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Microstrip to CPW transition. 2004-30338 윤정훈. Advantage of MS & CPW Low cost, compact size, and easy integration for devices demand Low-loss, wideband, and compact transition Two main techniques for the transition by electrical contact

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Microstrip to CPW transition


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    1. Microstrip to CPW transition 2004-30338 윤정훈

    2. Advantage of MS & CPW • Low cost, compact size, and easy integration for devices • demand • Low-loss, wideband, and compact transition • Two main techniques for the transition • by electrical contact • usually call for Via holes, bonding wires, or abrupt steps in the conductor • Compact size and wide bandwidth • Some degree of mechanical complexity • by electromagnetic coupling • No wired bonds or via holes • Narrow bandwidth and larger size Recently wider bandwidth transition

    3. Gold ribbon inductance capacitance Electrical Contact (1) • Case 1 : ribbon • Superposition of two different substrates • upper one works in a microstrip mode • lower one works in a coplanar mode • a small capacitance is added at the beginning of the coplanar line • lowpass filter • maximum cut-off frequency is related with the height h1

    4. Electrical Contact (2) • Case 2 : air bridge • Microstrip to CPW on GaAs chip substrate • Case 3 : via hole • Microstrip to CPW on opposite sides of a common substrate

    5. Electromagnetric Coupling(1) • Case 1 : uniplanar • this one uses the coupling between the ground plane of the microstrip and the ground planes of the coplanar line • Analyzed as a bandpass filter • cutoff frequency is determined by the length of the coupling region With radial coupling stub

    6. Electromagnetric Coupling(2) as n increases, S11 decreases Gradual transformation Return loss as the length of the transition increases, Bandwidth increases as well

    7. Wire bonding • can seriously degrade circuit operation • Is very labor intensive No wire bonding • Improve performance • Reduce cost gap Electromagnetric Coupling(3) • Case 2 : Surface to surface transition • CPW on one substrate surface to a MS on another • Types • Single-substrate transition • on opposite sides of a single substrate • gap size of roughly 10 % of the total length empirically give the best results • Chip to motherboard transition

    8. The chip and mother board ground planes coincide Ground plane of the chip is removed in the area over the coupling region Electromagnetric Coupling(4) • Chip to motherboard transition

    9. widening broadband transmission behavior • Single substrate transition

    10. A variety of transition structure As Sc is enlarged EM coupling becomes tight Rasining the equivalent series capacitivie coupling Constitute a Broad Passband with two minimum values (A)

    11. s Widening the width Futher expanding the transmission passband As Sc is enlarged, Lower end of a passband is moved to low frequency But higher end of a passband is unchanged (B)

    12. d • By the coupled-strip length As d is enlarged, the wide passband gradually moves down

    13. Two radial open stub Two short slot arms microstrip Electromagnetric Coupling(3) • Case 2 : radial stub • Radial shape of the open stub & shorted arm allow wider bandwidth operation • signal is effectively transferred through resonant coupling Stub reactance Mutual cancellation

    14. conclusion • 여러구조의 microstrip-to-CPW transition. • 각 transition의 다지인 패러미터. • 용도에 맞는 transition 구조의 선택 및 디자인에 도움.

    15. Reference [1] Lin, T.-H.; "Via-free broadband microstrip to CPW transition," Electronics Letters , Volume: 37 , Issue: 15 ,Pages:960 - 961, 19 Jul 2001 [2]Safwata, A.M.E.; Zaki, K.A.; Johnson, W.; Lee, C.H.;"Novel design for coplanar waveguide to microstrip transition," Microwave Symposium Digest, 2001 IEEE MTT-S International , Volume: 2 , 20-25, Pages:607 - 610 vol.2, May 2001 [3]Lei Zhu; Menzel, W.; "Broad-band microstrip-to-CPW transition via frequency-dependent electromagnetic coupling," Microwave Theory and Techniques, IEEE Transactions on , Volume: 52 , Issue: 5 , Pages:1517 – 1522, May 2004 [4] Houdart, M.; Aury, C.; "Various Excitation of Coplanar Waveguide," Microwave Symposium Digest, MTT-S International , Volume: 79 , Issue: 1 , Pages:116 - 118, Apr 1979 [5] Hang Jin; Vahldieck, R.; Jifu Huang; Russer, P.; "Rigorous analysis of mixed transmission line interconnects using the frequency-domain TLM method," Microwave Theory and Techniques, IEEE Transactions on , Volume: 41 , Issue: 12 , Pages:2248 - 2255, Dec. 1993 [6] Golja, B.; Sequeira, H.B.; Duncan, S.; Mendenilla, G.; Byer, N.E.; "A coplanar-to-microstrip transition for W-band circuit fabrication with 100-μm-thick GaAs wafers, " Microwave and Guided Wave Letters, IEEE [see also IEEE Microwave and Wireless Components Letters] , Volume: 3 , Issue: 2 , Pages:29 - 31, Feb. 1993 [7] Gauthier, G.P.; Katehi, L.P.; Rebeiz, G.M.; "W-Band finite ground coplanar waveguide (FGGPW) to microstrip line transition," Microwave Symposium Digest, 1998 IEEE MTT-S International , Volume: 1 , 7-12 , Pages:107 - 109 vol.1, June 1998

    16. [8] Guizhen Zheng; Papapolymerou, J.; Tentzeris, M.M.; "Wideband coplanar waveguide RF probe pad to microstrip transitions without via holes," Microwave and Wireless Components Letters, IEEE [see also IEEE Microwave and Guided Wave Letters] , Volume: 13 , Issue: 12 , Pages:544 - 546, Dec. 2003 [9] Chiu, T.;"A building-block design scheme for planar transmission-line transitions," Microwaves, Antennas and Propagation, IEE Proceedings - , Volume: 150 , Issue: 6 , Pages:405 - 410, Dec 2003 [10] Burke, J.J.; Jackson, R.W.; "Surface-to-surface transition via electromagnetic coupling of microstrip and coplanar waveguide," Microwave Theory and Techniques, IEEE Transactions on , Volume: 37 , Issue: 3 , Pages:519 - 525, March 1989