty places (voids) between layers • There are two types of voids • Each has a different CN
Assignment • Find out what types of voids are present • Find the ratio of voids/sphere for each type • Find the ratio of the voids to one another