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Pixel Bus Development. Who is working Over view of pixel bus Manufacture process Issues Development / Production Schedule. Atsushi Taketani RIKEN/RBRC. Who is working. RIKEN Design, Founding, and Coordination for PHENIX Soliton R&D Fine pitch PCB manufacture. Manufacturing Al bus

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pixel bus development

Pixel Bus Development

  • Who is working
  • Over view of pixel bus
  • Manufacture process
  • Issues
  • Development / Production Schedule

Atsushi Taketani

RIKEN/RBRC

who is working
Who is working
  • RIKEN
    • Design, Founding, and Coordination for PHENIX
  • Soliton R&D
    • Fine pitch PCB manufacture.
    • Manufacturing Al bus
  • Hiroshima Kokusai Gakuin University

Research Institute of Advanced Technology

    • Expert of Aluminum for condensed matter physics
  • KEK and their contractor
    • Parallel effort for R&D
alice pixel bus a milestone
ALICE Pixel BUS (a milestone)

ALICE Pixel BUS structure

Singal2

Singal3

5 to 7 mm Al

12 mm Polyimide

5 mm glue

5 to 7 mm Al

12 mm Polyimide

5 mm glue

Singal1

15 mm Al

5 mm glue

12 mm Polyimide

5 mm glue

50 mm Al

Signal 1;(Vertical line)line connected withpixel chip with wire bonding

5 mm glue

12 mm Polyimide

Signal 2;(Horizontal line)connected with vertical line with through hole

5 mm glue

50 mm Al

Signal 3;(for SMD)

Total radiation length = 0.173 % X0

5 mm glue

12 mm Polyimide

phenix option
PHENIX Option

Aggressive

Easy (relatively)

Option 2

Option 3

Option 1

Line spacing; 140 um pitch

Material Budget;

Cu; Total ~ 0.306 %

Al; Total ~ 0.128 %

Line spacing; 140 um pitch

Material Budget;

Cu; Total ~ 0.376 %

Al; Total ~ 0.139 %

Line spacing; 70 um pitch

Material Budget;

Cu; Total ~ 0.236 %

Al; Total ~ 0.117 %

Horizontal 2layer

Vertical 2layer

Horizontal 1 layer

Vertical 1layer

Fine pitch

Horizontal 2layer

Vertical 1ayer

Alignment, Through hole

manufacture process

Aluminum

Aluminum

Polyimide

Polyimide

Polyimide

Manufacture Process

4 Through hole

1 Glued

5 Alignment and Etching

2 Etching

3 Glued

6 Gold plating

list of issues
List of Issues
  • Pattern Etching

Aluminum fine pitch pattern

  • Through hole

Small (~100micron)

Filling conductive material

  • Al - Ni - Au plating

Making wire bonding pad

  • Alignment of multiple layer

Precise alignment

etching
Etching

Successfully for ALICE PIXEL bus pattern!!!

40 micron width, 120 micron pitch

etching 2
Etching (2)
  • Peal strength is OK by test.
  • 10micron Polyimide + 5micron/15micron Glue (polyimide) + 12 micron Al
  • Almost ready for production for ALICE BUS
  • Possible for 40micron space pattern
  • Possible to produce 5cm*60cm pattern
through hole bvh method
Through Hole (BVH method)

Tiring now and will have a result on next week

Aluminum

Laser

Polyimide

Aluminum

Chemical plating

or

Vacuum evaporation

al ni au plating
Al –Ni-Au plating
  • Al –Ni for hardening ground for wire bonding.

Succeeded, I got a sample, sorry for no picture.

  • Ni-Au

Trying now and will have a result on next week.

alignment for multilayer bus
Alignment for multilayer bus
  • By using alignment marks by machine
  • By using through halls by human

Developing adjustment machine by mid Sep.

Mask Pattern

Optics

Resist

Aluminum

On the movable table

Polyimide

schedule
Schedule
  • Etching Done
  • Through hall Done by 2nd week of June
  • Au plating Done by 2nd week of June
  • Alignment Machine will be ready at mid Sep.
  • Test production on Mid Oct for ALICE Bus
  • Preproduction for PHENIX on Mid Nov.
alternative
Alternative
  • KEK and their contractor

They will produce ALICE BUS on July.

But no Al-Ni-Au plating.

  • We are considering Cu version bus for PHENIX electrical test with readout chip and pilot module.