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Development Progress of Pixel Sensors for High-Energy Physics Experiments

This document outlines the advancements in pixel sensor prototypes for high-energy physics applications, detailing submissions from various institutions such as ATLAS, CMS, and ALICE. Key prototypes, including moderated p-spray and p-stop designs from CiS, SINTEF, and CSEM, are highlighted. It discusses yield rates, irradiation tests, module designs, and prototype submissions. Future steps include additional prototypes and thorough testing procedures. The collaboration and insights from different organizations emphasize the commitment to advancing detector technology for particle physics research.

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Development Progress of Pixel Sensors for High-Energy Physics Experiments

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  1. Pixel Sensor Submission • ATLAS • Prototype 1: CiS, SII (p-stop+p-spray) • Prototype 2: CiS, IRST (moderated p-spray) • PreProduction: CiS, TESLA • CMS • 1st prototype: CSEM (p-stop) • USCMS: SINTEF (p-stop) • 2nd prototype: SINTEF (p-stop) • PSI: ? (moderated p-spray? + p-stop) • ALICE • 1st prototype: Canberra (p on n)

  2. BTeV Submission • 1st prototype • Joint submission with US-CMS (p-stop) • Bids received: SINTEF, CSEM,CiS, Eurysis • No bid: Hamamatsu • SINTEF and CSEM chosen • CSEM submission held up by CMS • SINTEF: 22 wafers in total (5 oxygenated, 3 high resistivity)

  3. SINTEF wafers summary • Single-chip yield excellent • Leakage current low, BD voltage meet or exceed spec (> 300V) • 5-chip module yield: (see figure) • After irradiation : Vd < Vbd up to 4x1014 p/cm2 (low resistivity wafers) • Normal wafers about the same characteristics as oxygenated wafers

  4. SINTEF five chip modules

  5. Next steps • Two more prototype submissions planned • Moderated p-spray (NDA with ATLAS, Licence Agreement with Garching Innovation GmbH) • P-stop (meet design rule of vendor, new chip size, new module size)

  6. Moderated p-spray • Received prototype 2 wafers and preprod. Wafers from ATLAS • Probing results (Rita’s presentation) • Irradiation test end of January • Detectors: mated to preFPIX2tb (bench test, irradiation test, beam test) • Try out the submission process ourselves • New chip size, new module size • RFP sent to: CiS, Eurysis, SINTEF, TESLA • Bids received from : CiS, SINTEF, and TESLA (see next slide) • Big difference in quote and details of the responses • After checking with Purchasing Dept, proposed to drop TESLA (quote unrealistic and not enough detail) • Still waiting to get more details from CiS (testing procedure, material spec) • SINTEF: details on testing of modules

  7. Preconceptual R&D: Draft Timeline

  8. Discussion • ATLAS wafers (probing results) • More questions to the vendors? • Status of the mask design • Remaining issues • Simulation • Submission schedule

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