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Meeting Microcool LHCb. Status update 28.03.2012 Tushant Singh. Wafer Status - Fabrication. *EDX = Energy-dispersive X-ray spectroscopy To be done at CSEM Neuchatel on 2 nd April. Sphagetti Problem – Recall. Oxide strip – wet etch (BHF). Wafer#3426.

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meeting microcool lhcb

Meeting MicrocoolLHCb

Status update 28.03.2012

Tushant Singh

wafer status fabrication
Wafer Status - Fabrication

*EDX = Energy-dispersive X-ray spectroscopy

To bedoneat CSEM Neuchatel on 2nd April

sphagetti problem recall
SphagettiProblem – Recall

Oxide strip – wet etch (BHF)

Wafer#3426

White colored ‘Sphagetti’

observed coming out of

the channels

sem pictures
SEM pictures

SEM pictures of structures weretaken and thisiswhat the side-walls of the channel look like.

sphagetti problem
Sphagetti Problem

Wafer with Sphagetti Problem #3694

Wafer without Sphagetti problem #3442

You canseedirtysidewalls and dirty surface in thispicture

sphagetti problem1
SphagettiProblem
  • Possible causes –
    • WE DONT UNDERSTAND, but the guessis:
      • Contamination in dry etch machine
      • Contamination in wetetch bath

For nowwe are not observinganysuchproblems

surface roughness problem
Surface RoughnessProblem
  • During SEM imagingfor lookingatSphagettiproblemitwasobservedthat the Wafer surface wasvery rough.
    • This could cause badbonding.
compare surface roughness top surface
Compare surface roughness (Top surface)

Wafer with Sphagetti problem #3694

Wafer without Sphagetti problem #3442

surface roughness problem1
Surface RoughnessProblem
  • Preliminary investigations show thatthisproblemisassociatedwith wafers thathad the Sphagettiproblem.
  • The wafer whichdid not have sphagettiproblemlooked OK in terms of Surface roughness.
  • Further investigation neededwith more wafers.
further activities
Furtheractivities
  • New batch of 3 wafers
  • Modifiedprocess flow
    • Slight modification in process flow has been proposed and isunder discussion with Alessandro.
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