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3D Sensor Test Beams at FNAL: Qualification Batch for CMS Pixel Detectors

Explore 3D sensor performance with varied wafer thicknesses at FNAL. Assess low leakage current & high breakdown. Lots of wafers ready for use pending agreement with ATLAS for CMS sensors.

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3D Sensor Test Beams at FNAL: Qualification Batch for CMS Pixel Detectors

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  1. 3D sensor testbeams at FNAL M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira

  2. FBK ATLAS09 (QUALIFICATION BATCH) Different wafer thicknesses: 200-230-250 mm Slim edge (200 mm on two sides) Expected low leakage current and high breakdown. 1E 1E 1E 1E CMS pixel detectors Lots of wafers available, but … waiting for a general agreement with ATLAS about the use of CMS sensors

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