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SOI MEMS Platform HTA General Assembly November 12 – 13, 2013. Contact: [email protected] Status Report. Platform / Roadmap / Flagship Title: SOI MEMS Platform. Short Description: Platform purpose To create flexibility in designing and manufacturing new components Definition

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SOI MEMS Platform

HTA General Assembly

November 12 – 13, 2013


Status report

Contact: [email protected]

Status Report

Platform / Roadmap / Flagship Title:

SOI MEMS Platform

Short Description:

Platform purpose

  • To create flexibility in designing and manufacturing new components

    Definition

  • Platform composes of process equipment, steps, modules and needed personnel of HTA partners (e.g. CSOI-AlN pMEMS platform of VTT)

    Activity in practice

  • Network of four platform managers having regular Telcos & meetings

  • Gateway to services and facilities of other partners (= matchmaker)

  • Standardized documents (RFQ-template, customer case database, equipment list)

  • Main challenge: (internal) marketing => project managers and planners


Status report1

Contact: [email protected]

Status Report

Platform / Roadmap / Flagship Title:

SOI MEMS Platform

Status & Partners (institutes, departments, contact):

CEA-Leti: [email protected]

CSEM: [email protected]

FhG: ENAS/IMS/IPMS/ISIT: [email protected]

VTT: [email protected]

Vision, Mission, Strategy:

Vision: Platform for research, prototyping and pilot production as well as production ramp-up services

Mission: Helping researcher to do their work, through networking, creating new projects and fostering innovations


Status report2

Contact: [email protected]

Status Report

Platform / Roadmap / Flagship Title:

SOI MEMS Platform

Recent Activities (white papers, joint projects, joint PR, …)

  • 5 inquiries handled in 2013 (3 closed without contracts, 2 still underway)

  • CSEM: Philippe Niedermann replaced by Arno Hoogerwerf

    Next steps:

  • Standard activities continue

  • Participation to trade show under HTA banner planned (experiences of Semicon 2012 utilized)


Soi mems platform success stories

Challenge:

IPDiAdevelops in collaboration with Leti a unique technology to integrate a wide range of capacitor values on silicon. A high K dielectric with coverage on high aspect ratio trenches is required. Leti does not have the technology.

Solution:

Fhg-CNT has the perfect solution

Added value of HTA:

Access to capabilities not available within a single partner

Project was not feasible otherwise.

SOI MEMS Platform: success stories

Development of high density capacitors

50µm


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