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New build-up technique with copper bump. AGP Process. AGP Build-up PCB. AGP Build-up PCB Section Figure. Multi-via Structures. Cross sectional view of AGP. To use copper bump as a connection between layers. Photo. 1+4+1 build-up PWB using AGP. Cross sectional view of AGP. Copper bump.

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agp build up pcb section figure

AGP Build-upPCB Section Figure

Multi-via Structures

slide4

Cross sectional view of AGP

To use copper bump as a connection

between layers

Photo. 1+4+1 build-up PWB using AGP

slide5

Cross sectional view of AGP

Copper bump

L1 alnd

L2 land

Photo. 2+2+2 build-up PWB using AGP

Photo. 3+4+3 build-up PWB using AGP

slide6

Concepts of developing AGP

1.Possible to reduce land size

2.Possible to stack vias

3. Possible to form bumps of different diameters in a

one-step batch process

4. Improvement of reliability of electrical connection

slide7

Benefits of AGP

  • 1. Possible to reduce diameter of via
  • AGP bump is formed by etching
  • method.
  • It is possible to form micro-bumps
  • with a diameter 50micron.

2. Possible to stack vias easily

AGP enables very flat land surface

without via-filling.

It is suitable process for multi-layer

build-up structure.

slide8

Benefits of AGP

3. High reliability of connecting

Land to via joining is achieved by

copper plating.

This enables high reliability of

electrical connection and high land-

pull strength.

4. Possible to form bumps of

different diameters

By selecting the size of the etching

mask, the bump of a different

diameter can exist together.

Larger bump can be used for the part

where high heat conductivity or low

electric resistance are necessary.

slide9

Benefits of AGP

5. Low surface roughness of outer copper

Outer layer is formed by panel-plating.

It has sufficient peel strength even if there is no anchor

effect.

This smooth side contributes to the high frequency

characteristic.

slide10

Structure that AGP enables

1. Multi build-up structure with stacking via

High density PWBs can be

achieved by AGP.

2. Flip chip pad with micro via connection

It is suitable for MCM.

slide11

Structure that AGP enables

Via and line can be connected directly

without forming land.

It will bring drastic higher wiring density.

3. Land-less pattern

3D view

Upper view

4. Rigidly improvement by copper frame

Because the bump layer is formed by the etching,

It is possible to process it to various shape.

That enables frame as illustrated, it brings rigidly

Improvement.

It is also as possible to build the coaxial cable

Structure into.

slide12

Structure that AGP enables

5. Heat management by forming thermal via

BGA/CSP

Forming chip size heat sink

By AGP process

Plugged via by using

Conductive paste

Improvement of heat dissipation effect

slide13

Schematic illustration of AGP process

Core board

Copper plated on core board

Forming bumps by etching

Forming dielectric layer(Liquid epoxy)

Copper plating as outer layer

slide20

Manufacturing Spec

Minimum land size of outer layer 100m

Minimum size of top of via 50m

Dielectric thickness of AGP layer

30~60m

Dielectric consists of epoxy resin

Not including glass-cross

Minimum size of bottom of via 75m

Minimum land size of inner layer 150 m