New build-up technique with copper bump. AGP Process. AGP Build-up PCB. AGP Build-up PCB Section Figure. Multi-via Structures. Cross sectional view of AGP. To use copper bump as a connection between layers. Photo. 1+4+1 build-up PWB using AGP. Cross sectional view of AGP. Copper bump.
To use copper bump as a connection
Photo. 1+4+1 build-up PWB using AGP
Photo. 2+2+2 build-up PWB using AGP
Photo. 3+4+3 build-up PWB using AGP
1.Possible to reduce land size
2.Possible to stack vias
3. Possible to form bumps of different diameters in a
one-step batch process
4. Improvement of reliability of electrical connection
2. Possible to stack vias easily
AGP enables very flat land surface
It is suitable process for multi-layer
3. High reliability of connecting
Land to via joining is achieved by
This enables high reliability of
electrical connection and high land-
4. Possible to form bumps of
By selecting the size of the etching
mask, the bump of a different
diameter can exist together.
Larger bump can be used for the part
where high heat conductivity or low
electric resistance are necessary.
5. Low surface roughness of outer copper
Outer layer is formed by panel-plating.
It has sufficient peel strength even if there is no anchor
This smooth side contributes to the high frequency
1. Multi build-up structure with stacking via
High density PWBs can be
achieved by AGP.
2. Flip chip pad with micro via connection
It is suitable for MCM.
Via and line can be connected directly
without forming land.
It will bring drastic higher wiring density.
3. Land-less pattern
4. Rigidly improvement by copper frame
Because the bump layer is formed by the etching,
It is possible to process it to various shape.
That enables frame as illustrated, it brings rigidly
It is also as possible to build the coaxial cable
5. Heat management by forming thermal via
Forming chip size heat sink
By AGP process
Plugged via by using
Improvement of heat dissipation effect
Copper plated on core board
Forming bumps by etching
Forming dielectric layer(Liquid epoxy)
Copper plating as outer layer
Minimum land size of outer layer 100m
Minimum size of top of via 50m
Dielectric thickness of AGP layer
Dielectric consists of epoxy resin
Not including glass-cross
Minimum size of bottom of via 75m
Minimum land size of inner layer 150 m