CMS Phase 2 Tracker R&D R. Lipton 3/ 27/2014. Module R&D Allocation: Requested ~ $320k, received ~160k Eliminate VICTR testing (continue with FNAL funds and whatever time is available) Eliminate engineering for contributions to the PS chip Eliminate interconnect R&D
Module R&D Allocation:
- I plan to send this back to Max next week
…Plus: Cannot get bumped MPAs from TSMC
Because of mixed wire/bump bond requirement
- Why not shift constraint to more flexible sensor producer ?
Extended Pixel Sensor
We had originally planned to collaborate with CERN on the TSV work based on the 3T chip. The vendor doubled his price and we had to drop out of that phase.
I hope to keep this work going in the US, funds are still allocated.
An obvious possibility is to demonstrate insertion of TSVs in the PSI46 chip – which can then be bonded to sensors and tested. This is synergistic with the TSV interests of the phase 2 pixels.
I have written to Jorgen Christianson, Roland Horisberger, Gino Bollaso far with no response…
Carbon fiber/carbon foam disk