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1. Move remaining components into correct positions (18 components).

Detailed list of what what still needs to be done to board before it is sent out for fabrication. 1. Move remaining components into correct positions (18 components). 2. Hand Route 200 remaining connections (including diff pairs). 3. Route 5200 power connections - sort out split planes.

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1. Move remaining components into correct positions (18 components).

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  1. Detailed list of what what still needs to be done to board before it is sent out for fabrication 1. Move remaining components into correct positions (18 components). 2. Hand Route 200 remaining connections (including diff pairs). 3. Route 5200 power connections - sort out split planes. 4. Check and remove any offending DRC's. 5. Sort out Reference designators on top and bottom silks for 6500 components. 6. Ensure solder resist is okay for all components, copper areas etc. 7. Generate gerber data. 8. Generate Drill data and drawing. 9. Generate Assembly data (this can be done after boards have been sent out for M/fr). 10. Generate Ordering lists. 11. Design to be checked by D.O. member of staff following D.O.design rule check. 12. Design to be checked and approved in a design review before board goes out.

  2. SCSI cables - on hold, pending new length ? NIM-LVDS module - PCB assembled - awaiting quote QDR - MOQ 480, we require 22, extra cost £21k

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